FR2939973B1 - METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYER - Google Patents
METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYERInfo
- Publication number
- FR2939973B1 FR2939973B1 FR0858668A FR0858668A FR2939973B1 FR 2939973 B1 FR2939973 B1 FR 2939973B1 FR 0858668 A FR0858668 A FR 0858668A FR 0858668 A FR0858668 A FR 0858668A FR 2939973 B1 FR2939973 B1 FR 2939973B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- connector element
- layer
- golden layer
- manufacturing connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 229910052786 argon Inorganic materials 0.000 abstract 2
- 229910052734 helium Inorganic materials 0.000 abstract 2
- 238000010849 ion bombardment Methods 0.000 abstract 2
- 238000010884 ion-beam technique Methods 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 229910052743 krypton Inorganic materials 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 2
- 229910052724 xenon Inorganic materials 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 229910052754 neon Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Procédé de fabrication d'un élément de connecteur comprenant un substrat sur lequel est déposée une couche d'or qui comprend les étapes successives suivantes : a) approvisionnement d'un substrat (20) ; b) traitement par bombardement ionique grâce à un faisceau d'ions, d'une surface du substrat (20) où les ions sont choisis parmi He, N, Ar, Kr, Xe ; c) dépôt d'une couche d'or poreuse (10) par voie électrolytique sur la surface ainsi traitée du substrat (20) ; d) traitement par bombardement ionique grâce à un faisceau d'ions de la porosité de la couche d'or poreuse (10) où les ions sont choisis parmi He, N, Ne, Ar, Kr, Xe. Il en résulte des éléments de connecteurs aux propriétés améliorées.A method of manufacturing a connector element comprising a substrate on which is deposited a layer of gold which comprises the following successive steps: a) supplying a substrate (20); b) treatment by ion bombardment using an ion beam, of a surface of the substrate (20) where the ions are chosen from He, N, Ar, Kr, Xe; c) depositing a porous gold layer (10) electrolytically on the thus treated surface of the substrate (20); d) treatment by ion bombardment using an ion beam of the porosity of the porous gold layer (10) where the ions are chosen from He, N, Ne, Ar, Kr, Xe. This results in connector elements with improved properties.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0858668A FR2939973B1 (en) | 2008-12-16 | 2008-12-16 | METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYER |
PCT/FR2009/052545 WO2010076486A1 (en) | 2008-12-16 | 2009-12-15 | Method for manufacturing a connector element including a substrate on which a layer of gold is deposited |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0858668A FR2939973B1 (en) | 2008-12-16 | 2008-12-16 | METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYER |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2939973A1 FR2939973A1 (en) | 2010-06-18 |
FR2939973B1 true FR2939973B1 (en) | 2012-11-23 |
Family
ID=40791602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0858668A Expired - Fee Related FR2939973B1 (en) | 2008-12-16 | 2008-12-16 | METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYER |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2939973B1 (en) |
WO (1) | WO2010076486A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2982994B1 (en) * | 2011-11-21 | 2014-01-10 | Sc2N Sa | ELECTRIC CONTACT SWITCH |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0525629A (en) * | 1991-07-18 | 1993-02-02 | Tel Varian Ltd | Ion implantation device |
FR2906261B1 (en) * | 2006-09-26 | 2010-02-26 | Quertech Ingenierie | NITRIDING DEVICE BY IONIC IMPLANTATION OF A GOLD ALLOY PART AND METHOD USING SUCH A DEVICE |
FR2920785B1 (en) * | 2007-09-11 | 2010-02-26 | Quertech Ingenierie | TREATMENT OF THE POROSITY OF METALS BY ION BOMBING |
-
2008
- 2008-12-16 FR FR0858668A patent/FR2939973B1/en not_active Expired - Fee Related
-
2009
- 2009-12-15 WO PCT/FR2009/052545 patent/WO2010076486A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2010076486A1 (en) | 2010-07-08 |
FR2939973A1 (en) | 2010-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1693484A3 (en) | Plating Method | |
MY154004A (en) | Plasma immersion ion processing fro coating of hollow substrates | |
WO2008096160A3 (en) | An article and a method of surface treatment of an article | |
EP2072636A3 (en) | Method of making a coated cutting tool, and cutting tools thereof | |
EP2042261A3 (en) | Method of making a coated cutting tool | |
WO2005114692A3 (en) | In-situ process chamber preparation methods for plasma ion implantation systems | |
TW200741972A (en) | Semiconductor device and method for making the same | |
WO2007111676A3 (en) | Method of direct plating of copper on a substrate structure | |
TW200644164A (en) | Method for forming a barrier/seed layer for copper metallization | |
DE60304163D1 (en) | PREPARATION OF COATINGS BY PLASMAPOLYMERIZATION | |
TW200717709A (en) | A method for forming a ruthenium metal layer on a patterned substrate | |
WO2003076678A3 (en) | Ald method and apparatus | |
WO2008043528A3 (en) | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates | |
TW200420736A (en) | Photo mask blank, photo mask, method and apparatus for manufacturing of a photo mask blank | |
SG171631A1 (en) | A method for the manufacture of a coating | |
ATE502394T1 (en) | METHOD FOR PRODUCING SEPARABLE SUBSTRATES | |
EP2034045A3 (en) | Reduction of etch-rate drift in HDP processes | |
WO2007016218A3 (en) | Integrated electroless deposition system | |
WO2009141551A3 (en) | Electroplating composition and process for coating a semiconductor substrate using said composition | |
EA200801194A1 (en) | METHOD OF MANUFACTURING AN ENDOVASCULAR DEVICE WITH COATING | |
FR2941878B1 (en) | METHOD FOR TREATING AN ION BEAM WITH A METAL LAYER DEPOSITED ON A SUBSTRATE | |
WO2006136333A3 (en) | ELECTRODEPOSITION MATERIAL, PROCESS FOR PROVIDING A CORROSION-PROTECTIVE LAYER OF TiO2 ON AN ELECTRICALLY CONDUCTIVE SUBSTRATE AND METAL SUBSTRATE COATED WITH A LAYER OF TiO2 | |
TWI265204B (en) | Method for coating substrates in inline installations | |
FR2939973B1 (en) | METHOD FOR MANUFACTURING CONNECTOR ELEMENT COMPRISING A SUBSTRATE HAVING A GOLDEN LAYER | |
EP1837907A3 (en) | High performance semiconductor component with secondary passivation layer and associated method of manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CA | Change of address |
Effective date: 20150212 |
|
CD | Change of name or company name |
Owner name: QUERTECH, FR Effective date: 20150212 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
ST | Notification of lapse |
Effective date: 20240806 |