FR2850489A1 - Photovoltaic module production, with photovoltaic cells between glass substrates, in which the positive and negative linkage conductors are provided by gluing copper strips to one glass substrate - Google Patents

Abstract

Production of photovoltaic module (1), with photovoltaic cells (2) side by side between glass substrates (3, 4) and connected in series, with positive (5) and negative (5') linkage conductors associated with positive and negative poles of each cell, interconnection elements (7) arranged between two adjacent cells for connecting two linkage conductors, comprises gluing on one substrate of copper strips constituting linkage conductors. The production of a photovoltaic module (1), incorporating photovoltaic cells (2) arranged side by side between two glass substrates (3, 4) and connected in series, with a positive linkage conductor (5) and a negative linkage conductor (5') associated with the positive and negative poles of each cell, some electrical interconnection elements (7) being arranged between two adjacent cells for connecting the two linkage conductors, comprises the gluing on one of the glass substrates of copper strips constituting the negative and positive linkage conductors. An Independent claim is also included for a photovoltaic module obtained in the above process.

Description

i

  Technical field of the invention The invention relates to a method of making a photovoltaic module comprising photovoltaic cells, placed side by side between two glass substrates and connected in series, at least one positive connection conductor and at least one negative connection conductor being associated respectively with positive and negative poles of each cell, electrical interconnection elements being arranged between two adjacent cells to connect two connection conductors respectively positive and negative associated with the two adjacent cells.

   STATE OF THE ART A photovoltaic cell is conventionally formed on a solid silicon substrate 20 cut in the form of slices a few hundred microns thick. The substrate can consist of monocrystalline silicon, polycrystalline silicon or semiconductor layers deposited on a glass or ceramic substrate. It has on its surface a network of narrow electrodes, generally made of silver or aluminum, intended to drain the current towards one or more main electrodes from 1 to a few millimeters in width, also in silver or aluminum.

  Each cell supplies a current dependent on the illumination under an electric voltage which depends on the nature of the semiconductor and which is usually of the order of 0.45 V to 0.65 V for crystalline silicon. Voltages from 6V to several tens of volts are usually necessary to operate electrical devices, a photovoltaic module is generally constituted by an assembly of several cells in series. A 40 cell module provides, for example, nearly 24 volts. Depending on the currents requested, several cells can also be placed in parallel. A generator can then be produced by optionally adding accumulators, a voltage regulator, etc. To manufacture a photovoltaic module, the cells are prepared, that is to say covered with a network of electrodes and connected together by conductors metal. The assembly thus formed is then placed between two sheets of polymer, themselves sandwiched between two glass substrates.

  The assembly is then heated to around 1200C to strongly soften the polymer, make it transparent and ensure the mechanical cohesion of the module.

  In a known photovoltaic module, rear connection conductors associated with a first cell are connected to the front connection conductors associated with a second, adjacent cell. If the module has more than two cells, the rear connection conductors of the second cell are then connected to the front connection conductors of the next cell, all the cells thus being connected in series. In practice, a rear connection conductor of a cell and the associated front connection conductor of the neighboring cell can be formed by the same conductor. The connecting conductors of the end cells serve as connectors to the outside.

  An assembly of photovoltaic cells in matrix form may include conductors of transverse links connecting the cells in parallel. Typically the transverse connection conductors, constituted by a copper core and a surface deposit of a tin-lead alloy, are soldered with a tin-lead alloy on connection areas of the cell. The connecting conductors can also be produced by depositing a silver paste according to the desired pattern, then baking at high temperature.

  In document DE-A-4128766, the front and rear connection conductors are formed on the internal face of the front and rear glass substrates opposite the location of each of the cells. The connecting conductors are then soldered onto the cells and onto interconnection elements intended to connect the cells in series. The space remaining between the glass substrates is then filled with an organic resin.

  Furthermore, in certain known cells (US Pat. No. 6,383,417), the positive and negative poles of the cell are brought back to one of the faces thereof, in particular to its rear face.

  The soldering of the connection conductors and the assembly of the cells constitutes a handicap since these are long operations which can break the cells and lead to a high production cost.

