FR2980920B1 - Circuit integre a cle d'identification auto-programmee - Google Patents

Circuit integre a cle d'identification auto-programmee

Info

Publication number
FR2980920B1
FR2980920B1 FR1158734A FR1158734A FR2980920B1 FR 2980920 B1 FR2980920 B1 FR 2980920B1 FR 1158734 A FR1158734 A FR 1158734A FR 1158734 A FR1158734 A FR 1158734A FR 2980920 B1 FR2980920 B1 FR 2980920B1
Authority
FR
France
Prior art keywords
self
integrated circuit
identification key
programmed identification
programmed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1158734A
Other languages
English (en)
Other versions
FR2980920A1 (fr
Inventor
Emmanuel Petitprez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
Original Assignee
STMicroelectronics Crolles 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Crolles 2 SAS filed Critical STMicroelectronics Crolles 2 SAS
Priority to FR1158734A priority Critical patent/FR2980920B1/fr
Priority to US13/607,578 priority patent/US8848417B2/en
Publication of FR2980920A1 publication Critical patent/FR2980920A1/fr
Application granted granted Critical
Publication of FR2980920B1 publication Critical patent/FR2980920B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR1158734A 2011-09-29 2011-09-29 Circuit integre a cle d'identification auto-programmee Expired - Fee Related FR2980920B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1158734A FR2980920B1 (fr) 2011-09-29 2011-09-29 Circuit integre a cle d'identification auto-programmee
US13/607,578 US8848417B2 (en) 2011-09-29 2012-09-07 Integrated circuit with a self-programmed identification key

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1158734A FR2980920B1 (fr) 2011-09-29 2011-09-29 Circuit integre a cle d'identification auto-programmee

Publications (2)

Publication Number Publication Date
FR2980920A1 FR2980920A1 (fr) 2013-04-05
FR2980920B1 true FR2980920B1 (fr) 2013-10-04

Family

ID=45815644

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1158734A Expired - Fee Related FR2980920B1 (fr) 2011-09-29 2011-09-29 Circuit integre a cle d'identification auto-programmee

Country Status (2)

Country Link
US (1) US8848417B2 (fr)
FR (1) FR2980920B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103192521B (zh) * 2013-04-29 2015-08-12 中发输配电设备（平湖）有限公司 盆形绝缘子校平装置
US9666660B2 (en) * 2013-08-16 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structures including metal insulator metal capacitor
US9298946B2 (en) * 2013-09-09 2016-03-29 Qualcomm Incorporated Physically unclonable function based on breakdown voltage of metal-insulator-metal device
US9189654B2 (en) * 2013-12-04 2015-11-17 International Business Machines Corporation On-chip structure for security application
CN106997843B (zh) * 2016-01-22 2020-05-01 中芯国际集成电路制造(上海)有限公司 半导体器件安全认证方法
FR3050319B1 (fr) * 2016-04-14 2018-05-11 Stmicroelectronics Sa Memoire morte configurable
FR3053156B1 (fr) * 2016-06-28 2018-11-16 Stmicroelectronics (Rousset) Sas Composant a faible dispersion dans une puce electronique
US10462110B2 (en) * 2017-02-16 2019-10-29 Intel Corporation System, apparatus and method for providing a unique identifier in a fuseless semiconductor device
US10643006B2 (en) * 2017-06-14 2020-05-05 International Business Machines Corporation Semiconductor chip including integrated security circuit
FR3069677A1 (fr) 2017-07-27 2019-02-01 Stmicroelectronics (Crolles 2) Sas Dispositif de generation d'un nombre aleatoire
US10623192B2 (en) 2017-08-25 2020-04-14 Synopsys, Inc. Gate oxide breakdown in OTP memory cells for physical unclonable function (PUF) security
US11145591B2 (en) * 2019-11-18 2021-10-12 International Business Machines Corporation Integrated circuit (IC) device integral capacitor and anti-fuse
US11516028B2 (en) 2019-12-24 2022-11-29 CERA Licensing Limited Temperature sensing physical unclonable function (PUF) authentication system
GB201919297D0 (en) 2019-12-24 2020-02-05 Aronson Bill Temperature sensing physical unclonable function (puf) authenication system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5056061A (en) 1989-12-20 1991-10-08 N. A. Philips Corporation Circuit for encoding identification information on circuit dice using fet capacitors
JP2000003991A (ja) 1998-06-15 2000-01-07 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6180976B1 (en) 1999-02-02 2001-01-30 Conexant Systems, Inc. Thin-film capacitors and methods for forming the same
US6504202B1 (en) 2000-02-02 2003-01-07 Lsi Logic Corporation Interconnect-embedded metal-insulator-metal capacitor
JPWO2002050910A1 (ja) * 2000-12-01 2004-04-22 株式会社日立製作所 半導体集積回路装置の識別方法と半導体集積回路装置の製造方法及び半導体集積回路装置
US6960819B2 (en) * 2000-12-20 2005-11-01 Broadcom Corporation System and method for one-time programmed memory through direct-tunneling oxide breakdown
US6916722B2 (en) 2002-12-02 2005-07-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method to fabricate high reliable metal capacitor within copper back-end process
US7321502B2 (en) * 2004-09-30 2008-01-22 Intel Corporation Non volatile data storage through dielectric breakdown
US8134196B2 (en) 2005-09-02 2012-03-13 Stats Chippac Ltd. Integrated circuit system with metal-insulator-metal circuit element
US8659124B2 (en) 2008-12-29 2014-02-25 Nxp B.V. Physical structure for use in a physical unclonable function

Also Published As

Publication number Publication date
FR2980920A1 (fr) 2013-04-05
US20130083586A1 (en) 2013-04-04
US8848417B2 (en) 2014-09-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150529