FR3025899A1 - DEVICE FOR CONTROLLING THE TEMPERATURE OF A CONTROL MODULE OF AN ELECTRONIC COMPONENT - Google Patents

Abstract

The invention relates to a device (20) for regulating the temperature of a control module of at least one electronic component (10) intended to be disposed inside an aging oven of said electronic component (10). . The device (20) is advantageously configured to regulate the temperature of the control module so as to allow its operation inside the oven in operation while avoiding premature aging.

Description

TECHNICAL FIELD AND OBJECT OF THE INVENTION The present invention relates to the field of testing on electronic components and more particularly relates to a method and a control device the temperature of a control module of an electronic component. More particularly, the invention makes it possible to operate a control module of an electronic component in an aging oven of said component or in a vacuum chamber. STATE OF THE ART In the field of electronics, the failure rate of an electronic component over time is represented in a known manner by a U-shaped curve or "bathtub curve" ("bathtub curve" in English). . In known manner, it is thus observed that the failure rate of a component is high early in the life of the component and in this case the failures are called "youth" and low in the middle of life of the component and again high in the end of life of the component and in the latter case, failures are called "old age". It is thus known to proceed with accelerated aging of an electronic component as part of its development or prior to its commercialization. The aging of an electronic component as part of its development makes it possible to characterize it quickly in life-time ("life test" in English). The aging of an electronic component prior to its marketing makes it possible to place on the market a pre-aged component that has passed the youth breakdown interval, this operation being commonly called "burn-in" or "burn-in" or "burn-in". break-in ". A known aging process consists of placing the electronic component in an environment heated to a high temperature, for example at 125 ° C., or cooled to a negative temperature, for example -40 ° C., and to operate it for a period of 3025899. 2 predetermined aging. Known correlation tables then make it possible to relate the temperature to an aging parameter of the component so as to characterize its lifetime or its behavior.

The most common aging solution is to use an oven in which a large number of electronic components can be heated (or cooled) simultaneously. The electronic components are placed on a plurality of electronic boards, in the form of trays at different heights in the oven, and are operated. To this end, the electronic components 10 are connected to an electrical power supply module and to a control module common to all the components. The driver module ("driver") sends signals to the electronic component in order to operate it in a nominal manner for the duration of the oven aging. By the terms "nominal" or "nominal" is meant in this document that the capabilities and performance of the electronic component can be tested from signals necessary for the standard operation of the component, ie according to a use of the component according to its form technical.

In order to be able to function correctly and not to undergo aging, the control module is placed outside the oven and is found at a relatively large distance from the component, for example 20 cm. Such a distance causes a degradation of the signals generated by the control module, in particular high-frequency signals, for example with a frequency greater than 20 MHz, which prevents the electronic component from operating in a nominal manner and therefore has a significant disadvantage. Furthermore, it is also known to use a control module for testing an electronic component subjected to irradiation in a vacuum chamber placed in a particle accelerator. In this case, the control module heats due to the absence of convection in the vacuum, which can cause its dysfunction and therefore has a significant disadvantage.

The invention therefore aims to solve this drawback by proposing a simple, reliable and effective solution to allow a control module to operate an electronic component in a nominal manner in an aging oven or in a vacuum chamber.

GENERAL PRESENTATION OF THE INVENTION To this end, the subject of the invention is a device for regulating the temperature of a control module of at least one electronic component intended to be placed inside an oven. aging said electronic component or inside a vacuum chamber, said control module being configured to generate electrical signals allowing the nominal operation of the electronic component, said device being configured to regulate the temperature of the control module so as to to allow its operation inside said oven in operation while avoiding premature aging or respectively its operation in said vacuum chamber with a minimum of heating or without heating. By the words "allow the operation of the control module", it is meant that the control module is functioning properly and generates electrical signals adapted to test the nominal operation of the electronic component. The device according to the invention thus makes it possible to maintain the temperature inside the housing below or above a threshold value allowing operation of the control module in a suitable temperature range, for example respectively in each case. below 75 ° C when the oven is operating at a high temperature (eg more than 100 ° C) or above 0 ° when the oven is operating at a negative temperature. The control module can thus be placed in the oven near the electronic component so as to operate at a controlled temperature ensuring that the electrical signals received by the electronic component, in particular the high-frequency signals, are both suitable and sufficiently weakened by the distance to operate the electronic component in a nominal way. Similarly, in the case of a vacuum chamber, it is necessary to place the control module near the electronic component or the temperature of the control module rises significantly in the vacuum chamber because there is has no convection in the void.

