FR2837306A1 - Chip card for data storage has display and control electronics flush mounted in recess in surface with contact surfaces - Google Patents

Abstract

A chip card (15) has a recess (16) holding a flush mounted display (5) and a chip control module (10) supported on a shoulder (6) with mutual electrical contact surfaces (8, 9).

Description

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  PORTABLE DATA MEDIA WITH DISPLAY

AND ITS MANUFACTURING METHOD

  The present invention relates to a portable data carrier with display, in particular an electronic data carrier in the form of a card, such as a smart card, for example in the form of a monetary card, a card or a card. credit,

  of a check card and the like, as well as a method of its manufacture.

  The smart cards with display contain a control electronics, which is usually realized by a separate control chip and which solves the problem of grouping the many connection connections for the individual display elements, in fact to transform a signal of entered serie into a signal of

Parallel output for the display.

  Such a smart card is for example known from US Pat. No. 4,797,542. In this document, the control chip is arranged separately from the display on a wafer, on which also other electronic components, such as example a Central Processing Unit chip that controls the control chip. In addition, EP 0 426 163 A1 can be used to produce the control electronics, the CPU unit and other electronic components in a single chip.

2s on a common substrate.

  In addition, a specific mechanical structure of the display modules has been developed for the industrial production, for which the display is constructed on a base substrate, on which is realized at the same time

  the control electronics for controlling the individual display elements.

  Such a display module 1 is shown in FIG. 8a, or on the base substrate 2, next to the covering substrate 3 covering the display element, the control electronics 4 is arranged for controlling the elements. of individual displays. The disadvantage of this structure lies in the fact that, for the front view of the display module 1, the control electronics 4 is visible next to the

effective display surface.

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  Accordingly, this arrangement is not suitable for insertion into a card body surface unless the control electronics is covered by a

  additional covering layer.

  For insertion in the chip cards, it is intended in this regard to insert the display in a reverse arrangement, so that the covering substrate 3 is flushly connected to the surface of the board and forms a surface

unitarily optical.

  The control electronics 4 is realized in this arrangement on the face

  bottom of the substrate 3 as a sign of recovery as shown in Figure 8b.

  This arrangement leads, however, during the manufacture of the display, to

  additional process steps that increase costs.

  The object of the present invention is accordingly to provide an alternative such that a display can be combined in a simple manner with a control electronics, without the control electronics appear in an optically negative way in order to before. This problem is solved by a portable data carrier with a display, in particular a smart card, comprising a card body with an obviously, in which support wind boxes next to each other the display and a module of control chip for the selective control of individual elements of the display, in which data carrier, the display shows the dimension of the control module a first support shoulder with first contact surfaces and the control module presents first counter-support contact surfaces and data carrier in which the control chip module rests on the display support shoulder, so that the first counter-contact contact surfaces of the control chip module , is based on the first contact surfaces of the display. According to one embodiment of the data carrier of the invention, the display accommodates in the complete case of the side of the support shoulder a cavity which is completely covered by the control chip module. The control chip module can completely cover the first contact surface of the first

  Shoulder support of the display.

  According to another embodiment of the data carrier, the display and the control chip module terminate flush with a surface of the data carrier.

data support.

  According to yet another embodiment of the data carrier according to the invention, for contacting the first counter-contact contact surface of the control chip module on the first contact surfaces of the display,

  is an anisotropic conductive adhesive.

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  The contact surfaces of the display may come into touching contact with the counter-contact contact surfaces of the control chip module. The control chip module can also be based on a second support shoulder,

  which is formed by the card body.

  According to yet another embodiment of the data carrier, the second support shoulder comprises second contact surfaces for contacting the control chip module with electronic components inside the data carrier, and the module The control chip comprises second counter-contact contact surfaces which are located above the contact surfaces of the second support shoulder. The control electronics can be integrated in a chip module of CPU Central Processing Unit. The CPU chip module may have contact zones which are arranged for the exchange of data, by contact, with an external data processing member on a

surface of the data carrier.