  OBJECT OF THE INVENTION The object of the invention is to remedy these drawbacks and, in particular, a method for producing a photovoltaic module minimizing the number of welding operations and the manufacturing cost.

  According to the invention, this object is achieved by the fact that the method comprises the bonding on one of the glass substrates of copper strips constituting at least the positive or negative bonding conductors.

  According to a preferred embodiment, the bonding step comprises a sub-step of bonding the substrate or the copper strip with a precursor of an inorganic binder and the method comprises annealing the precursor, so as to decompose the precursor leaving a residue several microns thick.

  According to a development of the invention, the negative and positive poles of the cells being arranged on either side of the cells respectively, the positive bonding conductors are formed on an internal face of one of the substrates and the negative bonding conductors are formed on an internal face of the other substrate by front and rear connecting conductors respectively.

  According to a preferred embodiment, the front or rear connection conductors being formed by bonding copper strips onto one of the glass substrates, the other connection conductors are formed by baking a silver paste deposited on the other glass substrate.

  According to a preferred embodiment, an interconnection element is formed by deformation of one end of a copper strip of a front or rear connecting conductor so that the deformed end is in contact with the opposite connection zone after assembly of the photovoltaic module.

  According to another characteristic of the invention, the negative and positive poles of the cells being arranged on the same side of the cells, the positive and negative bonding conductors are arranged on an internal face of a single substrate.

  According to a preferred embodiment, the negative and positive poles of a cell being arranged on the same side of the cell (2), at least one electrical interconnection element, the corresponding connection zones and the two respectively positive connection conductors and negative associated are formed by a single copper strip folded back on itself of 900 in a predetermined direction and 900 in the opposite direction, the intermediate segment constituting the interconnection element and the two outer segments constituting the conductors of bond and bond areas.

  According to a development of the invention, the negative and positive poles of a cell being respectively disposed on either side of the cell and a continuous copper strip comprising first, second and third parts respectively constituting an element of electrical interconnection, a bonding conductor associated with a previously placed cell and a bonding conductor associated with the adjacent cell, the method comprises placing the copper strip and bonding the third part of the strip copper on one of the substrates before placing the adjacent cell.

Brief description of the drawings

  Other advantages and characteristics will emerge more clearly from the description which follows of particular embodiments of the invention given by way of nonlimiting examples and represented in the appended drawings, in which: FIG. 1 is a photovoltaic module according to the invention. 'invention.

  Figures 2 and 3 show photovoltaic modules with particular embodiments of the interconnection elements.

  FIGS. 4 and 5 illustrate a particular embodiment of a photovoltaic module, the positive and negative connection conductors being arranged on the same substrate, FIG. 4 being a sectional view along the axis CC of FIG. 10 5.

  Figures 6 and 7 show, in front view, two alternative embodiments of two cells according to Figures 4 and 5 and their connections.

  FIG. 8 is a sectional view along the axis DD of FIG. 7.

  FIG. 9 represents a photovoltaic module comprising metal connectors 15 intended to allow a connection of all the photovoltaic cells with the exterior of the module.

  Figures 10, 11, 12 and 16 show photovoltaic modules comprising various variants of connection terminals of the module with the outside.

  FIG. 13 represents a sectional view along the axis AA of FIG. 12.

  FIGS. 14 and 15 represent a particular embodiment of a terminal for connecting the module with the outside, FIG. 15 being a sectional view along the axis BB of FIG. 14.

  FIG. 17 represents a photovoltaic module comprising front and rear protective layers.

  FIG. 18 represents another embodiment of a photovoltaic module according to the invention.

  Description of particular embodiments.

  FIG. 1 represents a photovoltaic module 1 comprising two photovoltaic cells 2a and 2b arranged side by side between glass substrates 5 before 3 and rear 4 and connected in series. A positive connection conductor 5 and a negative connection conductor 5 ′ are associated respectively with positive and negative poles of each cell 2. Each connection conductor ends in a connection zone 6 protruding from a predetermined side of the cell, electrical interconnection elements 7 being arranged between two adjacent cells 2 10 to connect the connection zones 6 of two connection conductors 5, 5 ′ respectively positive and negative associated with the two adjacent cells 2.

