FR2987495B1 - CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD - Google Patents

CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD

Info

Publication number
FR2987495B1
FR2987495B1 FR1200527A FR1200527A FR2987495B1 FR 2987495 B1 FR2987495 B1 FR 2987495B1 FR 1200527 A FR1200527 A FR 1200527A FR 1200527 A FR1200527 A FR 1200527A FR 2987495 B1 FR2987495 B1 FR 2987495B1
Authority
FR
France
Prior art keywords
fluid
printed board
multilayer printed
circulation channels
circulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1200527A
Other languages
French (fr)
Other versions
FR2987495A1 (en
Inventor
Bernard Ledain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR1200527A priority Critical patent/FR2987495B1/en
Publication of FR2987495A1 publication Critical patent/FR2987495A1/en
Application granted granted Critical
Publication of FR2987495B1 publication Critical patent/FR2987495B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
FR1200527A 2012-02-23 2012-02-23 CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD Active FR2987495B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1200527A FR2987495B1 (en) 2012-02-23 2012-02-23 CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1200527A FR2987495B1 (en) 2012-02-23 2012-02-23 CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD

Publications (2)

Publication Number Publication Date
FR2987495A1 FR2987495A1 (en) 2013-08-30
FR2987495B1 true FR2987495B1 (en) 2014-02-14

Family

ID=46634179

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1200527A Active FR2987495B1 (en) 2012-02-23 2012-02-23 CIRCULATION CHANNELS OF A FLUID IN A MULTILAYER PRINTED BOARD

Country Status (1)

Country Link
FR (1) FR2987495B1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
JPH06152172A (en) * 1992-11-10 1994-05-31 Furukawa Electric Co Ltd:The Circuit board in which heat pipe is embedded
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
JP2006032490A (en) * 2004-07-13 2006-02-02 Hitachi Ltd Engine controlling circuit device
WO2006007803A1 (en) * 2004-07-20 2006-01-26 Technische Universität Braunschweig Carolo-Wilhelmina Cooled integrated circuit
CN101594739A (en) * 2008-05-27 2009-12-02 华为技术有限公司 Device embedded circuit board heat abstractor and processing method
EP2330873A1 (en) * 2009-12-03 2011-06-08 Continental Automotive GmbH Electronic module

Also Published As

Publication number Publication date
FR2987495A1 (en) 2013-08-30

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