FR2985155B1 - PRINTED CIRCUIT, IN PARTICULAR FOR AN LED OPTICAL DEVICE FOR A MOTOR VEHICLE - Google Patents
PRINTED CIRCUIT, IN PARTICULAR FOR AN LED OPTICAL DEVICE FOR A MOTOR VEHICLEInfo
- Publication number
- FR2985155B1 FR2985155B1 FR1162242A FR1162242A FR2985155B1 FR 2985155 B1 FR2985155 B1 FR 2985155B1 FR 1162242 A FR1162242 A FR 1162242A FR 1162242 A FR1162242 A FR 1162242A FR 2985155 B1 FR2985155 B1 FR 2985155B1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- motor vehicle
- optical device
- led optical
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1162242A FR2985155B1 (en) | 2011-12-22 | 2011-12-22 | PRINTED CIRCUIT, IN PARTICULAR FOR AN LED OPTICAL DEVICE FOR A MOTOR VEHICLE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1162242A FR2985155B1 (en) | 2011-12-22 | 2011-12-22 | PRINTED CIRCUIT, IN PARTICULAR FOR AN LED OPTICAL DEVICE FOR A MOTOR VEHICLE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2985155A1 FR2985155A1 (en) | 2013-06-28 |
FR2985155B1 true FR2985155B1 (en) | 2014-10-31 |
Family
ID=45815767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1162242A Expired - Fee Related FR2985155B1 (en) | 2011-12-22 | 2011-12-22 | PRINTED CIRCUIT, IN PARTICULAR FOR AN LED OPTICAL DEVICE FOR A MOTOR VEHICLE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2985155B1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10010979A1 (en) * | 2000-03-07 | 2001-09-13 | Bosch Gmbh Robert | Electrical circuit on substrate e.g. PCB, has component(s) mounted on conducting track layer on substrate and enclosed by recesses in conducting track layer in form of round holes or trenches |
JP3610496B2 (en) * | 2002-07-30 | 2005-01-12 | オリオン電機株式会社 | Soldering structure for printed circuit boards and electronic components |
WO2011038090A1 (en) * | 2009-09-23 | 2011-03-31 | 3M Innovative Properties Company | Electrical connection and method for making the same |
TW201117436A (en) * | 2009-11-04 | 2011-05-16 | Everlight Electronics Co Ltd | Light-emitting diode package and manufacturing method thereof |
WO2011060605A1 (en) * | 2009-11-17 | 2011-05-26 | Wang Dingfeng | Double-sided circuit board with pin soldered both on top circuit and bottom circuit and method for interconnection |
-
2011
- 2011-12-22 FR FR1162242A patent/FR2985155B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2985155A1 (en) | 2013-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20180831 |