  The negative and positive poles of a cell being arranged on either side of cell 2 respectively, the positive connection conductors 5 are formed on an internal face of one of the substrates 3 and the negative connection conductors 5 ' are formed on an internal face of the other substrate 4 by front and rear connecting conductors respectively.

  Copper strips constituting at least the positive 5 or negative 5 'bonding conductors are bonded, before assembly of the cells 2 and the substrates 3 and 4, on at least one of the glass substrates 3 and 4. Transversal bonding conductors intended to connect cells 2 in parallel can be formed by bonding copper strips on one of the substrates after bonding copper strips 25 constituting the positive 5 or negative 5 'conductors. Before bonding, the copper strips may possibly be covered with a thin layer of silver, another metal or an alloy less oxidizable than copper.

  The bonding of the copper strips on the substrate 3 or 4 can be carried out by means of a mineral compound. In a particular embodiment, the bonding step comprises a sub-step of bonding the substrate or the copper strip with a precursor of an inorganic binder, in particular an organic compound or an organometallic compound, and optionally , an annealing substep, so as to decompose the precursor leaving a residue several microns thick. Preferably, the precursor is a silicone, the residue then consisting of silica.

  Before bonding, each copper strip is pre-cut to the desired length.

  Then, the copper strip, or the corresponding location of the substrate, is glued with the bonding compound, for example silicone. The thickness of the layer formed by the bonding compound is less than 50 µm. The copper strip is then assembled on the substrate by applying a light pressure to achieve bonding. The copper strip is maintained by the bonding compound until the final assembly of the module. We can thus prepare each substrate. Then placed on one of the prepared substrates, the cells 2, the interconnection elements 7 and metal connectors 11 (shown in Figures 9 to 16) intended to allow connection of the module 20 with the outside. The second substrate is then placed on the cells.

  In a preferred embodiment, only one of the substrates is prepared by bonding copper strips and the opposite connecting conductors are formed by baking a silver paste deposited on the other glass substrate. Thus all the conductors associated with one of the substrates are made of copper and all the conductors associated with the other substrate are made of silver paste.

  As shown in FIG. 9, a sealing joint 12 made of mineral material can be placed between the two glass substrates 3 and 4, so as to delimit, inside the module 1, a sealed interior volume in which the cells. The whole is cooked at about 4000C for about 10 minutes. The bonding compound is thus broken down and leaves a residue a few microns thick.

  In a particular embodiment, shown in FIG. 2, the interconnection elements are formed by tinning 8 of the opposite connection zones 6 and positioning on one of the connection zones of a component 9, of the component type mounted in surface (CMS). SMDs have minimal electrical resistance and are widely used in electronic circuits. The placement of CMS is easy and fast because the corresponding technology is perfectly mastered in the printed circuit industry. One can, for example, use CMS of the jumper type, that is to say components with negligible resistance, with a width of 1 mm, with a length of 2 mm and with a thickness of 250 gm. These components can be placed by a machine with a capacity of several hundred pieces per minute.

  Tinning 8 is carried out by depositing a tin-based solder alloy. The fusion welding of the alloy is preferably carried out during the sealing of the module. The sealing temperature is in fact of the order of 4000 ° C., which allows this welding to be carried out automatically.

  In another particular embodiment, illustrated in FIG. 3, an interconnection element is formed by deformation 10 of one end of a copper strip of a negative 5 or positive 5 'connecting conductor so that that the deformed end is in contact with the opposite connection zone 6 after assembly of the photovoltaic module 1. The height of the deformation is of the order of the thickness of the cells 2 or slightly greater (between 200 μm and 1 mm) and its length is typically between 1 mm and 3 mm. The copper strip can be deformed before being bonded to the substrate. Contact between the deformed copper strip and the opposite connection zone 6 can be ensured by pressure. The deformed end or the opposite connecting zone 6 can be tinned beforehand. Alternatively, a solder material, consisting of a small amount of tinning paste, can ensure their soldering during sealing.

