FR2996052B1 - METHOD OF BONDING BY MOLECULAR ADHESION - Google Patents

METHOD OF BONDING BY MOLECULAR ADHESION

Info

Publication number
FR2996052B1
FR2996052B1 FR1259090A FR1259090A FR2996052B1 FR 2996052 B1 FR2996052 B1 FR 2996052B1 FR 1259090 A FR1259090 A FR 1259090A FR 1259090 A FR1259090 A FR 1259090A FR 2996052 B1 FR2996052 B1 FR 2996052B1
Authority
FR
France
Prior art keywords
bonding
molecular adhesion
adhesion
molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1259090A
Other languages
French (fr)
Other versions
FR2996052A1 (en
Inventor
Marcel Broekaart
Arnaud Castex
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1259090A priority Critical patent/FR2996052B1/en
Priority to PCT/IB2013/002089 priority patent/WO2014049414A1/en
Priority to CN201380050458.1A priority patent/CN104662649B/en
Publication of FR2996052A1 publication Critical patent/FR2996052A1/en
Application granted granted Critical
Publication of FR2996052B1 publication Critical patent/FR2996052B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Micromachines (AREA)
FR1259090A 2012-09-27 2012-09-27 METHOD OF BONDING BY MOLECULAR ADHESION Active FR2996052B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1259090A FR2996052B1 (en) 2012-09-27 2012-09-27 METHOD OF BONDING BY MOLECULAR ADHESION
PCT/IB2013/002089 WO2014049414A1 (en) 2012-09-27 2013-09-20 Direct bonding process
CN201380050458.1A CN104662649B (en) 2012-09-27 2013-09-20 Direct Bonding technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1259090A FR2996052B1 (en) 2012-09-27 2012-09-27 METHOD OF BONDING BY MOLECULAR ADHESION

Publications (2)

Publication Number Publication Date
FR2996052A1 FR2996052A1 (en) 2014-03-28
FR2996052B1 true FR2996052B1 (en) 2015-12-04

Family

ID=47215639

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1259090A Active FR2996052B1 (en) 2012-09-27 2012-09-27 METHOD OF BONDING BY MOLECULAR ADHESION

Country Status (3)

Country Link
CN (1) CN104662649B (en)
FR (1) FR2996052B1 (en)
WO (1) WO2014049414A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014224588B4 (en) 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Method for producing a plate-shaped metallized ceramic substrate, carrier for producing the substrate and use of the carrier
CN110148796B (en) * 2019-05-31 2021-06-04 广东天劲新能源科技股份有限公司 Processing device and method for manufacturing arc-shaped battery by utilizing thermal expansion coefficient difference
WO2023215598A1 (en) * 2022-05-05 2023-11-09 Adeia Semiconductor Bonding Technologies Inc. Low temperature direct bonding

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1153349A (en) 1955-11-15 1958-03-05 Acrow Eng Ltd scaffolding
FR2796491B1 (en) * 1999-07-12 2001-08-31 Commissariat Energie Atomique METHOD FOR TAKING OFF TWO ELEMENTS AND DEVICE FOR IMPLEMENTING SAME
FR2848337B1 (en) * 2002-12-09 2005-09-09 Commissariat Energie Atomique METHOD FOR PRODUCING A COMPLEX STRUCTURE BY ASSEMBLING STRESS STRUCTURES
JP5718235B2 (en) * 2008-11-16 2015-05-13 ズース マイクロテク，リソグラフィー，ゲエムベーハー Method and apparatus for wafer bonding that enhances wafer bonding
FR2954585B1 (en) 2009-12-23 2012-03-02 Soitec Silicon Insulator Technologies METHOD FOR MAKING A HETEROSTRUCTURE WITH MINIMIZATION OF STRESS
FR2965398B1 (en) 2010-09-23 2012-10-12 Soitec Silicon On Insulator MOLECULAR ADHESION COLLAGE PROCESS WITH OVERLAY TYPE RELOCATION REDUCTION
US8878116B2 (en) * 2011-02-28 2014-11-04 Sony Corporation Method of manufacturing solid-state imaging element, solid-state imaging element and electronic apparatus

Also Published As

Publication number Publication date
FR2996052A1 (en) 2014-03-28
WO2014049414A1 (en) 2014-04-03
CN104662649B (en) 2017-12-08
CN104662649A (en) 2015-05-27

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