FR2969812B1 - METHOD FOR MANUFACTURING FLAT PANEL SENSOR - Google Patents

METHOD FOR MANUFACTURING FLAT PANEL SENSOR Download PDF

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Publication number
FR2969812B1
FR2969812B1 FR1162222A FR1162222A FR2969812B1 FR 2969812 B1 FR2969812 B1 FR 2969812B1 FR 1162222 A FR1162222 A FR 1162222A FR 1162222 A FR1162222 A FR 1162222A FR 2969812 B1 FR2969812 B1 FR 2969812B1
Authority
FR
France
Prior art keywords
flat panel
panel sensor
manufacturing flat
manufacturing
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1162222A
Other languages
French (fr)
Other versions
FR2969812A1 (en
Inventor
Liang Zhang
Hongye ZHANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Medical Systems Global Technology Co LLC
Original Assignee
GE Medical Systems Global Technology Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Medical Systems Global Technology Co LLC filed Critical GE Medical Systems Global Technology Co LLC
Publication of FR2969812A1 publication Critical patent/FR2969812A1/en
Application granted granted Critical
Publication of FR2969812B1 publication Critical patent/FR2969812B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T7/00Details of radiation-measuring instruments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469Assemblies, i.e. hybrid integration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14658X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Adhesive Tapes (AREA)
FR1162222A 2010-12-22 2011-12-21 METHOD FOR MANUFACTURING FLAT PANEL SENSOR Expired - Fee Related FR2969812B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010620640.4 2010-12-22
CN201010620640.4A CN102551786B (en) 2010-12-22 2010-12-22 Use can remove the method for two-sided glued membrane fixed flat planar detector

Publications (2)

Publication Number Publication Date
FR2969812A1 FR2969812A1 (en) 2012-06-29
FR2969812B1 true FR2969812B1 (en) 2018-07-06

Family

ID=46210536

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1162222A Expired - Fee Related FR2969812B1 (en) 2010-12-22 2011-12-21 METHOD FOR MANUFACTURING FLAT PANEL SENSOR

Country Status (3)

Country Link
JP (1) JP6006484B2 (en)
CN (1) CN102551786B (en)
FR (1) FR2969812B1 (en)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118599A (en) * 1990-09-10 1992-04-20 Fujitsu Ltd X-ray picture image conversion sheet and apparatus using the same
US6847041B2 (en) * 2001-02-09 2005-01-25 Canon Kabushiki Kaisha Scintillator panel, radiation detector and manufacture methods thereof
JP2003043934A (en) * 2001-07-23 2003-02-14 Three M Innovative Properties Co Optical filter and double-faced adhesive tape with tab
JP2003332541A (en) * 2002-05-08 2003-11-21 Canon Inc Method of manufacturing imaging device
JP4032967B2 (en) * 2002-12-26 2008-01-16 松下電工株式会社 Glass break sensor
JP2004318033A (en) * 2003-04-16 2004-11-11 Mio Corporation Segment lighting position detection sensor of numeric indicator
JP2005227064A (en) * 2004-02-12 2005-08-25 Konica Minolta Medical & Graphic Inc Radiation image conversion panel
JP4442278B2 (en) * 2004-03-29 2010-03-31 株式会社島津製作所 Radiation detector
JP2006046990A (en) * 2004-08-02 2006-02-16 Konica Minolta Medical & Graphic Inc Radiographic image conversion panel
JP2006225620A (en) * 2005-02-16 2006-08-31 Akio Arai Helical tape
JP4448463B2 (en) * 2005-02-28 2010-04-07 株式会社セイコーアイ・インフォテック Document reading unit, scanner device, and image forming apparatus
KR100730726B1 (en) * 2006-04-14 2007-06-21 옵토팩 주식회사 Camera module
US7396159B2 (en) * 2006-06-07 2008-07-08 General Electric Company X-ray detector panel methods and apparatus
US7694570B1 (en) * 2007-03-30 2010-04-13 Cosense, Inc Non-invasive dry coupled disposable/reusable ultrasonic sensor
JP5255871B2 (en) * 2008-03-17 2013-08-07 株式会社ニトムズ Peelable adhesive tape
CN101604023B (en) * 2008-06-12 2012-11-14 清华大学 Array solid probe for radiation detection
JP5288956B2 (en) * 2008-09-09 2013-09-11 株式会社中央倉庫 Pallet and box
JP5405088B2 (en) * 2008-11-20 2014-02-05 株式会社カネカ Graphite composite film
JP5441400B2 (en) * 2008-12-19 2014-03-12 キヤノン株式会社 Imaging apparatus, radiation imaging apparatus, and manufacturing method thereof
JP5254918B2 (en) * 2009-09-25 2013-08-07 富士フイルム株式会社 Radiation imaging equipment

Also Published As

Publication number Publication date
CN102551786A (en) 2012-07-11
JP6006484B2 (en) 2016-10-12
FR2969812A1 (en) 2012-06-29
JP2012132906A (en) 2012-07-12
CN102551786B (en) 2016-08-03

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