  In FIGS. 4 and 5, the negative and positive poles of a cell being, in known manner, arranged on the same side of the cell 2, the positive 5 and negative 5 'connection conductors are arranged on an internal face of a only 10 substrate 4.

  Figure 6 shows two cells according to Figures 4 and 5 and their connections.

  Each of the electrical interconnection elements 7, the corresponding connection zones 6 and the two connection conductors 5, 5 ′, respectively positive 15 and associated negative, are formed by a single copper strip folded back on itself by 900 in a predetermined direction and by 900 in the opposite direction. Thus, the intermediate segment 28 constitutes the interconnection element 7 and the two outer segments constitute the connection conductors and the connection zones 6.

  FIGS. 7 and 8 illustrate interconnection elements 7 formed by components 9, of the surface-mounted component type, arranged before assembly of the module on the connection zones 6, preferably tinned (tinning 8).

  The photovoltaic module 1 may include metal connectors 11 (shown in FIGS. 9 to 16) intended to allow connection of the module 1 with the outside. The connectors 11 are electrically connected to the connection zones 6 of the positive 5 and / or negative 5 'connection conductors associated with the cells 2 arranged at the ends of the module 1, for example by a deformation of the end of the connection conductor 5, possibly tinned, pressing against connector 11 to ensure contact. The connectors 11 are preferably made of a material chosen from group 5 comprising copper, stainless steel, titanium and iron-nickel alloys, in particular of iron-nickel alloy comprising 48% nickel (FeNi-48). Preferably, the material of the connectors 11 is a metal or an alloy whose coefficient of thermal expansion is close to that of the substrates, such as FeNi-48. The connectors can also be tinned, gold-plated or 10 nickel-plated.

  The connectors 11 shown in FIG. 9 are constituted by metal rods passing through, in a sealed manner, the rear glass substrate 4 perpendicularly to the plane of the module 1. Preferably, an inorganic material 15 seals between the metal rods and the rear glass substrate 4.

  For example a sealing glass, softened during a heat treatment between 3500C and 700cC, for example during the thermal tempering of the substrate, ensures the connection between the substrate and a connector. Preferably, a crystallizable glass is used, which crystallizes during baking at a temperature of the order of 20 7000C and does not soften when sealed at 4000C.

  FIGS. 10 to 16 represent various embodiments of terminals 13 for connecting the module with the exterior, each comprising a block of insulating material 15 bonded to the end of the module 1, so as to connect external connectors 25 to connectors 11, which pass through the sealing joint 12 in a leaktight manner.

  In FIG. 10, an external connector, formed by a conductive wire 16, is connected in the block of insulating material 15, at one end of a connector 11 penetrating into the block of insulating material 15. The insulating material can be a material polymer. The connector 11 can be a blade with a thickness between 50 and 500 μm, typically 300 μm, and with a width between 1 and 100 mm, typically 4 mm. The connector 11 passes sealingly through the sealing joint 12 and is welded on the one hand to a connecting conductor 5 or 5 ′ inside the module and on the other hand to the conductive wire 16 outside the module. The connection zone between the connector 11 and the conductive wire 16 is covered with a resin or a polymer, for example of the epoxy type, constituting the block 15, which is bonded to the glass substrates 3 and 4. This resin or this polymer can be molded. The advantages are the absence of non-welded contacts, the absence of mechanical stress during the manufacture of the module and during its subsequent connection, great simplicity of the process because the solder between the connector 11 and the conductive wire 16 can be performed during the module sealing operation. In addition, module protection diodes can be transferred outside the module (on the conductive wire 16), which allows easy maintenance.

  The connector 11 shown in FIG. 11 ends with a female part 17 of a flat connector disposed between the glass substrates 3 and 4 outside the sealed volume. An external connector is connected to the connector 11 by a pin constituting the male part 18 of the flat connector and ending in a female part 19 integrated in an orifice of the block 15. The seal 12 is disposed at a certain distance from the end of the module, corresponding to the length of the male part 18 of the flat connector projecting from the block 15. The female part 19 is intended to be connected to an additional male connector inserted in the orifice of the block 15. As before, the connector 11 may consist of a blade with a thickness between 50 and 500 μm, typically 300 μm, and with a width between 1 and 100 mm, typically 4 mm. The blade ends, at one end, by the female part 17.

