FR2993134B1 - PRESS FOR ASSEMBLING MULTILAYER CIRCUITS - Google Patents
PRESS FOR ASSEMBLING MULTILAYER CIRCUITSInfo
- Publication number
- FR2993134B1 FR2993134B1 FR1201911A FR1201911A FR2993134B1 FR 2993134 B1 FR2993134 B1 FR 2993134B1 FR 1201911 A FR1201911 A FR 1201911A FR 1201911 A FR1201911 A FR 1201911A FR 2993134 B1 FR2993134 B1 FR 2993134B1
- Authority
- FR
- France
- Prior art keywords
- press
- multilayer circuits
- assembling multilayer
- assembling
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Press Drives And Press Lines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1201911A FR2993134B1 (en) | 2012-07-06 | 2012-07-06 | PRESS FOR ASSEMBLING MULTILAYER CIRCUITS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1201911A FR2993134B1 (en) | 2012-07-06 | 2012-07-06 | PRESS FOR ASSEMBLING MULTILAYER CIRCUITS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2993134A1 FR2993134A1 (en) | 2014-01-10 |
FR2993134B1 true FR2993134B1 (en) | 2015-05-29 |
Family
ID=47019055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1201911A Expired - Fee Related FR2993134B1 (en) | 2012-07-06 | 2012-07-06 | PRESS FOR ASSEMBLING MULTILAYER CIRCUITS |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2993134B1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1154256B (en) * | 1961-06-29 | 1963-09-12 | Eugen Siempelkamp | Hot plate press, in particular hot plate stack press |
US3969051A (en) * | 1975-06-13 | 1976-07-13 | D.G. Rung Industries, Inc. | Vulcanizing apparatus |
DE8518808U1 (en) * | 1985-06-28 | 1985-08-29 | Wacker, Jürgen, 5353 Mechernich | Heatable press ram for a laminating press |
DE3739213A1 (en) * | 1987-11-19 | 1989-06-01 | Zaengl Gmbh | Heating press |
DE4141972C2 (en) * | 1991-12-19 | 1995-02-02 | Interlock Ag | Method and device for laminating layers of identification cards and. the like |
DE4141971C2 (en) * | 1991-12-19 | 1995-02-02 | Interlock Ag | Device for laminating layers for identification cards and. the like |
IT1272106B (en) * | 1993-03-18 | 1997-06-11 | Cedal Srl | SYSTEM FOR THE AUTOMATIC CONNECTION BETWEEN THE ELECTRICITY SOURCE AND THE STACKS OF PLASTIC LAMINATE PACKAGES, IN THE ENDOTHERMAL HEATING. |
US5562796A (en) * | 1994-05-24 | 1996-10-08 | Dorner Mfg. Corp. | Heat press for joining the spliced ends of a conveyor belt |
DE102010031421B4 (en) * | 2010-07-15 | 2013-04-18 | Ruhlamat Gmbh | Laminating apparatus and method for laminating multi-ply documents |
-
2012
- 2012-07-06 FR FR1201911A patent/FR2993134B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2993134A1 (en) | 2014-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
ST | Notification of lapse |
Effective date: 20200306 |