FR2979033B1 - METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE - Google Patents

METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE

Info

Publication number
FR2979033B1
FR2979033B1 FR1202206A FR1202206A FR2979033B1 FR 2979033 B1 FR2979033 B1 FR 2979033B1 FR 1202206 A FR1202206 A FR 1202206A FR 1202206 A FR1202206 A FR 1202206A FR 2979033 B1 FR2979033 B1 FR 2979033B1
Authority
FR
France
Prior art keywords
composite wafer
graphite core
manufacturing
graphite
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1202206A
Other languages
French (fr)
Other versions
FR2979033A1 (en
Inventor
Rudolf Berger
Hermann Gruber
Wolfgang Lehnert
Guenther Ruhl
Raimund Foerg
Anton Mauder
Hans Joachim Schulze
Karsten Kellermann
Michael Sommer
Christian Rottmair
Roland Rupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/206,029 external-priority patent/US8822306B2/en
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of FR2979033A1 publication Critical patent/FR2979033A1/en
Priority to FR1300612A priority Critical patent/FR2987168B1/en
Application granted granted Critical
Publication of FR2979033B1 publication Critical patent/FR2979033B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR1202206A 2011-08-09 2012-08-08 METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE Active FR2979033B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1300612A FR2987168B1 (en) 2011-08-09 2013-03-18 METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/206,029 US8822306B2 (en) 2010-09-30 2011-08-09 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core

Publications (2)

Publication Number Publication Date
FR2979033A1 FR2979033A1 (en) 2013-02-15
FR2979033B1 true FR2979033B1 (en) 2016-11-25

Family

ID=47605849

Family Applications (2)

Application Number Title Priority Date Filing Date
FR1202206A Active FR2979033B1 (en) 2011-08-09 2012-08-08 METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE
FR1300612A Active FR2987168B1 (en) 2011-08-09 2013-03-18 METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR1300612A Active FR2987168B1 (en) 2011-08-09 2013-03-18 METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE

Country Status (1)

Country Link
FR (2) FR2979033B1 (en)

Also Published As

Publication number Publication date
FR2987168A1 (en) 2013-08-23
FR2987168B1 (en) 2016-11-25
FR2979033A1 (en) 2013-02-15

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