  The block of insulating material 15 is preferably made of polymeric material or resin. An insulating material block 15 can group together several connectors 11, the female part 19 serving to connect the connectors 11 corresponding to an external male connector inserted in a common orifice of the block 15.

  In an alternative embodiment (not shown), the sealing joint 12 is disposed at the end of the module and the female parts 17 of the connectors 11 are disposed at the end of the glass substrates 3 and 4 outside the sealed volume. The female parts 17 and the male parts 18 can then have larger dimensions.

  In another particular embodiment, represented in FIGS. 12 and 13, at least one connector 11, substantially L-shaped, penetrates, by forming a right angle 20, into the block of insulating material 15. From the ends 11 of 15 connectors 11 are arranged on the wall of a cylindrical opening 21 of the terminal 13. This cylindrical opening constitutes, with the ends 11 ', a female part intended to cooperate with an external connector introduced into the opening. The block of insulating material 15 is preferably made of glass and sealed to the substrates 3 and 4. The terminal 13 can be produced by high-temperature molding of a glassy compound around the ends of the connectors i1.

  The external connector 13 is then placed at the periphery of the substrates 3 and 4 during the assembly operation of the module and welded to the substrates 3 and 4 by means of a sealing glass, for example identical to the material constituting the seal 12.

  Another particular embodiment of a terminal 13 is represented in FIGS. 14 and 15. The block of insulating material 15 of terminal 13 comprises two glass substrates 22 and 23 enclosing several connectors 11, separated by strips 24 of glass, the assembly being linked by a sealing glass 25. The glass slides typically have a thickness of between 0.1 mm and 0.5 mm.

  In FIG. 16, the connector 11 ends at its outer end, by a flexible, spring-forming part 26, integrated in the block of insulating material 15 and coming into contact with a contact zone 27, disposed at the periphery of an orifice of the block 15 and intended to be connected to an external male connector introduced into the orifice. The flexible part 26 and the connector 11 can be golden. The block of insulating material 15 can be made of polymer material or 10 of resin and bonded against the glass substrates 3 and 4. Several springs 26 can be connected to a common terminal 13 comprising a single orifice.

  In the alternative embodiment illustrated in FIG. 17, the thickness of the glass substrates is reduced, which makes it possible to reduce the weight of the assembly. Each glass substrate has a thickness of between 0.5 and 2mm, typically between 0.8 and 1.6mm and preferably 1.2mm. The front 3 and rear 4 glass substrates preferably have the same thickness. Heat treatment operations, and in particular sealing, are more efficient and less costly because the mass of glass to be heated is lower. In the previous embodiments, the front glass substrate was toughened to withstand impact, for example hail. In the variant of FIG. 17, the front 3 and rear 4 glass substrates are not tempered. The mechanical resistance of the module, in particular, its impact resistance is nevertheless ensured by protective layers front 29 and rear 30 produced after the sealing operation, 25 respectively on the external faces of the glass substrates front 3 and rear 4. The front protective layer 29 is transparent and can be formed by laminating a transparent polymer film, by spraying a transparent plasticizing primer or by fixing, for example by gluing or pinching, a sheet of tempered glass or a polymer sheet (polycarbonate, PMMA, etc.). The rear protective layer 30 can be formed by laminating a polymer film, by spraying a plasticizing primer or by fixing, for example by gluing or pinching, 'a sheet of polymer (polyethylene, PVC, etc.). The final weight of the assembly is reduced thanks to the reduction in the thickness of the 5 glass substrates. 4mm thick glass can be replaced by 3mm and 4mm thick glass substrates, a front protective layer 29 made of 3mm thick tempered glass and a rear protective layer 30 consisting of polymer film, reducing the thickness of the glass layers of the assembly to 5mm, while ensuring good protection.

