FR2967694B3 - Systeme de depot de metal alcalin - Google Patents
Systeme de depot de metal alcalinInfo
- Publication number
- FR2967694B3 FR2967694B3 FR1103567A FR1103567A FR2967694B3 FR 2967694 B3 FR2967694 B3 FR 2967694B3 FR 1103567 A FR1103567 A FR 1103567A FR 1103567 A FR1103567 A FR 1103567A FR 2967694 B3 FR2967694 B3 FR 2967694B3
- Authority
- FR
- France
- Prior art keywords
- metal deposition
- deposition system
- alkaline metal
- alkaline
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41710810P | 2010-11-24 | 2010-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2967694A3 FR2967694A3 (fr) | 2012-05-25 |
FR2967694B3 true FR2967694B3 (fr) | 2012-12-07 |
Family
ID=45896159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1103567A Expired - Lifetime FR2967694B3 (fr) | 2010-11-24 | 2011-11-23 | Systeme de depot de metal alcalin |
Country Status (4)
Country | Link |
---|---|
US (1) | US20120152727A1 (fr) |
CN (1) | CN202465855U (fr) |
DE (1) | DE202011052094U1 (fr) |
FR (1) | FR2967694B3 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012145702A2 (fr) | 2011-04-21 | 2012-10-26 | Soladigm, Inc. | Cibles de pulvérisation de lithium |
CN109097746A (zh) | 2011-06-30 | 2018-12-28 | 唯景公司 | 溅射靶和溅射方法 |
EP2746423B1 (fr) * | 2012-12-20 | 2019-12-18 | Applied Materials, Inc. | Système de dépôt, appareil de dépôt et procédé de fonctionnement |
WO2014176457A1 (fr) * | 2013-04-24 | 2014-10-30 | View, Inc. | Auto pulvérisation entretenue de lithium pour un dépôt physique en phase vapeur de lithium |
BE1022190B1 (nl) * | 2014-07-07 | 2016-02-25 | Soleras Advanced Coatings Bvba | Afscherming voor een reactief sputterdoel |
CN208167089U (zh) * | 2015-05-08 | 2018-11-30 | 应用材料公司 | 用于靶材的保护构件和用于在靶材处理期间保护靶材的系统 |
CN109524287A (zh) * | 2018-12-28 | 2019-03-26 | 北京铂阳顶荣光伏科技有限公司 | 离子注入设备及太阳能电池制作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5487822A (en) * | 1993-11-24 | 1996-01-30 | Applied Materials, Inc. | Integrated sputtering target assembly |
US5830336A (en) * | 1995-12-05 | 1998-11-03 | Minnesota Mining And Manufacturing Company | Sputtering of lithium |
US6103069A (en) * | 1997-03-31 | 2000-08-15 | Applied Materials, Inc. | Chamber design with isolation valve to preserve vacuum during maintenance |
TW584905B (en) * | 2000-02-25 | 2004-04-21 | Tokyo Electron Ltd | Method and apparatus for depositing films |
US6506289B2 (en) * | 2000-08-07 | 2003-01-14 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
JP5051954B2 (ja) * | 2001-09-17 | 2012-10-17 | エルエスアイ コーポレーション | スパツタリング方法及び該方法に使用するスパツタリングターゲット用カバー |
US7247221B2 (en) * | 2002-05-17 | 2007-07-24 | Applied Films Corporation | System and apparatus for control of sputter deposition process |
KR101773498B1 (ko) | 2007-10-25 | 2017-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 박막 배터리들의 대량 생산을 위한 방법 |
US8168265B2 (en) | 2008-06-06 | 2012-05-01 | Applied Materials, Inc. | Method for manufacturing electrochromic devices |
-
2011
- 2011-11-21 US US13/301,718 patent/US20120152727A1/en not_active Abandoned
- 2011-11-23 FR FR1103567A patent/FR2967694B3/fr not_active Expired - Lifetime
- 2011-11-24 DE DE202011052094U patent/DE202011052094U1/de not_active Expired - Lifetime
- 2011-11-24 CN CN2011204965000U patent/CN202465855U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2967694A3 (fr) | 2012-05-25 |
DE202011052094U1 (de) | 2012-02-27 |
US20120152727A1 (en) | 2012-06-21 |
CN202465855U (zh) | 2012-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |