FR2959908A1 - Procede de realisation d'un circuit imprime - Google Patents
Procede de realisation d'un circuit imprime Download PDFInfo
- Publication number
- FR2959908A1 FR2959908A1 FR1001908A FR1001908A FR2959908A1 FR 2959908 A1 FR2959908 A1 FR 2959908A1 FR 1001908 A FR1001908 A FR 1001908A FR 1001908 A FR1001908 A FR 1001908A FR 2959908 A1 FR2959908 A1 FR 2959908A1
- Authority
- FR
- France
- Prior art keywords
- instruction
- offset
- hole
- terminal areas
- hyperfrequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005553 drilling Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
L'invention vise un procédé de réalisation d'un circuit imprimé comportant la formation de trous métallisés au sein dudit de circuit imprimé de façon à établir une connexion. La formation de trous métallisés comprend : - un calcul d'un écart fonction de l'erreur de positionnement d'un outil de perçage choisi pour la réalisation des trous, - un établissement d'une instruction de positionnement de trous métallisés, tel que pour chaque emplacement où une connexion est à former : • on place une première (PSTP) et une deuxième (PSTS) pastilles métallisées reliées entre elles à l'aide d'une piste de raccordement (PRA), toutes deux étant connectées à une même piste du circuit imprimé, et • on place un premier (TRP) et un deuxième (TRS) trou respectivement au sein de chaque pastille, la position de chaque trou étant décalée du centre de la pastille considérée dudit écart, dans des sens opposés, - une réalisation des pastilles et un perçage des trous métallisés selon ladite instruction, chaque trou percé étant au final, décalé de sa position établie dans l'instruction, de l'erreur de positionnement de l'outil de perçage considéré.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1001908A FR2959908B1 (fr) | 2010-05-04 | 2010-05-04 | Procede de realisation d'un circuit imprime |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1001908A FR2959908B1 (fr) | 2010-05-04 | 2010-05-04 | Procede de realisation d'un circuit imprime |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2959908A1 true FR2959908A1 (fr) | 2011-11-11 |
FR2959908B1 FR2959908B1 (fr) | 2012-06-15 |
Family
ID=43016915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1001908A Active FR2959908B1 (fr) | 2010-05-04 | 2010-05-04 | Procede de realisation d'un circuit imprime |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2959908B1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013063201A1 (fr) * | 2011-10-25 | 2013-05-02 | Zih Corp. | Structures pour compensation d'erreur d'alignement |
EP2597722A1 (fr) * | 2011-11-24 | 2013-05-29 | Rohde & Schwarz GmbH & Co. KG | Filtre interdigital dans la technologie strip-line |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105514542B (zh) * | 2015-12-24 | 2018-05-04 | 西安恒达微波技术开发有限公司 | 双路双工器及应用该双路双工器的双路双工极化跟踪器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5705966A (en) * | 1996-08-02 | 1998-01-06 | I.T.-Tel Ltd. | LC-type dielectric strip line resonator |
US20070080760A1 (en) * | 2005-10-11 | 2007-04-12 | Alford James L | Printed wiring board assembly with self-compensating ground via |
-
2010
- 2010-05-04 FR FR1001908A patent/FR2959908B1/fr active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5705966A (en) * | 1996-08-02 | 1998-01-06 | I.T.-Tel Ltd. | LC-type dielectric strip line resonator |
US20070080760A1 (en) * | 2005-10-11 | 2007-04-12 | Alford James L | Printed wiring board assembly with self-compensating ground via |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013063201A1 (fr) * | 2011-10-25 | 2013-05-02 | Zih Corp. | Structures pour compensation d'erreur d'alignement |
US8933768B2 (en) | 2011-10-25 | 2015-01-13 | Zih Corp. | Structures for registration error compensation |
US9748620B2 (en) | 2011-10-25 | 2017-08-29 | Zih Corp. | Structures for registration error compensation |
EP2597722A1 (fr) * | 2011-11-24 | 2013-05-29 | Rohde & Schwarz GmbH & Co. KG | Filtre interdigital dans la technologie strip-line |
US9252469B2 (en) | 2011-11-24 | 2016-02-02 | Rohde & Schwarz Gmbh & Co. Kg | Microwave circuit in strip line technology |
Also Published As
Publication number | Publication date |
---|---|
FR2959908B1 (fr) | 2012-06-15 |
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