  FIG. 18 represents a photovoltaic module in which, the negative and positive poles of a cell being respectively arranged on either side of cell 2, a single continuous copper strip is formed by first, second and third parts respectively constituting an electrical interconnection element 7, a connecting conductor 5 associated with a cell 2b previously put in place and a connecting conductor 5 'associated with the adjacent cell 2a. A connecting conductor 5 ′ corresponding to an end cell (for example 2b) is bonded to the substrate 4. The corresponding cell 2b 20 is then placed on the substrate. Then, the continuous copper strip is put in place, the third part being bonded to the substrate 4 at the location provided for the cell 2a. The cell 2a is then put in place.

  All the cells of a module are thus successively put in place with their interconnections, before the substrate 3 is put in place. Thus, only the 25 parts of the copper strips corresponding to the connecting conductors 5 ′ are bonded before sealing the module. The continuous copper strips are preferably deformed before assembly.

  The invention is not limited to the particular embodiments shown, in particular, the polarities of the cells and of the connection conductors can be reversed.

Claims (26)

claims   1. Method for producing a photovoltaic module (1) comprising 5 photovoltaic cells (2), placed side by side between two glass substrates (3, 4) and connected in series, at least one positive bonding conductor (5 ) and at least one negative connecting conductor (5 ′) being associated respectively with positive and negative poles of each cell, electrical interconnection elements (7) being arranged between two adjacent cells (2) to connect two conductors of bond (5, 5 ') respectively positive and negative associated with the two adjacent cells (2), method characterized in that it comprises the bonding on one of the glass substrates (3, 4) of copper strips constituting at least the conductors positive (5) or negative (5 ') bonding.   2. Method according to claim 1, characterized in that the bonding comprises a sub-step of gluing of the substrate (3, 4) or of the copper strip with a precursor of an inorganic binder and that the method comprises an annealing of the precursor, so as to decompose the precursor leaving a residue several microns thick.   3. Method according to claim 2, characterized in that the precursor is a silicone and the residue consists of silica.   4. Method according to any one of claims 1 to 3, characterized in that, the negative and positive poles of a cell being respectively disposed on either side of the cell (2), the positive connecting conductors (5) are formed on an internal face of one of the substrates (3) and the negative bonding conductors (5 ') are formed on an internal face of the other substrate (4) by front and rear bonding conductors respectively , each comprising a connecting zone (6) projecting from a predetermined side of the corresponding cell.   5. Method according to claim 4, characterized in that the front or rear connection conductors being formed by bonding copper strips on one of the glass substrates, the other connection conductors are formed by baking a paste silver deposited on the other glass substrate.   6. Method according to any one of claims 1 to 3, characterized in that, the negative and positive poles of a cell being arranged on the same side of the cell (2), the positive connecting conductors (5) and negatives (5 ') are arranged on an internal face of a single substrate (4), each connecting conductor comprising a connecting zone (6) projecting from a predetermined side of the corresponding cell.   7. Method according to any one of claims 4 to 6, characterized in that the interconnection elements (7) are formed by tinning (8) of the connection zones (6) and installation of components (9), of the surface mounted component type, on one of the connection zones (6), before assembly of the module.   8. Method according to one of claims 4 and 5, characterized in that an interconnection element (7) is formed by deformation (10) of one end of a copper strip of a front connecting conductor or rear so that the deformed end is in contact with the opposite connection zone (6) 25 after assembly of the photovoltaic module (1).   9. Method according to claim 8, characterized in that it comprises the tinning of the deformed end.   10. Method according to claim 8, characterized in that it comprises the tinning of the connection zone (6) opposite the deformed end.   11. Method according to claim 6, characterized in that at least one electrical interconnection element (7), the corresponding connection zones (6) and the two connection conductors (5, 5 ') respectively positive and negative associated are formed by a single copper strip folded back on itself of 900 in a predetermined direction and of 90 in the opposite direction, the intermediate segment (28) constituting the interconnection element (7) and the two outer segments 10 constituting the connecting conductors and the connecting zones (6).   