FR2883782B1 - METHOD AND DEVICE FOR CONTROLLING THE POWER TRANSMITTED BY A LASER BEAM AT A REFERENCE POINT, BRAZING DEVICE AND METHOD - Google Patents
METHOD AND DEVICE FOR CONTROLLING THE POWER TRANSMITTED BY A LASER BEAM AT A REFERENCE POINT, BRAZING DEVICE AND METHODInfo
- Publication number
- FR2883782B1 FR2883782B1 FR0503233A FR0503233A FR2883782B1 FR 2883782 B1 FR2883782 B1 FR 2883782B1 FR 0503233 A FR0503233 A FR 0503233A FR 0503233 A FR0503233 A FR 0503233A FR 2883782 B1 FR2883782 B1 FR 2883782B1
- Authority
- FR
- France
- Prior art keywords
- controlling
- laser beam
- reference point
- power transmitted
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 2
- 238000005219 brazing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0503233A FR2883782B1 (en) | 2005-04-01 | 2005-04-01 | METHOD AND DEVICE FOR CONTROLLING THE POWER TRANSMITTED BY A LASER BEAM AT A REFERENCE POINT, BRAZING DEVICE AND METHOD |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0503233A FR2883782B1 (en) | 2005-04-01 | 2005-04-01 | METHOD AND DEVICE FOR CONTROLLING THE POWER TRANSMITTED BY A LASER BEAM AT A REFERENCE POINT, BRAZING DEVICE AND METHOD |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2883782A1 FR2883782A1 (en) | 2006-10-06 |
FR2883782B1 true FR2883782B1 (en) | 2008-10-10 |
Family
ID=35385487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0503233A Expired - Fee Related FR2883782B1 (en) | 2005-04-01 | 2005-04-01 | METHOD AND DEVICE FOR CONTROLLING THE POWER TRANSMITTED BY A LASER BEAM AT A REFERENCE POINT, BRAZING DEVICE AND METHOD |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2883782B1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1250847A (en) * | 1969-03-06 | 1971-10-20 | ||
US4684796A (en) * | 1983-07-08 | 1987-08-04 | The Charles Stark Draper Laboratory, Inc. | Common optical aperture laser separator for reciprocal path optical |
DE3820848A1 (en) * | 1987-09-23 | 1989-04-13 | Fraunhofer Ges Forschung | Method and arrangement for joining workpieces by means of laser radiation |
US4930901A (en) * | 1988-12-23 | 1990-06-05 | Electro Scientific Industries, Inc. | Method of and apparatus for modulating a laser beam |
US6339604B1 (en) * | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
JP2004170930A (en) * | 2002-10-31 | 2004-06-17 | Olympus Corp | Microdissection apparatus and method |
-
2005
- 2005-04-01 FR FR0503233A patent/FR2883782B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2883782A1 (en) | 2006-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
ST | Notification of lapse |
Effective date: 20231205 |