Such a vacuum chamber can, for example, be used in the case of irradiation tests in a particle accelerator. The device according to the invention thus makes it possible to reduce the temperature of the control module to allow it to function properly in a vacuum chamber.

In one embodiment of the device according to the invention, the device comprises: - an outer casing, - an inner casing defining a housing for receiving the control module and extending inside said outer casing so as to form a thermal insulation space 10 between said inner housing and the outer housing, and - a circulation circuit of a temperature control fluid arranged inside the outer housing so as to regulate the temperature of the control module. By the words "inside the outer casing" is meant that the circuit is provided both in the inner casing and in the thermal insulation space between said inner casing and the outer casing. In a preferred embodiment of the device according to the invention, the circulation circuit of a temperature control fluid is arranged only inside the inner housing. In this case, the circuit does not travel through the thermal insulation space. Preferably, the circulation circuit comprises input means of the temperature control fluid in the outer housing and output means of the temperature control fluid of the outer housing. According to one aspect of the invention, the input means and the output means are configured to be connected, respectively via an inlet pipe and an outlet pipe, to means for generating a fluid circulation flow. such as, for example, a pump or a thermal fluid conditioner, especially for cooling said fluid. Preferably, the input means comprise at least one tube and / or at least one inlet nozzle of the temperature control fluid in the outer casing.

More preferably, the output means comprise at least one tube and / or at least one outlet nozzle of the temperature control fluid in the outer casing. The temperature control fluid may be a gas, such as, for example, air or a refrigerant gas, or a liquid, such as, for example, water or a coolant or any coolant. In one embodiment of the device according to the invention, the temperature control fluid is under pressure, for example greater than 3 bars.

To this end, the device may advantageously comprise an expander, for example in the form of a screw, arranged to modify the pressure of the fluid in the circulation circuit or the distribution of the fluid between several housings connected on the same pipe. input. Thus, in the case of cooling, proper adjustment of the expander allows the cold produced by the expansion in the housing to be used to improve the temperature control. The thermal insulation space between the outer casing and the inner casing may be filled with a thermal insulation fluid or with a high performance thermal insulating material such as, for example, an airgel or an elastomer, especially ethylene-propylene-diene monomer type (EPDM). Advantageously, the thermal insulation fluid comes from the temperature control fluid. In this case, the circulation circuit comprises at least in part the thermal insulation space. In one embodiment of the device according to the invention, the device comprises a heat exchanger, for example of Peltier type known to those skilled in the art, arranged in the circulation circuit.

The invention also relates to a system for aging at least one electronic component, said system comprising: - at least one oven inside which is disposed at least one electronic component and at least one temperature control device, as previously presented 3025899 6, coupled to said electronic component and in which is mounted a control module of said electronic component, said control module being electrically connected to the electronic component and being configured to generate electrical signals allowing the operation of the electronic component so 5 in the oven in operation, - means for generating a circulation flow of a temperature control fluid fluidically connected to the temperature control device so as to generate a circulation of a temperature control fluid inside said device.

Preferably, the generating means comprise a pump and / or a cooling or fluid conditioning module such as, for example, air. According to a feature of the invention, the system comprises a set of pipes or tubes for fluidly connecting the generating means to the temperature control device. The invention also relates to a method of aging at least one electronic component in an oven, said electronic component being connected to a module 20 for controlling said electronic component, said method being remarkable in that, the control module being placed in the oven in operation, it comprises a step of controlling the temperature of the control module so as to allow its operation inside the oven while avoiding premature aging.

Finally, the invention also relates to a system for using at least one electronic component in a vacuum, said system comprising: at least one vacuum chamber inside which at least one electronic component is arranged and at least one a temperature control device, as presented above, coupled to said electronic component and in which is mounted a control module of said electronic component, said control module being electrically connected to the electronic component and being configured to generate electrical signals allowing the operation of the electronic component nominally in the vacuum chamber; means for generating a circulation flow of a temperature control fluid fluidically connected to the temperature control device so as to generate a circulation of a temperature control fluid inside said dis positive.

Preferably, the generating means comprise a pump and / or a cooling or fluid conditioning module such as, for example, air. According to one characteristic of the invention, the system comprises a set of pipes or tubes for fluidly connecting the generating means to the temperature control device. The invention also relates to a method of using an electronic component in a vacuum, said electronic component being connected to a control module of said electronic component, said method being remarkable in that, the control module being placed in a vacuum chamber, it comprises a step of controlling the temperature of the control module so as to allow its operation inside the vacuum chamber, for example during irradiation in a particle accelerator.