12. Method according to any one of claims 1 to 3, characterized in that, the negative and positive poles of a cell being respectively disposed on either side of the cell (2) and a continuous copper strip comprising first, second and third parts respectively constituting an electrical interconnection element (7), a connecting conductor (5) associated with a cell (2b) previously placed and a connecting conductor (5 ') associated with the adjacent cell (2a), the method comprises placing the copper strip and bonding the third part of the copper strip to one of the 20 substrates (3, 4) before placing the adjacent cell (2a ).   13. Photovoltaic module (1) comprising photovoltaic cells (2), placed side by side between two glass substrates (3, 4) and connected in series, at least one positive connection conductor (5) and at least one conductor 25 of negative connection (5 ') being associated respectively with positive and negative poles of each cell, electrical interconnection elements (7) being arranged between two adjacent cells (2) to connect two connection conductors (5, 5') respectively positive and negative associated with the two adjacent cells (2), module characterized in that it is obtained by a method according to one   any of claims 1 to 12.   14. Module according to claim 13, characterized in that an interconnection element (7) consists of a component (9) of the surface-mounted component type.   15. Module according to claim 13, characterized in that, the negative and positive poles of the cells being respectively disposed on either side of a cell (2) and each connecting conductor comprising a connecting zone (6) protruding from a predetermined side of the corresponding cell, an interconnection element (7) is formed by deformation (10) of one end of a copper strip of a front (5) or rear (5) connecting conductor '), so that the deformed end is in contact with the opposite connection zone (6).   16. Module according to any one of claims 13 to 15, characterized in that, each connection conductor comprising a connection zone (6) projecting from a predetermined side of the corresponding cell, the module comprises at least one connector ( 11) metallic intended to allow a connection of the module (1) with the outside and electrically connected to the connection zone (6) of a connection conductor (5, 5 ′) associated with a cell (2) arranged at one end of the module (1).   17. Module according to claim 16, characterized in that the connector (11) is made of a material chosen from the group comprising copper, stainless steel, iron-nickel alloys and titanium.   18. Module according to claim 17, characterized in that the connector (11) is made of iron-nickel alloy comprising 48% nickel.   19. Module according to any one of claims 16 to 18, characterized in that the connector (11) consists of a metal rod passing through, in a sealed manner, the rear glass substrate (4), perpendicular to the plane of the module ( 1).   20. Module according to claim 19, characterized in that a mineral material provides sealing between the metal rod and the rear glass substrate (4).   21. Module according to any one of claims 13 to 20, characterized in that it comprises a sealing joint (12) made of mineral material, disposed between the two glass substrates (3, 4), so as to delimit, inside the module (1), a sealed interior volume, in which the cells (2) are arranged.   22. Module according to claim 21, characterized in that the connector (11) passes, in a leaktight manner, the sealing joint (12).   23. Module according to one of claims 16 to 18 and 21 to 22, characterized in that it comprises a connection terminal (13) comprising a block of insulating material (15) glued to one end of the module (1) , so as to connect at least one connector (11) to an external connector.   24. Module according to any one of claims 16 to 23, characterized in that the connection between the connector (11) and the connection conductor (5) associated with a cell (2b) disposed at the end of the module ( 1) is produced by a deformation of the end of the connecting conductor (5).   25. Module according to claim 13, characterized in that, the negative and positive poles of a cell being arranged on the same side of the cell (2) and each connecting conductor comprising a connecting zone (6) projecting from a predetermined side of the corresponding cell, at least one electrical interconnection element (7), the corresponding connection zones (6) and the two connection conductors (5, 5 ′) respectively positive and negative associated 5 are formed by a single copper strip folded back on itself by 90 in a predetermined direction and by 900 in the opposite direction, the intermediate segment (28) constituting the interconnection element (7) and the two outer segments constituting the connecting conductors and the connecting areas (6).   26. Module according to any one of claims 13 to 25, characterized in that the glass substrates (3, 4) having a thickness of between 0.5mm and 2mm, the module comprises front protective layers (29) and rear (30) formed respectively on the glass substrates before (3) and rear (4) after assembly.