FR2895567B1 - Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe - Google Patents

Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe

Info

Publication number
FR2895567B1
FR2895567B1 FR0513197A FR0513197A FR2895567B1 FR 2895567 B1 FR2895567 B1 FR 2895567B1 FR 0513197 A FR0513197 A FR 0513197A FR 0513197 A FR0513197 A FR 0513197A FR 2895567 B1 FR2895567 B1 FR 2895567B1
Authority
FR
France
Prior art keywords
picots
micro component
interconnection method
plates interconnected
associated interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0513197A
Other languages
English (en)
Other versions
FR2895567A1 (fr
Inventor
Jean Brun
Francois Baleras
Jean Louis Pornin
Lydie Mathieu
Dubois Beatrice Bonvalot
Julien Roumegoux
Frederic Depoutot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Axalto SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Axalto SA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0513197A priority Critical patent/FR2895567B1/fr
Priority to PCT/IB2006/003741 priority patent/WO2007072202A1/fr
Priority to EP06831789A priority patent/EP1964173A1/fr
Publication of FR2895567A1 publication Critical patent/FR2895567A1/fr
Application granted granted Critical
Publication of FR2895567B1 publication Critical patent/FR2895567B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
FR0513197A 2005-12-22 2005-12-22 Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe Expired - Fee Related FR2895567B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0513197A FR2895567B1 (fr) 2005-12-22 2005-12-22 Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe
PCT/IB2006/003741 WO2007072202A1 (fr) 2005-12-22 2006-12-19 Microcomposant comprenant deux tranches interconnectees par des broches et procede associe d'interconnexion
EP06831789A EP1964173A1 (fr) 2005-12-22 2006-12-19 Microcomposant comprenant deux tranches interconnectees par des broches et procede associe d'interconnexion

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FR2895567B1 true FR2895567B1 (fr) 2008-07-11

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FR2932004B1 (fr) * 2008-06-03 2011-08-05 Commissariat Energie Atomique Dispositif electronique empile et procede de realisation d'un tel dispositif electronique
DE102009013826A1 (de) * 2009-03-18 2011-03-10 Michalk, Manfred, Dr. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module
WO2018145968A1 (fr) * 2017-02-09 2018-08-16 Siemens Aktiengesellschaft Module de puissance

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US5411400A (en) * 1992-09-28 1995-05-02 Motorola, Inc. Interconnect system for a semiconductor chip and a substrate
US6130148A (en) * 1997-12-12 2000-10-10 Farnworth; Warren M. Interconnect for semiconductor components and method of fabrication
JP2001007473A (ja) * 1999-06-17 2001-01-12 Nec Corp 集積回路素子の実装構造および方法
US6297063B1 (en) * 1999-10-25 2001-10-02 Agere Systems Guardian Corp. In-situ nano-interconnected circuit devices and method for making the same

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WO2007072202A1 (fr) 2007-06-28
EP1964173A1 (fr) 2008-09-03
FR2895567A1 (fr) 2007-06-29

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