Other features and advantages of the invention will become apparent from the following description given with reference to the appended figures given by way of non-limiting examples and in which identical references are given to similar objects.

DESCRIPTION OF THE FIGURES FIG. 1 is a perspective view of an embodiment of the system according to the invention.

FIG. 2 represents a perspective view of a tray intended to be placed in the oven of the system of FIG. 1.

FIG. 3 represents a partial perspective and partly exploded view of the plate of FIG. 2. FIG. 4 represents a perspective view of a temperature control device according to the invention. FIG. 5 represents a partial perspective and exploded view of the device of FIG. 4.

Fig. 6 is a bottom perspective view of a portion of the inner housing of the device of Fig. 5. Fig. 7 shows a cross-sectional view of a first embodiment of the device according to the invention.

Figure 8 shows a cross-sectional view of a second embodiment of the device according to the invention. Figure 9 shows a cross-sectional view of a third embodiment of the device according to the invention. DETAILED DESCRIPTION OF THE INVENTION Description of an Embodiment of the System According to the Invention The system according to the invention makes it possible to age a plurality of electronic components. This aging can be carried out by heating, for example above 100 ° C., or by cooling, for example at a negative temperature. The heating makes it possible in particular to use the electronic component rapidly while the cooling makes it possible more particularly to cause cracks on the electronic component.

FIG. 1 shows an embodiment of the system according to the invention. System 1 The system 1 comprises an aging oven 2, means for generating a fluid circulation flow and means for connecting the oven to the means for generating a fluid circulation flow. In this example, with reference to FIGS. 1 to 3, the means for generating a fluid circulation flow are in the form of a pump 3 and the connection means are in the form of a set of 4A fluid inlet pipes, preferably protected from the temperature in the oven by a thermal insulation, and fluid outlet pipes 4B for conveying the fluid respectively from the pump 3 to the devices according to the invention. In the interests of clarity, it should be noted that only the fluid inlet pipes 4A have been shown in FIG. 2. It will also be noted that the outlet pipes are optional, the control fluid having passed through the device then being expelled by the flow of circulation to the inside of the oven.

Oven 2 In this example, the oven 2 is in the form of a cabinet of substantially parallelepipedal shape comprising, on its front face FA (with reference to FIG. 1), a door 5, control means 6 of FIG. oven and a display 7 for displaying the temperature of the interior INT of the oven. Two trays 8 are arranged inside INT of the oven 2 at different heights. Of course, in another embodiment of the system according to the invention, the number of trays 8 could be less than or greater than two.

Still with reference to Figures 1 to 3, each plate 8 comprises a plurality of supports 9 of an electronic component 10 and as many female connectors 11 on each of which is mounted a temperature control device 20 according to the invention.

Each plate 8 is an electronic card comprising a plurality of electrical circuits or tracks (not shown), each electrical circuit making it possible to electrically connect a component support 10 to the associated female connector 11 in order to allow the transmission of electrical signals, generated by the control module 30 (with reference to FIG. 5), from the device 20 to the component 10 via the female connector 11 and the support 9. By way of example, the electronic components 10 to be aged can be microprocessors , memories, analog-digital converters (DAC or ADC), serializer-deserializers, FPGA etc ... In addition, it should be noted that the system according to the invention could comprise more than one oven and / or more a pump and / or more than one electronic component and a single temperature control device. Similarly, the same control module could control a plurality of electronic components. In addition, for the sake of clarity, each medium comprises a single electronic component. However, it goes without saying that the support could comprise a plurality of electronic components.

Device 20 according to the invention The device 20 according to the invention allows the regulation of the temperature of a control module 30 (with reference to FIG. 5) of an electronic component 10 placed in the aging oven 2.

To this end, in the embodiment illustrated in FIGS. 4 and 5, the device 20 comprises an outer casing 21, made for example of a plastic material adapted to the operating temperatures of the oven, inside which extends an inner housing 22, preferably made of the same material as the outer housing 21.

As illustrated in FIG. 5, the outer casing 21 and the inner casing 22 each have a substantially parallelepipedal shape, the dimensions of the inner casing 22 being smaller than the dimensions of the outer casing 21.

A control module 30 is mounted inside this inner housing 22. In this example, the control module 30 is in the form of an electric circuit 32 on which a plurality of electrical components 34 are welded. This control module 30 is advantageously configured to deliver electrical signals making it possible to operate a plurality of electronic components of a different type, for example by simple reprogramming. This driver module 30 or "driver" in English language is known to those skilled in the art, it will not be detailed further here. This control module 30 makes it possible to send electrical signals to the associated electronic component 10 in order to operate it in a nominal manner during aging in an oven 2. The nominal operation of the electronic component 10 makes it possible, in particular, to test its capabilities, its functionalities, its functions. performances (especially in frequencies), its memory if necessary etc ...

