FR2847762B1 - ELEMENT OF ELECTRONIC POWER MODULE - Google Patents

ELEMENT OF ELECTRONIC POWER MODULE

Info

Publication number
FR2847762B1
FR2847762B1 FR0214561A FR0214561A FR2847762B1 FR 2847762 B1 FR2847762 B1 FR 2847762B1 FR 0214561 A FR0214561 A FR 0214561A FR 0214561 A FR0214561 A FR 0214561A FR 2847762 B1 FR2847762 B1 FR 2847762B1
Authority
FR
France
Prior art keywords
power module
electronic power
electronic
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0214561A
Other languages
French (fr)
Other versions
FR2847762A1 (en
Inventor
Frederic Lecoq
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renault SAS
Original Assignee
Renault SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renault SAS filed Critical Renault SAS
Priority to FR0214561A priority Critical patent/FR2847762B1/en
Publication of FR2847762A1 publication Critical patent/FR2847762A1/en
Application granted granted Critical
Publication of FR2847762B1 publication Critical patent/FR2847762B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0214561A 2002-11-21 2002-11-21 ELEMENT OF ELECTRONIC POWER MODULE Expired - Lifetime FR2847762B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0214561A FR2847762B1 (en) 2002-11-21 2002-11-21 ELEMENT OF ELECTRONIC POWER MODULE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0214561A FR2847762B1 (en) 2002-11-21 2002-11-21 ELEMENT OF ELECTRONIC POWER MODULE

Publications (2)

Publication Number Publication Date
FR2847762A1 FR2847762A1 (en) 2004-05-28
FR2847762B1 true FR2847762B1 (en) 2006-07-21

Family

ID=32241464

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0214561A Expired - Lifetime FR2847762B1 (en) 2002-11-21 2002-11-21 ELEMENT OF ELECTRONIC POWER MODULE

Country Status (1)

Country Link
FR (1) FR2847762B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2911247B1 (en) 2007-01-08 2009-02-27 Sames Technologies Soc Par Act ELECTRONIC CARD AND COLD PLATE FOR THIS CARD.
DE102009010257A1 (en) * 2009-02-24 2010-08-26 Jungheinrich Aktiengesellschaft Power splitter for a motor control in an industrial truck, comprises a printed circuit board, whose substrate consists of metal or other good heat conducting material or good heat conducting lower layer, and a cooling body
NL2027865B1 (en) * 2021-03-30 2022-11-23 E Traction Europe Bv Insulated-gate bipolar transistor module cooling system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2715773B1 (en) * 1994-02-02 1996-04-26 Merlin Gerin Liquid cooling device for a power electronic component.
FR2756134B1 (en) * 1996-11-21 1999-07-09 Gec Alsthom Transport Sa COOLING DEVICE FOR IGBT COMPONENTS
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
DE10006215A1 (en) * 2000-02-11 2001-08-16 Abb Semiconductors Ag Baden Cooling device for a high-performance semiconductor module
FR2807285A1 (en) * 2000-03-29 2001-10-05 Seem Semrac Device for thermal control of high-power electronic components by circulation of coolant

Also Published As

Publication number Publication date
FR2847762A1 (en) 2004-05-28

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