FR2980268B1 - METHOD AND SYSTEM FOR DETECTION IN HIGH TEMPERATURE ENVIRONMENTS - Google Patents

METHOD AND SYSTEM FOR DETECTION IN HIGH TEMPERATURE ENVIRONMENTS Download PDF

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Publication number
FR2980268B1
FR2980268B1 FR1202517A FR1202517A FR2980268B1 FR 2980268 B1 FR2980268 B1 FR 2980268B1 FR 1202517 A FR1202517 A FR 1202517A FR 1202517 A FR1202517 A FR 1202517A FR 2980268 B1 FR2980268 B1 FR 2980268B1
Authority
FR
France
Prior art keywords
detection
high temperature
temperature environments
environments
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1202517A
Other languages
French (fr)
Other versions
FR2980268A1 (en
Inventor
Marc Dierckx
Rymantas Jonas Kazys
Algirdas Voleisis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAUNAS UNIVERSITY OF TECHNOLOGY, LT
SCK-CEN, BE
Original Assignee
SCK CEN
Kauno Technologijos Universitetas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCK CEN, Kauno Technologijos Universitetas filed Critical SCK CEN
Publication of FR2980268A1 publication Critical patent/FR2980268A1/en
Application granted granted Critical
Publication of FR2980268B1 publication Critical patent/FR2980268B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/228Details, e.g. general constructional or apparatus details related to high temperature conditions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21CNUCLEAR REACTORS
    • G21C17/00Monitoring; Testing ; Maintaining
    • G21C17/02Devices or arrangements for monitoring coolant or moderator
    • G21C17/022Devices or arrangements for monitoring coolant or moderator for monitoring liquid coolants or moderators
    • G21C17/025Devices or arrangements for monitoring coolant or moderator for monitoring liquid coolants or moderators for monitoring liquid metal coolants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/02Forming enclosures or casings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/03Assembling devices that include piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00Energy generation of nuclear origin
    • Y02E30/30Nuclear fission reactors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Plasma & Fusion (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Monitoring And Testing Of Nuclear Reactors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
FR1202517A 2011-09-21 2012-09-21 METHOD AND SYSTEM FOR DETECTION IN HIGH TEMPERATURE ENVIRONMENTS Active FR2980268B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11182253.2 2011-09-21
EP11182253 2011-09-21

Publications (2)

Publication Number Publication Date
FR2980268A1 FR2980268A1 (en) 2013-03-22
FR2980268B1 true FR2980268B1 (en) 2018-05-04

Family

ID=46851351

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1202517A Active FR2980268B1 (en) 2011-09-21 2012-09-21 METHOD AND SYSTEM FOR DETECTION IN HIGH TEMPERATURE ENVIRONMENTS

Country Status (2)

Country Link
FR (1) FR2980268B1 (en)
GB (1) GB2495378A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102762A1 (en) * 2015-02-26 2016-09-01 Sick Ag Ultrasonic transducer and method for producing an ultrasonic transducer
WO2017223499A1 (en) * 2016-06-24 2017-12-28 Wyle Laboratories Inc. Micro-resolution ultrasonic nondestructive imaging method
CN108011035B (en) * 2017-12-13 2021-02-26 中国电子科技集团公司第二十六研究所 Bonding method of piezoelectric ceramic piece
WO2020194026A1 (en) * 2019-03-23 2020-10-01 Secretary, Department Of Atomic Energy Diffusion bonding of piezoelectric crystal to metal wear plate
DE102021109992A1 (en) 2021-04-20 2022-10-20 Flexim Flexible Industriemesstechnik Gmbh Process and arrangement for joining a piezoelectric material for a wide temperature range

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4077558A (en) * 1976-12-06 1978-03-07 International Business Machines Corporation Diffusion bonding of crystals
US5180093A (en) * 1991-09-05 1993-01-19 Cray Research, Inc. Apparatus for ultrasonic bonding
JP3420954B2 (en) * 1998-12-14 2003-06-30 松下電器産業株式会社 Ultrasonic probe
US8833174B2 (en) * 2007-04-12 2014-09-16 Colorado School Of Mines Piezoelectric sensor based smart-die structure for predicting the onset of failure during die casting operations
JP5031450B2 (en) * 2007-06-12 2012-09-19 富士フイルム株式会社 Composite piezoelectric material, ultrasonic probe, ultrasonic endoscope, and ultrasonic diagnostic apparatus
JP5346182B2 (en) * 2008-07-30 2013-11-20 富士フイルム株式会社 Intracavity ultrasound probe

Also Published As

Publication number Publication date
GB2495378A (en) 2013-04-10
GB201216914D0 (en) 2012-11-07
FR2980268A1 (en) 2013-03-22

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Owner name: SCK-CEN, BE

Effective date: 20140930

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