FR2918244B1 - FILTERING STRUCTURE ON PRINTED CIRCUIT. - Google Patents

FILTERING STRUCTURE ON PRINTED CIRCUIT. Download PDF

Info

Publication number
FR2918244B1
FR2918244B1 FR0756089A FR0756089A FR2918244B1 FR 2918244 B1 FR2918244 B1 FR 2918244B1 FR 0756089 A FR0756089 A FR 0756089A FR 0756089 A FR0756089 A FR 0756089A FR 2918244 B1 FR2918244 B1 FR 2918244B1
Authority
FR
France
Prior art keywords
track
printed circuit
affixing
inductance
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0756089A
Other languages
French (fr)
Other versions
FR2918244A1 (en
Inventor
Marc Meyer
Yannick Poire
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Group SAS
Original Assignee
European Aeronautic Defence and Space Company EADS France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by European Aeronautic Defence and Space Company EADS France filed Critical European Aeronautic Defence and Space Company EADS France
Priority to FR0756089A priority Critical patent/FR2918244B1/en
Priority to PCT/FR2008/050964 priority patent/WO2009000998A1/en
Publication of FR2918244A1 publication Critical patent/FR2918244A1/en
Application granted granted Critical
Publication of FR2918244B1 publication Critical patent/FR2918244B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

On réalise un corps (1) de circuit imprimé comportant un filtre. Une inductance est formée par apposition d'une piste (2) conductrice du corps du circuit imprimé, en regard d'un plan de masse. Cette disposition permet de réaliser une ségrégation de courant entre cette piste dite BF et une autre piste dite HF car moins inductive. En conséquence, des résistances en série avec cette piste HF et une capacité en parallèle entre cette piste HF et un plan de masse permettent de réaliser un filtrage RC. En variante, l'inductance est formée par apposition d'une ou plusieurs couches (4) de matériau magnétique répandue dans le corps, en regard de la piste, de l'autre côté de la piste par rapport à la première couche.A printed circuit body (1) comprising a filter is produced. An inductance is formed by affixing a conductive track (2) of the body of the printed circuit, facing a ground plane. This arrangement makes it possible to carry out current segregation between this so-called LF track and another so-called HF track because it is less inductive. Consequently, resistors in series with this HF track and a capacitor in parallel between this HF track and a ground plane make it possible to carry out RC filtering. As a variant, the inductance is formed by affixing one or more layers (4) of magnetic material spread in the body, facing the track, on the other side of the track relative to the first layer.

FR0756089A 2007-06-28 2007-06-28 FILTERING STRUCTURE ON PRINTED CIRCUIT. Active FR2918244B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0756089A FR2918244B1 (en) 2007-06-28 2007-06-28 FILTERING STRUCTURE ON PRINTED CIRCUIT.
PCT/FR2008/050964 WO2009000998A1 (en) 2007-06-28 2008-06-02 Filtering structure on printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0756089A FR2918244B1 (en) 2007-06-28 2007-06-28 FILTERING STRUCTURE ON PRINTED CIRCUIT.

Publications (2)

Publication Number Publication Date
FR2918244A1 FR2918244A1 (en) 2009-01-02
FR2918244B1 true FR2918244B1 (en) 2020-11-06

Family

ID=39027485

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0756089A Active FR2918244B1 (en) 2007-06-28 2007-06-28 FILTERING STRUCTURE ON PRINTED CIRCUIT.

Country Status (2)

Country Link
FR (1) FR2918244B1 (en)
WO (1) WO2009000998A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3743398B2 (en) * 2001-08-10 2006-02-08 株式会社村田製作所 Group delay flat type Bessel low pass filter, mounting structure thereof, group delay flat type Bessel low pass filter device, and optical signal receiving device
DE10139707A1 (en) * 2001-08-11 2003-02-20 Philips Corp Intellectual Pty circuit board
US7142836B2 (en) * 2003-12-01 2006-11-28 Alpha Networks Inc. Microwave filter distributed on circuit board of wireless communication product

Also Published As

Publication number Publication date
WO2009000998A1 (en) 2008-12-31
FR2918244A1 (en) 2009-01-02

Similar Documents

Publication Publication Date Title
TW200729561A (en) Luminescence device and manufacturing method of the same
TW200721211A (en) Laminated electronic component
TW200721215A (en) Monolithic capacitor
EP1699277A4 (en) Ceramic multilayer substrate
TW200802888A (en) Thin film transistor and manufacturing method thereof
WO2007084796A3 (en) Ionic polymer devices and methods of fabricating the same
TW200644005A (en) Multilayer electronic component and manufacturing method thereof
EP3799118A3 (en) Ground via clustering for crosstalk mitigation
TW200632958A (en) Multilayer capacitor
TW200601561A (en) High-performance cmos soi devices on hybrid crystal-oriented substrates
EP2819134A3 (en) Laminated chip electronic component, board for mounting the same, and packing unit thereof
KR20100068056A (en) Circuit board device and integrated circuit device
TW200726335A (en) Substrate structure with capacitance component embedded therein and method for fabricating the same
EP3062341A3 (en) Semiconductor device with an electrode structure comprising an aluminium or aluminium alloy layer with {110} texture, method of manufacturing said semiconductor device and power conversion device comprising said semiconductor device
TW200714163A (en) Ceramic multilayer substrate and process for producing the same
EP1533896A3 (en) Piezoelectric element, composite piezoelectric element, and filter, duplexer and communication equipment using the same
JP2022174322A (en) Multilayer ceramic electronic component and board having the same
WO2007121412A3 (en) Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same
JPH03215915A (en) Laminated capacitor
TW200701411A (en) Semiconductor device and unit equipped with the same
FR2993713A1 (en) MICROELECTRONIC COMPONENTS, SUITABLE FOR CIRCULATING A RADIO FREQUENCY OR HYPERFREQUENCY SIGNAL IN A SINGLE DIRECTION
FR2918244B1 (en) FILTERING STRUCTURE ON PRINTED CIRCUIT.
DE602007007470D1 (en) MULTILAYER MODULE WITH HOUSING
WO2008149808A1 (en) Switch circuit and semiconductor integrated circuit
CA2396271A1 (en) A capacitor element for a power capacitor, a power capacitor comprising such element and a metallized film for a power capacitor

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17