  According to another embodiment of the invention, the control chip module or the CPU chip module comprises an arrangement of conductive tracks and a chip connected to the arrangement of conductive tracks by connections, the chip and the connections. electrics are surrounded by a casting mass of coating. The method of manufacturing a portable data carrier with a display, in particular a smart card, comprises according to the invention the steps consist in: providing a display having a first support shoulder on the side of the edge with first contact surfaces, a control chip module for the selective control of the individual elements 2s of the display, the control chip module comprising first counter-contact contact surfaces for coming into contact with the first contact surfaces of the display, and a card body with an obviously to receive the display and the control chip module, - to place the display in the obviously so that in obviously on the side of the shoulder of the support, next to the display, there is space to set up the control chip module; - Place the control chip module in the obvious, next to the display, so that the control chip module rests on the support shoulder of the display and the first contact surfaces 3s counter-support of the control chip module, relies on the first

contact surfaces of the display.

  According to another embodiment of the method, includes the step of manufacturing the card body made available, obviously in the card body is made of \\ HIRSCH6 \ PATENTS \} 3revets \ 20800 \ 20B90.doc 6 rnars 2003 - 3/15

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  so that the display places in the obviously complete side of the shoulder

  support a cavity in which is housed the control chip module.

  According to another embodiment of the manufacturing method according to the invention, obviously in the card body is realized so that the display and the control chip module terminate flush with a card body surface. . According to yet another embodiment of the method of the invention, there is created in the card body a second support shoulder on which is pressed the

  control chip module, has its implementation in the recess.

  According to another embodiment of the method according to the invention, the wind is provided on the second bearing shoulder of the second contact surfaces for bringing the control chip module into contact with the electrical components in the data carrier, and wherein the control chip module includes second counter-contact contact surfaces which have the control chip module in place, in the recess, are placed on the second surface of the control chip module.

  contact of the second shoulder of support.

  According to yet another embodiment, the method comprises the step of manufacturing the display and / or the control chip module, so that the control chip module has the installation in the recess covers o Completely the first contact surfaces of the first support shoulder of the display. According to yet another embodiment of the method according to the invention, the first contact surfaces situated above the aukes, the display and the first counter-support surfaces of the control chip module, wind

  2s in contact with an anisokope conductive adhesive.

  According to another embodiment of the method according to the invention, the first contact surfaces located above the aukes of the display and the first counter-contact contact surfaces of the control chip module.

come in touching touch.

  According to another embodiment of the method according to the invention, the control chip module is integrated into a chip module of the central processing unit CPU of the data medium. The CPU chip module may have contact zones that are available for the exchange of data by contacts with

  an external data processing member on a surface of the data carrier.

  The control chip module or the CPU chip module may comprise an arrangement of conductive tracks and a chip connected to the arrangement of conductive tracks by electrical connections, the chip and the electrical connections.

  being surrounded by a poured mass of coating.

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  The control electronics is therefore manufactured separate from the display in the form of a control chip module and is first relic to the display during the manufacture of the card. For this, the card body has a recess in which

  first the prefabricated display is displayed, and then the control chip module.

  s The display has, on the side of the edge, a support shoulder which may for example be formed by the base substrate extending laterally from the display. On this support shoulder, ends the connecting conductors to the individual display elements in the form of contact surfaces placed at a distance from each other. The control chip module has support surfaces which are arranged so that when the control chip module is placed in the recess of the card body, they are placed on the

contact surfaces of the display.

  The module of the control chip is also supported, so as to ensure contact,

  on the shoulder area of the surface.

  The rear face of the chip module rotated towards the board surface closes together with the display cover substrate, flush with the surface of the data carrier, so that another step of work to complete the display placed in the data carrier is not necessary, without restriction. Correspondingly, a preferred embodiment also provides that by placing the display in the recess of the card body, a cavity is completed which is fully covered by the control chip module. So that not only the control electronics but also the contact surfaces on the display support shoulder can not be recognized in the front view of the display, another advantageous embodiment 2s provides that the contact surfaces wind completely covered by the modules of

control chip.

