FR3006546B1 - WHITE LIGHT EMITTING DIODE MODULE - Google Patents
WHITE LIGHT EMITTING DIODE MODULE Download PDFInfo
- Publication number
- FR3006546B1 FR3006546B1 FR1354826A FR1354826A FR3006546B1 FR 3006546 B1 FR3006546 B1 FR 3006546B1 FR 1354826 A FR1354826 A FR 1354826A FR 1354826 A FR1354826 A FR 1354826A FR 3006546 B1 FR3006546 B1 FR 3006546B1
- Authority
- FR
- France
- Prior art keywords
- emitting diode
- light
- white light
- light emitting
- diode module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000001429 visible spectrum Methods 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 1
- -1 phosphorus Chemical compound 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Module (1) de diode électroluminescente à lumière blanche, du type comprenant : - au moins une diode électroluminescente, recouverte d'une substance fluorescente telle que du phosphore, et, - une résine d'encapsulage (3) transparente au moins aux longueurs d'onde correspondant au spectre visible, résistante aux UV et recouvrant ladite diode électroluminescente (2) pour réaliser l'étanchéité de la Led. Selon l'invention, le module comprend une couche écran (5), transparente au moins aux longueurs d'onde correspondant au spectre visible, disposée entre la diode électroluminescente (2) et la résine d'encapsulage (3), ladite couche écran (5) n'étant pas en contact direct avec la substance fluorescente.White light emitting diode module (1), of the type comprising: - at least one light-emitting diode, coated with a phosphor such as phosphorus, and - an encapsulating resin (3) transparent at least to the lengths of the light-emitting diode. wave corresponding to the visible spectrum, UV-resistant and covering said light-emitting diode (2) for sealing the LED. According to the invention, the module comprises a screen layer (5), transparent at least at the wavelengths corresponding to the visible spectrum, arranged between the light-emitting diode (2) and the encapsulation resin (3), said screen layer ( 5) not in direct contact with the fluorescent substance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1354826A FR3006546B1 (en) | 2013-05-28 | 2013-05-28 | WHITE LIGHT EMITTING DIODE MODULE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1354826A FR3006546B1 (en) | 2013-05-28 | 2013-05-28 | WHITE LIGHT EMITTING DIODE MODULE |
FR1354826 | 2013-05-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3006546A1 FR3006546A1 (en) | 2014-12-05 |
FR3006546B1 true FR3006546B1 (en) | 2019-03-29 |
Family
ID=48795800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1354826A Active FR3006546B1 (en) | 2013-05-28 | 2013-05-28 | WHITE LIGHT EMITTING DIODE MODULE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3006546B1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (en) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
RU2576382C2 (en) * | 2010-07-01 | 2016-03-10 | Конинклейке Филипс Электроникс Н.В. | Led module of modifiable luminescent tube placed inside sealed glass tube |
-
2013
- 2013-05-28 FR FR1354826A patent/FR3006546B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3006546A1 (en) | 2014-12-05 |
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