For this purpose, as previously explained, the control module 30 is electrically connected to the associated electronic component 10 via a female connector 11 on which the device 20 is mounted, the support 9 of the electronic component 10 and the tray 8 on which the female connector 11 and the support 9 are mounted.

In order to connect the control module 30 to the female connector 11, the device 20 comprises a complementary male connector 24. The control module 30 is electrically connected to said male connector 24 when it is placed in the inner housing 22 so as to be able to transmit electrical signals. According to the invention, in order to allow the operation of the control module 30 in the oven 2 near the electronic component 10 and to prevent aging, the device 20 comprises a circuit arranged to allow the circulation of a fluid F control of the temperature of the control module 30 inside the outer casing 21. More precisely, when the thermal insulation space between the inner casing and the outer casing is filled by an insulator different from the control fluid F thermal (for example EPDM or airgel), the circuit is arranged to allow the circulation of the temperature control fluid F 30 of the control module 30 inside the inner housing 22. This F regulation fluid is fed from the pump 3 by a fluid inlet pipe 4A 4 connected to the circulation circuit by a fluid inlet tube 26A. In order to evacuate the fluid F, the device 20 comprises, at the outlet of the circulation circuit, an outlet tube 26B of the fluid F. In this example, the inlet tube 26A and the fluid outlet tube 26B come from 10 material However, this is in no way limiting the scope of the present invention insofar as the inlet tube 26A and the outlet tube 26B could be derived from material of the outer case 21 or from material both the outer housing 21 and the inner housing 22 or else reported on the outer housing 21 and / or on the inner housing 22.

Referring to FIG. 5, a pressure reducer in the form of a screw 27, for example made of a plastic material, is mounted on the fluid inlet tube 26A so as to adjust the inlet pressure of the F fluid in the inner housing 22, thus advantageously improving the efficiency of the temperature control of the control module 30. With reference to Figures 5 and 6, the inner housing 22 comprises in this example a chute 22A allowing to diffuse the fluid flow F substantially over the entire length of said inner housing 22 so as to improve the flow of the fluid F.

As illustrated in FIGS. 7 to 9, the outer housing 21 and the inner housing 22 are arranged to form an ESP thermal insulation space. In another embodiment of the device according to the invention (not shown), the outer housing 21, the inner housing 22 and the ESP thermal insulation space can be replaced by a single insulating hard material, for example of the type cellular ceramic inside which would be placed the control module and in which would be arranged the fluid circulation circuit.

Vacuum chamber A particular application of the device according to the invention relates to its use in a vacuum chamber (not shown) and not in an oven. For example, such a chamber can be used for radiation testing in a particle accelerator. In this case, the outer housing 21 is sealed, for example with the use of a seal type silicone seal. The outer housing 21 is then configured to withstand the pressure difference between the interior and exterior of the chamber. To this end, the outer housing 21 may comprise reinforcing means or have walls of a large thickness, for example greater than 3 mm. As part of this application, the outer housing 21 is then preferably made of a vacuum-free degassing material, in a manner known to those skilled in the art.

In addition, the vacuum chamber is equipped with two openings, called "traverses" by those skilled in the art, allowing the passage of the inlet and outlet pipes of the control fluid, without necessarily that these pipes are made in one. thermally insulating material.

The invention will now be described in its implementation in the context of its application to an aging oven of electronic components. Implementation of the invention With reference to FIGS. 1 to 3, each electronic component 10 is mounted on a support 9 and a device 20 according to the invention is mounted on the corresponding female connector 11 via the male connector 24. The fluid inlet pipe 4A and the fluid outlet pipe 4B are then connected to the device 20 via respectively the inlet pipe 26A and the outlet pipe 26B. In this example, the temperature control fluid is air. The control modules 30 of the devices 20, the oven 2 and the pump 3 are then put into operation. Note that the control modules 30 can be operated manually before closing the door 5 of the oven 2 or remotely, via a control cable (not shown) once the door 5 closed. The pump 3, optionally coupled to an air conditioning module (not shown) makes it possible to create a continuous flow of air F (possibly conditioned) inside each device 20 so as to regulate the temperature of each of the control modules 30 so that they function properly at a controlled temperature.

