FR2913973A1 - Glass transparent substrate for e.g. plasma screen, has mixed layer placed between glass substrate and electro-conductive layer, where mixed layer contains nitrides or oxinitride, or oxides or oxicarbide forming layer at doped state - Google Patents

Abstract

The substrate has a mixed layer provided between a glass substrate and a transparent electro-conductive layer, where the mixed layer contains nitrides or oxinitride, or oxides or oxicarbide having good glass adhesion properties, and other nitrides or oxinitride, or oxides or oxicarbide capable of forming a transparent electro-conductive layer at a doped state. An independent claim is also included for a method for manufacturing a glass transparent substrate.

Description

LAYER-COATED GLASS SUBSTRATE WITH IMPROVED MECHANICAL STRENGTH

  The invention relates to transparent conductive layers, in particular based on oxides, of great interest on a glass substrate. Examples are ITO (indium tin oxide) layers of tin doped indium oxide, SnO2: F layers of fluorine doped tin oxide. Such layers constitute electrodes in certain applications: flat lamps, electroluminescent glazing, electrochromic glazing, liquid crystal display screen, plasma screen, photovoltaic glazing, heated glasses. In other applications for low-emissive glazings, for example, these transparent conductive layers do not have to be activated by a power-up. In the prior art, these transparent conductive layers are generally associated with an underlayer to improve the optical properties of a layer or stack of transparent conductive layers on a glass substrate. Without being exhaustive, mention may in particular be made of EP 611 733 by PPG, which proposes a mixed gradient layer of silicon oxide and tin oxide to avoid the iridescence effects induced by the transparent conductive oxide layer. tin doped with fluorine. The patents of Gordon Roy FR 2 419 335 also propose a variant of this underlayer for improving the color properties of a conductive transparent layer of fluorine-doped tin oxide. The precursors mentioned in this patent are on the other hand unusable on an industrial scale. SAINT-GOBAIN also has know-how in this field: the patent FR 2,736,632 thus proposes a mixed sub-layer with inverse index gradient of silicon oxide and tin oxide as anti-backing layer. color of a conductive transparent layer of fluorine doped tin oxide. On the other hand, there has been a tendency for transparent glass conductive oxide layers to delaminate in the photovoltaic cells or all the active applications mentioned above. A characterization test of this phenomenon consists in subjecting the glass and its electrode during for example 10 minutes to the joint action of electric fields of the order of 200 V for example, on both sides of the glass, and temperatures about 200 C. The action of an electric field at these temperatures induced for the duration of the test a total of electrical charges displaced from 1 to 8 mC / cm 2 according to the electrical resistivity values of the glass at the test temperature. These delaminations are also observed with the sub-layers mentioned in the prior art. Such delaminations are also observed in the case of curved glasses. These delaminations are undetectable by a man who is not of the profession if the glasses thus coated are not traversed by an electric current. On the other hand, in the case of applications where the glass thus coated is traversed by an electric current, as is the case for a heating glass for example, then the presence of these delaminations removes the functionality. In order to solve the problems of delamination of the transparent conducting oxide layers deposited on a glass substrate, the inventors have developed an underlayer connecting a glass substrate to a transparent conductive oxide layer considerably improving adhesion of the latter, especially under conditions of putting the whole of the electric field and relatively high temperatures, greater than 100 or 150 C, or especially when the glass is formed (curved and / or tempered). The subject of the invention is therefore a glass transparent substrate, associated with a transparent electroconductive layer constituting an electrode, in particular a photovoltaic cell and composed of a doped oxide, characterized by the interposition, between the glass substrate and the transparent electroconductive layer, a mixed layer of one or more first nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) having good adhesion properties with the glass, and a or a plurality of second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) likely to constitute, optionally in the doped state, a transparent electroconductive layer. Thus, the invention makes it possible to obtain suitable layer stacks for photovoltaic cells whose mechanical strength on a glass substrate is not affected in the presence of an electric field and at high temperature. This considerable improvement can be obtained for large glass surfaces (PLF - full-width float), since deposition methods compatible with such dimensions are available for the layers concerned. This satisfactory mechanical strength is also observed after quenching and bending treatment, including radii of curvature as small as 200 mm. Thus, the transparent electroconductive layer of the substrate of the invention is not only able to constitute a photovoltaic cell electrode, but also a coating having excellent adhesion to tempered and / or curved glass. By way of example, a low-emissive coating is mentioned, in particular on the face of a glazing turned towards the interior of a building in order to reflect and conserve the ambient heat. In the alternative, the mixed underlayer may not be a barrier for the migration of alkali from the glass to the transparent conductive layer. It is advantageously sparse to allow passage to alkaline glass and itself conductive. In a subsidiary manner, the transparent substrate of the invention has improved optical properties compared to transparent electroconductive layers on a glass substrate: reduced iridescence, more uniform reflection coloration. According to two preferred embodiments of the substrate of the invention: said mixed layer has a compositional gradient in the direction of a decreasing proportion of the first nitride (s) or oxynit (s), or oxide (s); ) or oxycarbide (s) at increasing distance from the glass substrate; said mixed layer has a composition gradient in the direction of an increasing proportion of the first nitride (s) or oxynit (s) or oxide (s) or oxycarbide (s) at increasing distance from the substrate; glass. Advantageously, the substrate of the invention is characterized in that its mechanical strength is not affected within 24 hours after a treatment of at least 10 minutes, preferably 20 minutes, with an electric field of at least 100 V, preferably 200 V on either side of the substrate, and a temperature of at least 200 C, inducing a displacement of electric charges of at least 2 mC / cm 2, preferably 8 mC / cm 2 according to electrical resistivity values of the glass substrate at the test temperature. By mechanical strength, it is meant that the stack or part of the stack does not delaminate.

