FR3005462B1 - MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS - Google Patents

MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS

Info

Publication number
FR3005462B1
FR3005462B1 FR1354216A FR1354216A FR3005462B1 FR 3005462 B1 FR3005462 B1 FR 3005462B1 FR 1354216 A FR1354216 A FR 1354216A FR 1354216 A FR1354216 A FR 1354216A FR 3005462 B1 FR3005462 B1 FR 3005462B1
Authority
FR
France
Prior art keywords
axis
device formed
microelectronic device
sensitive according
transducers sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1354216A
Other languages
French (fr)
Other versions
FR3005462A1 (en
Inventor
Olivier Gigan
Christian Pisella
Peter Pfluger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tronics Microsystems SA
Original Assignee
Tronics Microsystems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tronics Microsystems SA filed Critical Tronics Microsystems SA
Priority to FR1354216A priority Critical patent/FR3005462B1/en
Priority to PCT/FR2014/050897 priority patent/WO2014181051A1/en
Publication of FR3005462A1 publication Critical patent/FR3005462A1/en
Application granted granted Critical
Publication of FR3005462B1 publication Critical patent/FR3005462B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0757—Topology for facilitating the monolithic integration
    • B81C2203/0764—Forming the micromechanical structure in a groove
FR1354216A 2013-05-08 2013-05-08 MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS Active FR3005462B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1354216A FR3005462B1 (en) 2013-05-08 2013-05-08 MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS
PCT/FR2014/050897 WO2014181051A1 (en) 2013-05-08 2014-04-11 Microelectronic device formed from a set of electronic microsystems comprising at least three non-encapsulated monolithic inertial transducers sensitive along at least one axis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1354216A FR3005462B1 (en) 2013-05-08 2013-05-08 MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS

Publications (2)

Publication Number Publication Date
FR3005462A1 FR3005462A1 (en) 2014-11-14
FR3005462B1 true FR3005462B1 (en) 2015-05-15

Family

ID=49378360

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1354216A Active FR3005462B1 (en) 2013-05-08 2013-05-08 MICROELECTRONIC DEVICE FORMED OF A SET OF ELECTRONIC MICROSYSTEMS COMPRISING AT LEAST THREE NON-ENCAPSULATED MONOLITHIC INERTIAL TRANSDUCERS SENSITIVE ACCORDING TO AT LEAST ONE AXIS

Country Status (2)

Country Link
FR (1) FR3005462B1 (en)
WO (1) WO2014181051A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2833106B1 (en) * 2001-12-03 2005-02-25 St Microelectronics Sa INTEGRATED CIRCUIT INCLUDING AN AUXILIARY COMPONENT, FOR EXAMPLE A PASSIVE COMPONENT OR AN ELECTROMECHANICAL MICROSYSTEM, PROVIDED ABOVE AN ELECTRONIC CHIP, AND CORRESPONDING MANUFACTURING METHOD
US7253079B2 (en) * 2002-05-09 2007-08-07 The Charles Stark Draper Laboratory, Inc. Coplanar mounting member for a MEM sensor

Also Published As

Publication number Publication date
FR3005462A1 (en) 2014-11-14
WO2014181051A1 (en) 2014-11-13

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