FR2909833B1 - METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT - Google Patents

METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT

Info

Publication number
FR2909833B1
FR2909833B1 FR0610726A FR0610726A FR2909833B1 FR 2909833 B1 FR2909833 B1 FR 2909833B1 FR 0610726 A FR0610726 A FR 0610726A FR 0610726 A FR0610726 A FR 0610726A FR 2909833 B1 FR2909833 B1 FR 2909833B1
Authority
FR
France
Prior art keywords
making
printed circuit
multilayer printed
multilayer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0610726A
Other languages
French (fr)
Other versions
FR2909833A1 (en
Inventor
Diouron Joel Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0610726A priority Critical patent/FR2909833B1/en
Publication of FR2909833A1 publication Critical patent/FR2909833A1/en
Application granted granted Critical
Publication of FR2909833B1 publication Critical patent/FR2909833B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
FR0610726A 2006-12-08 2006-12-08 METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT Active FR2909833B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0610726A FR2909833B1 (en) 2006-12-08 2006-12-08 METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0610726A FR2909833B1 (en) 2006-12-08 2006-12-08 METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT

Publications (2)

Publication Number Publication Date
FR2909833A1 FR2909833A1 (en) 2008-06-13
FR2909833B1 true FR2909833B1 (en) 2009-01-23

Family

ID=38197836

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0610726A Active FR2909833B1 (en) 2006-12-08 2006-12-08 METHOD FOR MAKING A MULTILAYER PRINTED CIRCUIT

Country Status (1)

Country Link
FR (1) FR2909833B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117479412A (en) * 2022-08-29 2024-01-30 中兴通讯股份有限公司 Printed circuit board, electronic device and preparation method of printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699613A (en) * 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
DE19827089A1 (en) * 1998-06-18 2000-01-05 Diehl Stiftung & Co Multilayer circuit structure with double-sided SMD assembly
JP3838800B2 (en) * 1998-12-15 2006-10-25 富士通株式会社 Multilayer printed wiring board manufacturing method
WO2006089255A2 (en) * 2005-02-17 2006-08-24 Sanmina-Sci Corporation High aspect ratio plated through holes in a printed circuit board

Also Published As

Publication number Publication date
FR2909833A1 (en) 2008-06-13

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