  According to other characteristics of the substrate of the invention: the stacking of said mixed layer with said transparent electroconductive layer has a blur at most equal to 30%, said mixed layer has at its interface with said transparent electroconductive layer a surface consisting of rods oriented randomly, lengths of 10 to 50 nm, diameters of 5 to 20 nm, forming a roughness rms of 10 to 50 nm, and causing an increase in the blurring of the complete stack of 5 to 10 With respect to the same stack of said mixed layer with said transparent electroconductive layer where the first named has a smooth surface in the photovoltaic application, a high blur is sought for a light transmission (visible transmission weighted by the curve sensitivity of the human eye to ISO 9050) of at least 75%, preferably 80%, a square resistance, Ru, defined as the electrical resistance measured across two linear electrodes, parallel, of the same length L, and distant from this length L, these two electrodes being in electrical contact along their entire length with the electroconductive surface of the substrate, between 5 and 1000 0, - absorption in the visible and near infrared at most equal to 10%. According to other characteristics of the invention, and especially when the vision through the glass is essential: the stack of said mixed layer to said transparent electroconductive layer has a blur of less than 5%, preferably less than 1% ; a light transmission of at least 80%; A resistance per square, Ru, of between 10 and 1000 °; a color in neutral reflection and in all cases homogeneous. Preferably, said first nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) are chosen from nitrides or oxynitrides, or oxides or oxycarbides of Si, Al and Ti, especially SiO2, TiO2 and Al2O3; the one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) are chosen from nitrides or oxynitrides, or oxides or oxycarbides of Sn, Zn and In, in particular SnO2, ZnO and InO; said transparent electroconductive layer is composed of a doped Sn, Zn or In oxide such as SnO 2: F, SnO 2: Sb, ZnO: Al, ZnO: Ga, InO: Sn or ZnO: In. In view of the process for obtaining the preferred mixed layer within the scope of the invention, and described in more detail hereinafter, said mixed layer is electrically conductive, and non-insulating, and in particular has resistance to square at most equal to 100,000 C2, preferably 100000; At a molar ratio F / Sn at least equal to 0.01, preferably 0.05. In accordance with embodiments providing an optimal combination of the desired mechanical strength and the optical properties of the substrate, the thickness of said mixed layer is between 20 and 500 nm, preferably between 50 and 300 nm; the face of said mixed layer located on the side of the glass substrate consists exclusively of a thickness of 2 to 20 nm, of one or more first nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s), which promotes the adhesion of the mixed layer to the glass; The face of said mixed layer situated on the side opposite to that of the glass substrate consists exclusively of a thickness of 2 to 20 nm of one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s), which promotes the adhesion of the mixed layer to its coating of similar composition, such as said transparent electroconductive layer 30. According to a first variant, said transparent electroconductive layer composed of a doped oxide, is connected to said mixed layer with the interposition of a layer of the same undoped oxide, the cumulative thickness of the two layers of the undoped oxide and the doped oxide being between 700 and 2000 nm, and the ratio of the thicknesses of the two layers being between 1: 4 and 4: 1. The doped oxide layer may be coated with a layer of plasma-supported CVD-deposited microcrystalline silicon (PECVD) to form a photovoltaic cell. The two undoped oxide and doped oxide layers advantageously have an RMS roughness of 20 ± 40 nm. Indeed silicon absorbs relatively little light. The roughness of the underlying layers makes them diffusing and thus lengthens the path of light in the active silicon layer, ensuring a sufficient number of electron-hole pairs therein, and effective light entrapment. According to a second variant, said transparent electroconductive layer with a thickness of between 300 and 600 nm, composed of a doped oxide, is formed directly on said mixed layer. The doped oxide layer may be covered with a cadmium-tellurium layer to form a photovoltaic cell. In a preferred embodiment of the substrate of the invention, said transparent electroconductive layer composed of a doped oxide is coated with a protective layer vis-à-vis the deposition of constituent coatings of a photovoltaic cell, including deposition by PECVD a layer such as silicon, or a layer increasing the quantum efficiency of the photovoltaic cell, such as zinc oxide or titanium oxide. According to an advantageous embodiment of the invention, one of the faces of the substrate - in particular the glass face opposite to that carrying said mixed layer - is coated with a stack providing a function of the anti-reflection or hydrophobic type or photocatalytic. On the other hand, said mixed layer may comprise grains of one or more first nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s), mixed with grains of one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s). An example is a mixed layer comprising SiO 2 grains mixed with SnO 2 grains. In this case, the continuous composition gradient means a regular decrease in the proportion of SiO 2 grains relative to those of SnO 2 for example throughout the thickness of the mixed layer at increasing distance from the glass substrate. This regular decay does not exclude a decrease in steps or steps, or the presence of two separate zones and nested one in the other (like pieces of a puzzle) with exclusive contents in one only one or more of said first (s) or second (s) nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s). Said mixed layer may also comprise, additionally or alternatively, mixed grains of one or more first nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s), and of one or more second (s) nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s). An example is a mixed layer comprising the elements Si, Sn, Al and O. In accordance with the two preceding variants, the sizes of said grains determined by observation with a transmission electron microscope are between 10 and 80 nm, preferably 20 and 50. nm. The subject of the invention is also a process for manufacturing a substrate 15 in which said mixed layer is obtained by vapor phase chemical deposition resulting from the contacting of precursors of said first and second (s) and second (s) nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s) with the substrate in the presence of at least one fluorine compound, such as tetrafluoromethane (CF4), octafluoropropane (C3F8), hexafluoroethane (C2F6), hydrogen fluoride (HF), difluoro-chloromethane (CHCIF2), difluoro-chloroethane (CH3CCIF2), trifluoromethane (CHF3), dichlorodifluoromethane (CF2Cl2), trifluoromethane chloromethane (CF3Cl), trifluorobromomethane (CF3Br), trifluoroacetic acid (TFA, CF30OOH), nitrogen trifluoride (NF3). The fluorine compound accelerates the deposition of the first nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s), in particular SiO 2 -, relative to that of the second (s) such as SnO2. As precursor of SiO 2: tetraethoxysilane (TEOS), hexamethyldisiloxane (HMDSO), silane (SiH4); As SnO2 precursor: monobutyltin trichloride (MBTCI), dibutyltin diacetate (DBTA), tin tetrachloride (SnCl4). According to a first route, said mixed layer is obtained by implementing a chemical vapor deposition (CVD for Chemical Vapor Deposition) assisted by plasma (PE CVD for Plasma Enhanced CVD), in particular plasma at atmospheric pressure (AP PECVD for Atmospheric Pressure PECVD); the temperature of the substrate is then advantageously at most equal to 300 C.

