FR2938724B1 - Procede et dispositif de soudage selectif par thermodes pour puces electroniques - Google Patents

Procede et dispositif de soudage selectif par thermodes pour puces electroniques

Info

Publication number
FR2938724B1
FR2938724B1 FR0857861A FR0857861A FR2938724B1 FR 2938724 B1 FR2938724 B1 FR 2938724B1 FR 0857861 A FR0857861 A FR 0857861A FR 0857861 A FR0857861 A FR 0857861A FR 2938724 B1 FR2938724 B1 FR 2938724B1
Authority
FR
France
Prior art keywords
thermody
electronic chips
selective welding
selective
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0857861A
Other languages
English (en)
Other versions
FR2938724A1 (fr
Inventor
Romaric Lenoir
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR0857861A priority Critical patent/FR2938724B1/fr
Publication of FR2938724A1 publication Critical patent/FR2938724A1/fr
Application granted granted Critical
Publication of FR2938724B1 publication Critical patent/FR2938724B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
FR0857861A 2008-11-19 2008-11-19 Procede et dispositif de soudage selectif par thermodes pour puces electroniques Active FR2938724B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0857861A FR2938724B1 (fr) 2008-11-19 2008-11-19 Procede et dispositif de soudage selectif par thermodes pour puces electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0857861A FR2938724B1 (fr) 2008-11-19 2008-11-19 Procede et dispositif de soudage selectif par thermodes pour puces electroniques

Publications (2)

Publication Number Publication Date
FR2938724A1 FR2938724A1 (fr) 2010-05-21
FR2938724B1 true FR2938724B1 (fr) 2012-08-10

Family

ID=40751552

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0857861A Active FR2938724B1 (fr) 2008-11-19 2008-11-19 Procede et dispositif de soudage selectif par thermodes pour puces electroniques

Country Status (1)

Country Link
FR (1) FR2938724B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
DE3722730A1 (de) * 1987-07-09 1989-01-19 Productech Gmbh Geheizter stempel
EP0305697B1 (fr) * 1987-08-31 1992-03-11 Siemens Aktiengesellschaft Procédé de soudure d'éléments montés en surface et maintenus par une tête de soudure pouvant être temporairement mise sous vide
US4795077A (en) * 1988-05-23 1989-01-03 Motorola Inc. Bonding method and apparatus
US5113581A (en) * 1989-12-19 1992-05-19 Matsushita Electric Industrial Co., Ltd. Outer lead bonding head and method of bonding outer lead

Also Published As

Publication number Publication date
FR2938724A1 (fr) 2010-05-21

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