FR2880185B1 - PROCESS FOR PROCESSING A WAFER SURFACE - Google Patents
PROCESS FOR PROCESSING A WAFER SURFACEInfo
- Publication number
- FR2880185B1 FR2880185B1 FR0413922A FR0413922A FR2880185B1 FR 2880185 B1 FR2880185 B1 FR 2880185B1 FR 0413922 A FR0413922 A FR 0413922A FR 0413922 A FR0413922 A FR 0413922A FR 2880185 B1 FR2880185 B1 FR 2880185B1
- Authority
- FR
- France
- Prior art keywords
- processing
- wafer surface
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0413922A FR2880185B1 (en) | 2004-12-24 | 2004-12-24 | PROCESS FOR PROCESSING A WAFER SURFACE |
US11/145,455 US7919391B2 (en) | 2004-12-24 | 2005-06-02 | Methods for preparing a bonding surface of a semiconductor wafer |
PCT/EP2005/057003 WO2006069945A1 (en) | 2004-12-24 | 2005-12-21 | Method for treating the surface of a wafer |
KR1020077014457A KR100884672B1 (en) | 2004-12-24 | 2005-12-21 | Method for treating the surface of a wafer |
EP05823924A EP1829099A1 (en) | 2004-12-24 | 2005-12-21 | Method for treating the surface of a wafer |
JP2007547504A JP2008526006A (en) | 2004-12-24 | 2005-12-21 | Wafer surface processing method |
TW094145970A TWI333258B (en) | 2004-12-24 | 2005-12-23 | A method of treating a wafer surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0413922A FR2880185B1 (en) | 2004-12-24 | 2004-12-24 | PROCESS FOR PROCESSING A WAFER SURFACE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2880185A1 FR2880185A1 (en) | 2006-06-30 |
FR2880185B1 true FR2880185B1 (en) | 2007-07-20 |
Family
ID=34953367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0413922A Expired - Fee Related FR2880185B1 (en) | 2004-12-24 | 2004-12-24 | PROCESS FOR PROCESSING A WAFER SURFACE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2880185B1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3187109B2 (en) * | 1992-01-31 | 2001-07-11 | キヤノン株式会社 | Semiconductor member and method of manufacturing the same |
JPH07183288A (en) * | 1993-12-24 | 1995-07-21 | Toshiba Corp | Semiconductor wafer treating agent |
US5916819A (en) * | 1996-07-17 | 1999-06-29 | Micron Technology, Inc. | Planarization fluid composition chelating agents and planarization method using same |
US6896826B2 (en) * | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US7235461B2 (en) * | 2003-04-29 | 2007-06-26 | S.O.I.Tec Silicon On Insulator Technologies | Method for bonding semiconductor structures together |
-
2004
- 2004-12-24 FR FR0413922A patent/FR2880185B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2880185A1 (en) | 2006-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name |
Effective date: 20120423 Owner name: SOITEC, FR |
|
ST | Notification of lapse |
Effective date: 20130830 |