In a first embodiment of the device according to the invention illustrated in FIG. 7, the ESP thermal insulation space is filled with a highly insulating material, for example of the airgel or EPDM type, in order to improve the regulation. of the temperature of the control module 30. The fluid flow F flows through a circulation circuit arranged inside the inner housing 22, from the inlet tube 26A, then around the control module 30 before to be ejected by the outlet tube 26B. In a second embodiment of the device according to the invention illustrated in FIG. 8, the circulation circuit comprises the ESP thermal insulation space which is therefore filled with the temperature control fluid F coming from the pump 3. The flow fluid F circulates through a circulation circuit, from the inlet tube 26A, then around the control module 30, then into the ESP thermal insulation space before being ejected by the outlet tube 26B. In a third embodiment of the device according to the invention illustrated in FIG. 9, the ESP thermal insulation space is filled with an insulating material, for example of the airgel or EPDM type, in order to improve the regulation of the temperature of the control module 30. The fluid flow F flows through a circulation circuit arranged inside the inner housing 22, from the inlet tube 26A, then through a heat exchanger 28 before being ejected through the outlet tube 26B. The heat exchanger 28 may be of the Peltier type known to those skilled in the art. For this purpose, the heat exchanger 28 comprises a heat exchange element 28A, for example of the metal cooler type and a Peltier element 28B, mounted between said heat exchange element and the control module 30, at the right of the control module 30 so as to regulate the temperature.

The method according to the invention therefore advantageously makes it possible to operate a control module in an oven in operation in order to allow the proper functioning of electronic components subjected to an aging process.

Finally, it should be noted that the present invention is not limited to the examples described above and is capable of numerous variants accessible to those skilled in the art. In particular, the number, shape and dimensions of the oven 2, the pump 3 and the device 20, as shown in the figures so as to illustrate an embodiment of the invention, can not be interpreted as limiting.

Claims (10)

REVENDICATIONS1. Device (20) for regulating the temperature of a control module (30) of at least one electronic component (10) intended to be disposed inside (INT) of an aging oven (2) for said component electronics (10) or a vacuum chamber, said control module (30) being configured to generate electrical signals for nominal operation of the electronic component (10), said device (20) being configured to regulate the temperature of the module control (30) so as to allow its operation inside (INT) of said oven in operation while avoiding its premature aging or respectively its operation inside said vacuum chamber. 2. Device according to claim 1, said device comprising: - an outer casing (21), - an inner casing (22) defining a housing for receiving the control module (30) and extending inside said outer casing (21) so as to form a thermal insulation space (ESP) between said inner housing (22) and the outer housing (21), and - a circulation circuit of a temperature control fluid (F) arranged at the inside of the outer casing (21) so as to regulate the temperature of the control module (30). 3. Device according to the preceding claim, wherein the circulation circuit comprises input means (26A) of the temperature control fluid (F) in the outer housing (21) and fluid outlet means (26B) ( F) temperature control of the outer casing (21). 4. Device according to one of the preceding claims 2 and 3, said device comprising an expander (27) arranged to change the fluid pressure (F) in the circulation circuit. 5. Device according to one of the preceding claims 2 to 4, wherein the thermal insulation space (ESP) between the outer housing (21) and the inner housing (22) is filled with a thermal insulation fluid or else a thermal insulation material such as, for example, an airgel or an elastomer, in particular of ethylene-propylene-diene monomer (EPDM) type. 6. Device according to the preceding claim, wherein the thermal insulation fluid 5 comes from the fluid (F) temperature control. In this case, the circulation circuit comprises at least in part the thermal insulation space. 7. Device according to one of the preceding claims 2 to 6, said device comprising a heat exchanger (28), for example of the Peltier type, disposed in the circulation circuit. 8. System (1) for aging of at least one electronic component (10), said system (1) comprising: - at least one oven (2) inside which is disposed at least one electronic component (10) ) and at least one temperature control device (20) according to one of the preceding claims, coupled to said electronic component (10) and in which a control module (30) of said electronic component (10) is mounted, said module control unit (30) being electrically connected to the electronic component (10) and being configured to generate electrical signals permitting operation of the electronic component (10) in a nominal manner in the oven (2) in operation, - generating means a circulation flow of a temperature control fluid (F) fluidly connected to the temperature control device (20) so as to generate a circulation of a temperature control fluid (F) e within said device (20). 25 9. System according to the preceding claim, wherein the generating means comprises a pump (3). 10. A method of aging an electronic component (10) in an oven (2), said electronic component (10) being connected to a control module (30) of said electronic component (10), said method being characterized in that that, the control module (30) being placed in the oven (2) in operation, it comprises a step of controlling the temperature of the control module (30) so as to allow its operation inside (INT) of the oven (2) while avoiding aging.35