FR3051967B1 - METHOD OF MAKING REASONS - Google Patents

METHOD OF MAKING REASONS Download PDF

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Publication number
FR3051967B1
FR3051967B1 FR1654822A FR1654822A FR3051967B1 FR 3051967 B1 FR3051967 B1 FR 3051967B1 FR 1654822 A FR1654822 A FR 1654822A FR 1654822 A FR1654822 A FR 1654822A FR 3051967 B1 FR3051967 B1 FR 3051967B1
Authority
FR
France
Prior art keywords
reasons
making
making reasons
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1654822A
Other languages
French (fr)
Other versions
FR3051967A1 (en
Inventor
Nicolas Posseme
Stephan Landis
Lamia NOURI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1654822A priority Critical patent/FR3051967B1/en
Priority to EP17172346.3A priority patent/EP3249468B1/en
Priority to US15/606,626 priority patent/US10242870B2/en
Publication of FR3051967A1 publication Critical patent/FR3051967A1/en
Application granted granted Critical
Publication of FR3051967B1 publication Critical patent/FR3051967B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02304—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
FR1654822A 2016-05-27 2016-05-27 METHOD OF MAKING REASONS Expired - Fee Related FR3051967B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1654822A FR3051967B1 (en) 2016-05-27 2016-05-27 METHOD OF MAKING REASONS
EP17172346.3A EP3249468B1 (en) 2016-05-27 2017-05-23 Method for producing patterns
US15/606,626 US10242870B2 (en) 2016-05-27 2017-05-26 Method for producing patterns

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1654822 2016-05-27
FR1654822A FR3051967B1 (en) 2016-05-27 2016-05-27 METHOD OF MAKING REASONS

Publications (2)

Publication Number Publication Date
FR3051967A1 FR3051967A1 (en) 2017-12-01
FR3051967B1 true FR3051967B1 (en) 2018-05-11

Family

ID=56802616

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1654822A Expired - Fee Related FR3051967B1 (en) 2016-05-27 2016-05-27 METHOD OF MAKING REASONS

Country Status (3)

Country Link
US (1) US10242870B2 (en)
EP (1) EP3249468B1 (en)
FR (1) FR3051967B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6960351B2 (en) * 2018-02-19 2021-11-05 東京エレクトロン株式会社 Processing method
EP3556911A1 (en) 2018-04-19 2019-10-23 Comadur S.A. Method for structuring a decorative or technical pattern in an object made of an at least partially transparent amorphous, crystalline or semi-crystalline material
CN111825311A (en) * 2019-04-17 2020-10-27 中国兵器工业第五九研究所 Micro-nano hot-press molding process for optical glass array lens
CN113981400B (en) * 2021-09-10 2023-10-20 浙江上方电子装备有限公司 Electrochromic device capable of displaying pattern and coating method thereof
FR3127628A1 (en) * 2021-09-24 2023-03-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Process for manufacturing a mold for nano-imprint and associated mold

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19837395C2 (en) * 1998-08-18 2001-07-19 Infineon Technologies Ag Method for producing a semiconductor component containing a structured insulation layer
KR20120013747A (en) * 2010-08-06 2012-02-15 삼성전자주식회사 Method for manufacturing a strained semiconductor device
KR20130020221A (en) * 2011-08-19 2013-02-27 삼성전자주식회사 Semiconductor dievices and methods of manufacturing the same
FR3000600B1 (en) 2012-12-28 2018-04-20 Commissariat Energie Atomique MICROELECTRONIC METHOD FOR ETCHING A LAYER
FR3000601B1 (en) * 2012-12-28 2016-12-09 Commissariat Energie Atomique METHOD FOR FORMING SPACERS OF A GRID OF A TRANSISTOR
FR3028350B1 (en) 2014-11-10 2018-09-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives IMPROVED PATTERN REALIZATION METHOD IN THIN LAYER
US10276715B2 (en) * 2016-02-25 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Fin field effect transistor and method for fabricating the same

Also Published As

Publication number Publication date
EP3249468A1 (en) 2017-11-29
FR3051967A1 (en) 2017-12-01
US20170345655A1 (en) 2017-11-30
US10242870B2 (en) 2019-03-26
EP3249468B1 (en) 2018-12-26

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