  According to a second route, said mixed layer is obtained at a substrate temperature of at least 500 ° C., preferably at least 600 ° C., and particularly preferably at least 650 ° C. According to another preferred embodiment of this method, method, said mixed layer is obtained in the presence of auxiliary agents for controlling the relative deposition rates of the said first (s) and second (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s). Thus, the use of a mixture of precursors of SiO 2 and SnO 2 in thermal CVD can lead to the deposition of SiO 2 alone in the absence of O 2, or of SnO 2 alone with a sufficient amount of O 2, all intermediate situations being possible. also be obtained. Other compounds, including fluorine, phosphorus, boron, are also available to increase the rate of SiO2 deposition relative to that of SnO2 during formation of the mixed layer. It is not sufficient for these compounds to be Lewis acids. This invention advantageously utilizes fluorine not only to accelerate the rate of SiO 2 deposition with respect to that of SnO 2 during formation of the mixed layer, but also to dope the underlayer and render it itself conductive. The electrical conduction of the sub-layer contributes to improving the mechanical strength of the stack, in particular under the effect of an electric field. The invention furthermore has for object: a photovoltaic cell comprising a substrate described above; a tempered and / or curved glass having a radius of curvature at most equal to 2000 mm, preferably at most equal to 500 mm and particularly preferably at most equal to 300 mm, comprising a substrate according to the invention; the mechanical strength of the layers deposited on this glass is excellent; a shaped heating glass comprising a substrate as described above; 5 - a plasma screen (PDP for Plasma Display Panel) comprising a substrate according to the invention; a flat lamp electrode comprising such a substrate. The invention is illustrated by the following examples. Example 1: Deposition of SiOSn doped with fluorine in a static thermal reactor CVD

