FR2954667B1 - Circuit imprime multicouche assemble par thermodiffusion - Google Patents

Circuit imprime multicouche assemble par thermodiffusion

Info

Publication number
FR2954667B1
FR2954667B1 FR0959098A FR0959098A FR2954667B1 FR 2954667 B1 FR2954667 B1 FR 2954667B1 FR 0959098 A FR0959098 A FR 0959098A FR 0959098 A FR0959098 A FR 0959098A FR 2954667 B1 FR2954667 B1 FR 2954667B1
Authority
FR
France
Prior art keywords
thermodiffusion
printed circuit
multilayer printed
circuit assembled
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0959098A
Other languages
English (en)
Other versions
FR2954667A1 (fr
Inventor
Le Guern Guy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0959098A priority Critical patent/FR2954667B1/fr
Publication of FR2954667A1 publication Critical patent/FR2954667A1/fr
Application granted granted Critical
Publication of FR2954667B1 publication Critical patent/FR2954667B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR0959098A 2009-12-17 2009-12-17 Circuit imprime multicouche assemble par thermodiffusion Active FR2954667B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0959098A FR2954667B1 (fr) 2009-12-17 2009-12-17 Circuit imprime multicouche assemble par thermodiffusion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0959098A FR2954667B1 (fr) 2009-12-17 2009-12-17 Circuit imprime multicouche assemble par thermodiffusion

Publications (2)

Publication Number Publication Date
FR2954667A1 FR2954667A1 (fr) 2011-06-24
FR2954667B1 true FR2954667B1 (fr) 2012-07-13

Family

ID=42272050

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0959098A Active FR2954667B1 (fr) 2009-12-17 2009-12-17 Circuit imprime multicouche assemble par thermodiffusion

Country Status (1)

Country Link
FR (1) FR2954667B1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3723236A1 (de) * 1987-07-14 1989-01-26 Hartmuth F Ing Grad Thaler Verfahren zur herstellung einer schaltungsplatte
JP2001230551A (ja) * 2000-02-14 2001-08-24 Ibiden Co Ltd プリント配線板並びに多層プリント配線板及びその製造方法

Also Published As

Publication number Publication date
FR2954667A1 (fr) 2011-06-24

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