FR2848723B1 - Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes - Google Patents

Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes

Info

Publication number
FR2848723B1
FR2848723B1 FR0215902A FR0215902A FR2848723B1 FR 2848723 B1 FR2848723 B1 FR 2848723B1 FR 0215902 A FR0215902 A FR 0215902A FR 0215902 A FR0215902 A FR 0215902A FR 2848723 B1 FR2848723 B1 FR 2848723B1
Authority
FR
France
Prior art keywords
desolidarizing
tools
tool
plates
field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0215902A
Other languages
English (en)
Other versions
FR2848723A1 (fr
Inventor
Sebastien Kerdiles
Vaillant Yves Mathieu Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR0215902A priority Critical patent/FR2848723B1/fr
Priority to US10/733,470 priority patent/US7187162B2/en
Publication of FR2848723A1 publication Critical patent/FR2848723A1/fr
Application granted granted Critical
Publication of FR2848723B1 publication Critical patent/FR2848723B1/fr
Priority to US11/567,417 priority patent/US7740735B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manipulator (AREA)
FR0215902A 2002-12-16 2002-12-16 Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes Expired - Lifetime FR2848723B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0215902A FR2848723B1 (fr) 2002-12-16 2002-12-16 Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes
US10/733,470 US7187162B2 (en) 2002-12-16 2003-12-12 Tools and methods for disuniting semiconductor wafers
US11/567,417 US7740735B2 (en) 2002-12-16 2006-12-06 Tools and methods for disuniting semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0215902A FR2848723B1 (fr) 2002-12-16 2002-12-16 Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes

Publications (2)

Publication Number Publication Date
FR2848723A1 FR2848723A1 (fr) 2004-06-18
FR2848723B1 true FR2848723B1 (fr) 2005-02-25

Family

ID=32338817

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0215902A Expired - Lifetime FR2848723B1 (fr) 2002-12-16 2002-12-16 Outil pour la desolidarisation de plaques dans le domaine des substrats semiconducteurs, ensemble de tels outils et procedes associes

Country Status (1)

Country Link
FR (1) FR2848723B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2913968B1 (fr) 2007-03-23 2009-06-12 Soitec Silicon On Insulator Procede de realisation de membranes autoportees.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124547B (en) * 1982-05-28 1985-10-16 Penrhyn Quarries Limited Apparatus for and a method of cleaving laminated plate
JPS60196644A (ja) * 1984-03-21 1985-10-05 Toshiba Corp 付着力評価方法
FR2572216B1 (fr) * 1984-10-23 1987-01-23 Trt Telecom Radio Electr Procede de controle par pelage de l'adherence d'une couche deposee sur une surface
NL8903010A (nl) * 1989-12-07 1991-07-01 Philips & Du Pont Optical Werkwijze en inrichting voor het verwijderen van een buigzaam produkt van een draagplaat.
JPH06268051A (ja) * 1993-03-10 1994-09-22 Mitsubishi Electric Corp ウエハ剥し装置
EP0989593A3 (fr) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Dispositif et procédé de séparation de substrat, et procédé de fabrication de susbtrat
FR2785217B1 (fr) * 1998-10-30 2001-01-19 Soitec Silicon On Insulator Procede et dispositif pour separer en deux tranches une plaque de materiau notamment semi-conducteur

Also Published As

Publication number Publication date
FR2848723A1 (fr) 2004-06-18

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