  Substrate = glass of 4 mm, dimensions 10 x 20 cm2 io MBTCI = 0.4% vol. TEOS = 1.6% vol. 02 = 10% vol. TFA = 0.5% vol. Glass substrate temperature (planilux 2 mm) = 650 C 15 Total N2 flow rate = 1.5 I / min

  The following stack is obtained: Glass / SiO 2 (10 nm) / mixed SiO 2 gradient SiO 2 to SnO 2 / SnO 2 (10 nm) / SiO 2 (10 nm) TFA = 0.5% vol. CH30OOH = 0.5% vol. under the conditions above under the conditions above Obtaining a mixed layer YES NO SiOSn Example 2: Deposition of doped SiOSn fluorine / undoped SnO2 / fluorine-doped SnO2, carried out dynamically in a thermal CVD reactor at Atmospheric pressure Substrate = 4 mm extra-clear glass, dimensions 100 x 60 cm 2 In a first pass: MBTCI = 0.3 mol / min TEOS = 0.36 mol / min O 2 = 13% vol.

  TFA = 0.19 mol / min H2O = 2.3 mol / min Glass substrate temperature (Diamond, 4 mm) = 650 C Total N2 flow = 1625 N / min (NI = Normoliter = liter under 1 atm and 25 C Glass speed = 10 m / min. In a second pass: MBTCI = 0.95 mol / min 02 = 20% vol. H2O = 3.7 mol / min 15 Glass substrate temperature = 650 C Total N2 flow = 1600 N / min Scroll speed = 10 m / min

  In a third passage: 20 MBTCI = 0.47 mol / min O 2 = 20% vol. TFA = 1.85 mol / min H2O = 0.88 mol / min Glass substrate temperature = 650 C 25 Total N2 flow rate = 1600 N / min Scroll speed = 10 m / min

