FR3047141B1 - ELECTRONIC COMPACT POWER MODULE - Google Patents

ELECTRONIC COMPACT POWER MODULE Download PDF

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Publication number
FR3047141B1
FR3047141B1 FR1650576A FR1650576A FR3047141B1 FR 3047141 B1 FR3047141 B1 FR 3047141B1 FR 1650576 A FR1650576 A FR 1650576A FR 1650576 A FR1650576 A FR 1650576A FR 3047141 B1 FR3047141 B1 FR 3047141B1
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FR
France
Prior art keywords
power module
compact power
electronic compact
electronic
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1650576A
Other languages
French (fr)
Other versions
FR3047141A1 (en
Inventor
Bernardo Cogo
Martin Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut De Recherche Tech Aeronautique Espace Systemes Embarques
Original Assignee
Institut De Recherche Tech Aeronautique Espace Systemes Embarques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut De Recherche Tech Aeronautique Espace Systemes Embarques filed Critical Institut De Recherche Tech Aeronautique Espace Systemes Embarques
Priority to FR1650576A priority Critical patent/FR3047141B1/en
Publication of FR3047141A1 publication Critical patent/FR3047141A1/en
Application granted granted Critical
Publication of FR3047141B1 publication Critical patent/FR3047141B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1650576A 2016-01-25 2016-01-25 ELECTRONIC COMPACT POWER MODULE Active FR3047141B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1650576A FR3047141B1 (en) 2016-01-25 2016-01-25 ELECTRONIC COMPACT POWER MODULE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1650576A FR3047141B1 (en) 2016-01-25 2016-01-25 ELECTRONIC COMPACT POWER MODULE
FR1650576 2016-01-25

Publications (2)

Publication Number Publication Date
FR3047141A1 FR3047141A1 (en) 2017-07-28
FR3047141B1 true FR3047141B1 (en) 2018-02-02

Family

ID=56322016

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1650576A Active FR3047141B1 (en) 2016-01-25 2016-01-25 ELECTRONIC COMPACT POWER MODULE

Country Status (1)

Country Link
FR (1) FR3047141B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9818733B2 (en) * 2011-06-27 2017-11-14 Massachusetts Institute Of Technology Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters
JP6406815B2 (en) * 2013-11-29 2018-10-17 株式会社東芝 Semiconductor device

Also Published As

Publication number Publication date
FR3047141A1 (en) 2017-07-28

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