FR2967694B3 - Systeme de depot de metal alcalin - Google Patents

Systeme de depot de metal alcalin

Info

Publication number
FR2967694B3
FR2967694B3 FR1103567A FR1103567A FR2967694B3 FR 2967694 B3 FR2967694 B3 FR 2967694B3 FR 1103567 A FR1103567 A FR 1103567A FR 1103567 A FR1103567 A FR 1103567A FR 2967694 B3 FR2967694 B3 FR 2967694B3
Authority
FR
France
Prior art keywords
metal deposition
deposition system
alkaline metal
alkaline
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR1103567A
Other languages
English (en)
Other versions
FR2967694A3 (fr
Inventor
Byung Sung Kwak
Stefan Bangert
Michael Koenig
Florian Ries
Ralf Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of FR2967694A3 publication Critical patent/FR2967694A3/fr
Application granted granted Critical
Publication of FR2967694B3 publication Critical patent/FR2967694B3/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR1103567A 2010-11-24 2011-11-23 Systeme de depot de metal alcalin Expired - Lifetime FR2967694B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41710810P 2010-11-24 2010-11-24

Publications (2)

Publication Number Publication Date
FR2967694A3 FR2967694A3 (fr) 2012-05-25
FR2967694B3 true FR2967694B3 (fr) 2012-12-07

Family

ID=45896159

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1103567A Expired - Lifetime FR2967694B3 (fr) 2010-11-24 2011-11-23 Systeme de depot de metal alcalin

Country Status (4)

Country Link
US (1) US20120152727A1 (fr)
CN (1) CN202465855U (fr)
DE (1) DE202011052094U1 (fr)
FR (1) FR2967694B3 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012145702A2 (fr) 2011-04-21 2012-10-26 Soladigm, Inc. Cibles de pulvérisation de lithium
CN109097746A (zh) 2011-06-30 2018-12-28 唯景公司 溅射靶和溅射方法
EP2746423B1 (fr) * 2012-12-20 2019-12-18 Applied Materials, Inc. Système de dépôt, appareil de dépôt et procédé de fonctionnement
WO2014176457A1 (fr) * 2013-04-24 2014-10-30 View, Inc. Auto pulvérisation entretenue de lithium pour un dépôt physique en phase vapeur de lithium
BE1022190B1 (nl) * 2014-07-07 2016-02-25 Soleras Advanced Coatings Bvba Afscherming voor een reactief sputterdoel
CN208167089U (zh) * 2015-05-08 2018-11-30 应用材料公司 用于靶材的保护构件和用于在靶材处理期间保护靶材的系统
CN109524287A (zh) * 2018-12-28 2019-03-26 北京铂阳顶荣光伏科技有限公司 离子注入设备及太阳能电池制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5487822A (en) * 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5830336A (en) * 1995-12-05 1998-11-03 Minnesota Mining And Manufacturing Company Sputtering of lithium
US6103069A (en) * 1997-03-31 2000-08-15 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
TW584905B (en) * 2000-02-25 2004-04-21 Tokyo Electron Ltd Method and apparatus for depositing films
US6506289B2 (en) * 2000-08-07 2003-01-14 Symmorphix, Inc. Planar optical devices and methods for their manufacture
JP5051954B2 (ja) * 2001-09-17 2012-10-17 エルエスアイ コーポレーション スパツタリング方法及び該方法に使用するスパツタリングターゲット用カバー
US7247221B2 (en) * 2002-05-17 2007-07-24 Applied Films Corporation System and apparatus for control of sputter deposition process
KR101773498B1 (ko) 2007-10-25 2017-09-01 어플라이드 머티어리얼스, 인코포레이티드 박막 배터리들의 대량 생산을 위한 방법
US8168265B2 (en) 2008-06-06 2012-05-01 Applied Materials, Inc. Method for manufacturing electrochromic devices

Also Published As

Publication number Publication date
FR2967694A3 (fr) 2012-05-25
DE202011052094U1 (de) 2012-02-27
US20120152727A1 (en) 2012-06-21
CN202465855U (zh) 2012-10-03

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