  The following stack is obtained: Glass / SiO 2 / SiOSn mixed fluorine doped fluorine-doped gradient / SnO 2 / SnO 2, as shown by the SIMS profile tracking of the constituent elements of the stack. A Transmission Electron Microscopy / Energy Dispersive X-Ray (TEMIEDX) analysis shows that the fluorine-doped SiOSn layer has an increasing proportion of Si relative to Sn at increasing distance from the glass substrate. In a mechanical strength test where a sample of 5 cm x 5 cm is subjected to a treatment of 10 minutes by an electric field of 200 V on both sides of the substrate, and a temperature of 200 C, the layer is not affected in the 24 hours following the treatment, unlike the same layer where the first deposition pass has not been made. This treatment induces a displacement of electric charges of 4 mC / cm 2 according to the resistivity value of the glass at 200 ° C. of the order of 7 × 10 50 μm. This solution is compared with a less efficient solution in which the mixed layer is produced in the same manner but without the addition of fluorinated dopant. Present solution Solution of the invention Solution of the invention Glass / SiOC / SnO 2: -1 -2 F Glass / SiOSn / SnO 2: F Glass / SiOSn: F / SnO 2: F Delamination YES NO, but the layer NO, the layer observed with delamine in delamina plus treatment described days later than the above at the treatment solution of the tip of the previous 24 hours Example 3: Deposition of Si-O-Sn carried out dynamically in a reactor of Thermal CVD at atmospheric pressure

  Substrate = Planilux Saint-Gobain glass of 4 mm

  First pass: TEOS bubbler, bubbler temperature 80 C, nitrogen bubbler flow 175 NI / min MBTCI = 5 kg / h 02 = 15% vol. TFA = 1.5 kg / h H2O = 2.5 kg / h Glass substrate temperature = 650 C Total N2 flow rate = 1500 N / min Travel speed = 10 m / min In a second pass: MBTCI = 35 kg / h 02 = 20% vol. TFA = 9 kg / h H2O = 9 kg / h Glass substrate temperature = 650 C Total N2 flow = 1600 N / min. Scroll speed = 10 m / min A 78% light transmittance, resistance strength layer is obtained. square equal to 10 ohms, and blur equal to 4%. It has been possible to achieve with such underlays curvatures approximately 4 times greater than the same layer without underlayer. Current solution: Solution of the invention: Glass / SnO2: F Glass / SiOSn: F / SnO2: F 1 ¼ curvature radius normalized to the minimum value of the current solution of the state of the art Example 4 : Dynamic Ti-O-Sn deposition in a thermal CVD reactor at atmospheric pressure

  Substrate: Planilux Saint-Gobain 4 mm glass In a single pass: In a slot upstream of the main injection slit: TiPT bubbler, bubbler temperature 50 C, nitrogen bubbler flow rate 125 N / min, nitrogen dilution flow 375 NI / min.

  In the main injection slot: MBTCI = 15 kg / h 02 = 20% vol. TFA = 7.5 kg / h H2O = 3.7 kg / h Glass substrate temperature = 650 C Total N2 flow = 1000 N / min Scroll speed = 4 m / min The order of arrival of the precursors implies a Glide / TiO2 / Ti-O-Sn mixed dopant fluorinated gradient / fluorinated doped SnO2 stack. The resulting layer is 10 ohms squared, 80% light transmission, 1.5% blur. It has been possible to achieve with such sub-layers radii of curvature approximately 2 times lower than those of the same layer without underlayer, without observing delamination. Current solution: Solution of the invention: Glass / SnO2: F Glass / TiOSn: F / SnO2: F 1 1/2 curvature radius normalized to the minimum value of the current solution Example 5: Deposition of Si-O-Sn achieved in dynamics in a plasma reactor at atmospheric pressure

  Flow rate N2: 200 I / min TEOS: 45 sccm SnCl4: 5 sccm 25 H2 (diluted to 5% in N2): 2000 sccm Plasma power: 2 W / cm 2 with a pulse type feed. The discharge regime is homogeneous.

Glass temperature: 150 C.

