FR2867013B1 - METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD - Google Patents

METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD

Info

Publication number
FR2867013B1
FR2867013B1 FR0402078A FR0402078A FR2867013B1 FR 2867013 B1 FR2867013 B1 FR 2867013B1 FR 0402078 A FR0402078 A FR 0402078A FR 0402078 A FR0402078 A FR 0402078A FR 2867013 B1 FR2867013 B1 FR 2867013B1
Authority
FR
France
Prior art keywords
motherboard
mounting
manufacturing
methods
electronic module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0402078A
Other languages
French (fr)
Other versions
FR2867013A1 (en
Inventor
Gilles Moreau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR0402078A priority Critical patent/FR2867013B1/en
Publication of FR2867013A1 publication Critical patent/FR2867013A1/en
Application granted granted Critical
Publication of FR2867013B1 publication Critical patent/FR2867013B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR0402078A 2004-03-01 2004-03-01 METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD Expired - Fee Related FR2867013B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0402078A FR2867013B1 (en) 2004-03-01 2004-03-01 METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0402078A FR2867013B1 (en) 2004-03-01 2004-03-01 METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD

Publications (2)

Publication Number Publication Date
FR2867013A1 FR2867013A1 (en) 2005-09-02
FR2867013B1 true FR2867013B1 (en) 2008-12-05

Family

ID=34834150

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0402078A Expired - Fee Related FR2867013B1 (en) 2004-03-01 2004-03-01 METHODS OF MANUFACTURING AND MOUNTING AN ELECTRONIC MODULE CAPABLE OF BEING MOUNTED ON A MOTHERBOARD, ASSOCIATED MOTHERBOARD

Country Status (1)

Country Link
FR (1) FR2867013B1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5796169A (en) * 1996-11-19 1998-08-18 International Business Machines Corporation Structurally reinforced ball grid array semiconductor package and systems
JPH11233926A (en) * 1998-02-13 1999-08-27 Denso Corp Method for mounting electronic component
US6444563B1 (en) * 1999-02-22 2002-09-03 Motorlla, Inc. Method and apparatus for extending fatigue life of solder joints in a semiconductor device
JP3645136B2 (en) * 1999-06-22 2005-05-11 三菱電機株式会社 Electronic circuit package and mounting board
JP2003031728A (en) * 2001-07-13 2003-01-31 Alps Electric Co Ltd Ic chip and attaching structure therefor

Also Published As

Publication number Publication date
FR2867013A1 (en) 2005-09-02

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
TP Transmission of property

Owner name: APPLE INC., US

Effective date: 20111229

PLFP Fee payment

Year of fee payment: 13

ST Notification of lapse

Effective date: 20171130