FR2979483B1 - ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE - Google Patents

ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE

Info

Publication number
FR2979483B1
FR2979483B1 FR1157447A FR1157447A FR2979483B1 FR 2979483 B1 FR2979483 B1 FR 2979483B1 FR 1157447 A FR1157447 A FR 1157447A FR 1157447 A FR1157447 A FR 1157447A FR 2979483 B1 FR2979483 B1 FR 2979483B1
Authority
FR
France
Prior art keywords
electronic circuit
domotic device
domotic
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1157447A
Other languages
French (fr)
Other versions
FR2979483A1 (en
Inventor
Volkmar Rebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somfy Activites SA
Original Assignee
Somfy SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somfy SA filed Critical Somfy SA
Priority to FR1157447A priority Critical patent/FR2979483B1/en
Priority to DE201220007971 priority patent/DE202012007971U1/en
Publication of FR2979483A1 publication Critical patent/FR2979483A1/en
Application granted granted Critical
Publication of FR2979483B1 publication Critical patent/FR2979483B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/105Mechanically attached to another device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10651Component having two leads, e.g. resistor, capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR1157447A 2011-08-22 2011-08-22 ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE Active FR2979483B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1157447A FR2979483B1 (en) 2011-08-22 2011-08-22 ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE
DE201220007971 DE202012007971U1 (en) 2011-08-22 2012-08-22 Electronic circuit for a home automation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1157447A FR2979483B1 (en) 2011-08-22 2011-08-22 ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE

Publications (2)

Publication Number Publication Date
FR2979483A1 FR2979483A1 (en) 2013-03-01
FR2979483B1 true FR2979483B1 (en) 2016-06-24

Family

ID=47425990

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1157447A Active FR2979483B1 (en) 2011-08-22 2011-08-22 ELECTRONIC CIRCUIT FOR DOMOTIC DEVICE

Country Status (2)

Country Link
DE (1) DE202012007971U1 (en)
FR (1) FR2979483B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10348421A1 (en) * 2003-10-14 2005-06-02 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Operating circuit for lamp with heat sink
US7151010B2 (en) 2004-12-01 2006-12-19 Kyocera Wireless Corp. Methods for assembling a stack package for high density integrated circuits

Also Published As

Publication number Publication date
DE202012007971U1 (en) 2012-11-26
FR2979483A1 (en) 2013-03-01

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