  The deposited layer is amorphous SiOSn type, and has a gradient such that the concentration of tin is higher on the surface. The deposition rate of this layer is equal to 200 nm / min. On a scale of 1 to 5, the holding in the photovoltaic test is equal to 4 (the layer is the test but eventually delaminate either after 24 hours or very weakly before 24 hours). By photovoltaic test is meant a treatment of 10 minutes by an electric field of 200 V on either side of the substrate, and a temperature of 200 C: the delamination or not of the layer is observed within 24 hours after the treatment. 14

Claims (35)

  1. Transparent glass substrate, associated with a transparent electroconductive layer constituting an electrode and composed of a doped oxide, characterized by the interposition, between the glass substrate and the transparent electroconductive layer, of a mixed layer of one or more first layers. (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) having good adhesion properties with glass, and one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) likely (s) to constitute, optionally in the doped state, a transparent electroconductive layer.   2. Substrate according to claim 1, characterized in that said mixed layer has a composition gradient in the direction of a decreasing proportion of the first nitride (s) or oxynit (s), or oxide (s) or oxycarbide (s) at increasing distance from the glass substrate.   3. Substrate according to claim 1, characterized in that said mixed layer has a composition gradient in the direction of an increasing proportion of the first nitride (s) or oxynit (s), or oxide (s). or oxycarbide (s) at increasing distance from the glass substrate.   4. Substrate according to one of the preceding claims, the mechanical strength of which is not affected within 24 hours after a treatment of at least 10 minutes, preferably 20 minutes, with an electric field of at least 100 V, preferably 200 V on either side of the substrate, and a temperature of at least 200 C, inducing a displacement of electric charges of at least 2 mC / cm 2, preferably 8 mC / cm 2, according to the values of electrical resistivity of the glass substrate at the test temperature.   5. Substrate according to one of the preceding claims, characterized in that the stack of said mixed layer to said transparent electroconductive layer has a blur at most equal to 30%.   6. Substrate according to one of the preceding claims, characterized in that said mixed layer has at its interface with said transparent electroconductive layer a surface consisting of rods oriented randomly, lengths of 10 to 50 nm, diameters of 5 to 20 nm. nm, forming a rms roughness of 10 to 50 nm, and causing an increase in the blurring of the complete stack by 5 to 10% with respect to the same stack of said mixed layer to said transparent electroconductive layer where the first named has a smooth surface .   7. Substrate according to one of the preceding claims, characterized in that the stack of said mixed layer to said transparent electroconductive layer has a light transmission at least equal to 75%, preferably 80%.   8. Substrate according to one of the preceding claims, characterized in that the stack of said mixed layer to said transparent electroconductive layer has a resistance per square, Ru, between 5 and 1000 0.   9. Substrate according to one of the preceding claims, characterized in that the stack of said mixed layer to said transparent electroconductive layer has an absorption in the visible and near infrared at most equal to 10%.   10. Substrate according to one of the preceding claims, characterized in that the or said first (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) are chosen from nitrides or oxynitrides, or oxides or oxycarbides of Si, Al and Ti, especially SiO2, TiO2 and Al2O3.   11. Substrate according to one of the preceding claims, characterized in that the second (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) are chosen from nitrides or oxynitrides, or oxides or oxycarbides of Sn, Zn and In, especially SnO2, ZnO and InO.   12. Substrate according to one of the preceding claims, characterized in that said transparent electroconductive layer is composed of an oxide doped Sn, Zn or ln, such as SnO2: F, SnO2: Sb, ZnO: Al, ZnO: Ga , InO: Sn or ZnO: In.   13. Substrate according to one of the preceding claims, characterized in that said mixed layer has a resistance per square at most equal to 100,000 0, preferably at most equal to 10,000 0.   14. Substrate according to one of the preceding claims, characterized in that said mixed layer has a F / Sn molar ratio at least equal to 0.01, preferably 0.05.   