FR3039564B1 - SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL - Google Patents

SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL

Info

Publication number
FR3039564B1
FR3039564B1 FR1557371A FR1557371A FR3039564B1 FR 3039564 B1 FR3039564 B1 FR 3039564B1 FR 1557371 A FR1557371 A FR 1557371A FR 1557371 A FR1557371 A FR 1557371A FR 3039564 B1 FR3039564 B1 FR 3039564B1
Authority
FR
France
Prior art keywords
electrochemical
processed
chemical
substrate
support device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1557371A
Other languages
French (fr)
Other versions
FR3039564A1 (en
Inventor
Laurent Ventura
Sebastien Desplobain
Gael Gautier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silimixt
Universite de Tours
Original Assignee
Silimixt
Universite Francois Rabelais de Tours
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silimixt, Universite Francois Rabelais de Tours filed Critical Silimixt
Priority to FR1557371A priority Critical patent/FR3039564B1/en
Publication of FR3039564A1 publication Critical patent/FR3039564A1/en
Application granted granted Critical
Publication of FR3039564B1 publication Critical patent/FR3039564B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR1557371A 2015-07-31 2015-07-31 SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL Active FR3039564B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1557371A FR3039564B1 (en) 2015-07-31 2015-07-31 SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1557371A FR3039564B1 (en) 2015-07-31 2015-07-31 SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL

Publications (2)

Publication Number Publication Date
FR3039564A1 FR3039564A1 (en) 2017-02-03
FR3039564B1 true FR3039564B1 (en) 2017-08-25

Family

ID=54186187

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1557371A Active FR3039564B1 (en) 2015-07-31 2015-07-31 SUPPORT DEVICE FOR SUBSTRATE TO BE PROCESSED IN PARTICULAR BY CHEMICAL OR ELECTROCHEMICAL

Country Status (1)

Country Link
FR (1) FR3039564B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019066566A1 (en) * 2017-09-28 2019-04-04 주식회사 어썸리드 Electrode frame for electropolishing, variable electrode frame for electropolishing and electropolishing apparatus comprising same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2315028A1 (en) * 1975-06-17 1977-01-14 Quadrimetal Offset Jig for holding metal lithographic plates during electrotyping - using inflatable tubes to clamp the plates
US5458755A (en) * 1992-11-09 1995-10-17 Canon Kabushiki Kaisha Anodization apparatus with supporting device for substrate to be treated
US7230681B2 (en) * 2004-11-18 2007-06-12 International Business Machines Corporation Method and apparatus for immersion lithography

Also Published As

Publication number Publication date
FR3039564A1 (en) 2017-02-03

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