FR2877805B1 - Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe - Google Patents

Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe

Info

Publication number
FR2877805B1
FR2877805B1 FR0411928A FR0411928A FR2877805B1 FR 2877805 B1 FR2877805 B1 FR 2877805B1 FR 0411928 A FR0411928 A FR 0411928A FR 0411928 A FR0411928 A FR 0411928A FR 2877805 B1 FR2877805 B1 FR 2877805B1
Authority
FR
France
Prior art keywords
metal housing
electronic equipment
containing electronic
equipped therewith
electromagnetic interferences
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0411928A
Other languages
English (en)
Other versions
FR2877805A1 (fr
Inventor
Eric Bourgogne
Jean Eric Besold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR0411928A priority Critical patent/FR2877805B1/fr
Publication of FR2877805A1 publication Critical patent/FR2877805A1/fr
Application granted granted Critical
Publication of FR2877805B1 publication Critical patent/FR2877805B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0066Constructional details of transient suppressor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0723Shielding provided by an inner layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09354Ground conductor along edge of main surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0949Pad close to a hole, not surrounding the hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1006Non-printed filter
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
FR0411928A 2004-11-09 2004-11-09 Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe Expired - Fee Related FR2877805B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0411928A FR2877805B1 (fr) 2004-11-09 2004-11-09 Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0411928A FR2877805B1 (fr) 2004-11-09 2004-11-09 Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe

Publications (2)

Publication Number Publication Date
FR2877805A1 FR2877805A1 (fr) 2006-05-12
FR2877805B1 true FR2877805B1 (fr) 2007-03-16

Family

ID=34953525

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0411928A Expired - Fee Related FR2877805B1 (fr) 2004-11-09 2004-11-09 Dispositif de filtrage d'interferences electromagnetiques pour un boitier metallique contenant du materiel electronique, et boitier metallique qui en est equipe

Country Status (1)

Country Link
FR (1) FR2877805B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2887776A1 (fr) * 2013-12-18 2015-06-24 Advanced Digital Broadcast S.A. Carte de circuit imprimé avec des trajets de signal RF

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0181286A1 (fr) * 1984-10-29 1986-05-14 Ascom Autophon Ag Dispositif blindé de protection contre les perturbations dans les lignes de transmission de données
DE3823469A1 (de) * 1988-07-11 1990-01-18 Bodenseewerk Geraetetech Filteranordnung
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
US5191174A (en) * 1990-08-01 1993-03-02 International Business Machines Corporation High density circuit board and method of making same
US5039965A (en) * 1990-08-24 1991-08-13 Motorola, Inc. Radio frequency filter feedthrough structure for multilayer circuit boards
FR2720216B1 (fr) * 1994-05-18 1996-06-14 Snecma Dispositif de protection d'un dispositif électronique sensible aux rayonnements électromagnétiques.

Also Published As

Publication number Publication date
FR2877805A1 (fr) 2006-05-12

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Legal Events

Date Code Title Description
TP Transmission of property
CA Change of address

Effective date: 20140805

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

CD Change of name or company name

Owner name: SAGEM DEFENSE SECURITE, FR

Effective date: 20170126

ST Notification of lapse

Effective date: 20180731