15. Substrate according to one of the preceding claims, characterized in that the thickness of said mixed layer is between 20 and 500 nm, preferably between 50 and 300 nm.   16. Substrate according to one of the preceding claims, characterized in that the face of said mixed layer located on the side of the glass substrate is exclusively composed of a thickness of 2 to 20 nm, one or more io first (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s).   17. Substrate according to one of the preceding claims, characterized in that the face of said mixed layer located on the opposite side to that of the glass substrate consists exclusively of a thickness of 2 to 20 nm of one or more second (s). nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s).   18. Substrate according to one of the preceding claims, characterized in that said transparent electroconductive layer composed of a doped oxide, is connected to said mixed layer with interposition of a layer of the same undoped oxide, the cumulative thickness of both the undoped oxide and doped oxide layers being between 700 and 2000 nm, and the ratio of the thicknesses of the two layers being between 1: 4 and 4: 1.   19. Substrate according to one of claims 1 to 15, characterized in that said transparent electroconductive layer composed of a doped oxide, having a thickness of between 300 and 600 nm, is formed directly on said mixed layer.   20. Substrate according to one of the preceding claims, characterized in that said transparent electroconductive layer composed of a doped oxide is coated with a layer protecting it vis-à-vis the deposition of constituent coatings of a photovoltaic cell, or a layer increasing the quantum efficiency of the latter, such as zinc oxide or titanium oxide.   21. Substrate according to one of the preceding claims, characterized in that one of the faces of the substrate is coated with a stack providing a feature of the anti-reflective or hydrophobic or photocatalytic type.   22. Substrate according to one of the preceding claims, characterized in that said mixed layer comprises grains of one or more first nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s), in admixture with grains of one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s).   23. Substrate according to one of the preceding claims, characterized in that said mixed layer comprises mixed grains of one or more first nitride (s) or oxynitride (s) or oxide (s) or oxycarbide (s). ), and one or more second nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s).   24. Substrate according to one of claims 22 or 23, characterized in that the sizes of said grains determined by observation with a transmission electron microscope are between 10 and 80 nm, preferably 20 and 50 nm.   25. A method of manufacturing a substrate according to one of the preceding claims, characterized in that said mixed layer is obtained by vapor phase chemical deposition resulting from the contacting of precursors of said first (s) and second (s) nitride (s) or oxynitride (s), or oxide (s) or oxycarbide (s) with the substrate in the presence of at least one fluorine compound.   26. The method of claim 25, characterized in that said mixed layer is obtained by implementing a plasma-assisted chemical vapor deposition, in particular plasma at atmospheric pressure.   27. The method of claim 26, characterized in that said mixed layer is obtained at a substrate temperature at most equal to 300 C.   28. Process according to claim 25, characterized in that said mixed layer is obtained at a substrate temperature of at least 500 ° C., preferably at least 600 ° C., and particularly preferably at least 650 ° C. .   29. Process according to at least one of claims 25 to 28, characterized in that said mixed layer is obtained in the presence of auxiliary agents for controlling the relative deposition velocities of said first and second nitride (s). s) or oxynitride (s), or oxide (s) or oxycarbide (s).   30. Method according to one of claims 25 to 29, characterized in that said at least one fluorine compound is selected from tetrafluoromethane (CF4), octafluoropropane (C3F8), hexafluoroethane (C2F6), fluoride d hydrogen (HF), difluoro-chloro-methane (CHCIF2), difluoro-chloroethane (CH3CCIF2), trifluoromethane (CHF3), dichloro-difluoromethane (CF2Cl2), trifluoro-chloromethane (CF3Cl), trifluoro-bromomethane (CF3Br), trifluoroacetic acid (TFA, CF30OOH), nitrogen trifluoride (NF3).   31. Photovoltaic cell comprising a substrate according to one of claims 1 to 24.   32. Tempered and / or curved glass with a radius of curvature at most equal to 2000 mm, preferably at most equal to 500 mm and particularly preferably at most equal to 300 mm, comprising a substrate according to one of claims 1 to 24.   33. Shaped heating glass, comprising a substrate according to one of claims 1 to 24.   34. Plasma screen comprising a substrate according to one of claims 1 to 24.   35. Flat lamp electrode comprising a substrate according to one of claims 1 to 24.