  The control chip module comprises an arrangement of conductive tracks, for example a conductive frame or a sheet of polymer with a conductive coating of the electricity on which is placed a control chip containing the control electronics and which is in contact with electrical connections at least the control chip and the electrical links, for example the wired links, being surrounded by a cast casting mass. The counteracting contact surfaces of the control chip module to ensure contact of the contact surfaces of the display constitute the arrangement of conductive tracks, a

  3s know for example the ends of the jambs of the driver's frame.

  The use of a control chip module instead of a control electronics built on the base substrate of the display, or a << naked >> control chip applied to the base substrate, offers the advantage that \\ RSCH6 \ PATENTS \ Patents \ 20800 \ 20890.doc - 6 March 2003 - 5/15

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  electronic components of the control electronics can be brought into contact in the control module by conventional techniques, for example by wire links, which is not possible without further by a direct arrangement on the base substrate which, For use in smart cards, it is usually made of a flexible plastic material. In addition, the control chip module can be advantageously tested before being connected to the display. The control chip module is in principle constructed in the same way as the module

  CPU chip Central CPU processing of the usual smart cards.

  The placing of the counter surface of the display module against the contact surfaces of the display may, in comparison with a direct contact of a control part with the control conductors of a display It can be made in a relatively uncomplicated manner because the counter-support surfaces of the control chip module can be made substantially larger as components of the conductive track arrangement than the contact surfaces of the control chip. . For this, it is possible to put the counter-contact contact surfaces of the control chip module into contact with the contact surfaces of the display by means of a carefully conductive adhesive.

  dose, or even simpler, using an anisotropic conductive adhesive.

  As an alternative to this embodiment, it is also possible to fix the control chip module in the card body with a non-conductive adhesive, so that the control contact surface of the control chip module

  find in touching contact with the contact surfaces of the display.

  Via a second support shoulder presenting second contact surfaces which are close to the second contact surface of the counter-support of the control chip module, the control chip module is electrically connected to a unit. CPU and, if applicable, other electronic components, inside the data carrier, for example

  a battery, a keyboard, an antenna coil and the like.

  Another development of the invention provides that the control chip and the central processing unit CPU integrate into a common chip module, which advantageously comprises on its face turned towards the surface of the data carrier, contact zones for the transmission of data and / or energy by contact. Other goals, benefits and features will appear on reading the

  description of embodiments of the invention, in a non-limiting manner and in

  FIG. 1 shows a display and a control chip module, separated from one another; \\ HIRSCH6 \ PATENTS \ Patents \ 20800 \ 20890.doc - 6 March 2003 - 6/15

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  FIG. 2 represents the display and the control module of FIG. 1, combined. FIG. 3 represents the display of FIG. 1 and a chip module with a CPU central processing unit with the integrated control module, each being separated. ; Figure 4 shows the display and CPU chip CPU Unit of Figure 3 combined; Figs. 5 to 7 show successive method steps for implanting in a card body a display and a chip module; Figures 8a and 8b show the display module with the integrated control electronics according to the state of the art; and

  Figure 9 shows a cross-section of a control chip module.

  FIG. 1 represents a display 5, which is constructed in the usual manner in correspondence with the state of the art according to FIG. 8a on a base substrate 2 and

  is covered with a substrate 3 covering.

  The base substrate 2 protrudes on one edge under the covering substrate 3 and defines a support shoulder 6 for the support of the control chip module 7, which

  in Figure 1 is indicated as a separate component.

  o On the bearing shoulder 6, ends with a number, which is not specified in more detail of first contact surfaces 8, a corresponding number of unrepresented conductive tracks from and to the individual elements of the 5. The control chip module 7 comprises, on its side, counter-contact contact surfaces 9 which constitute components of a conductive track arrangement and which, together with the control chip module 7,

  the display 5, are placed on the contact surfaces 8 of the display 5.

  In FIG. 2, wind represents the display 5 and the control chip module 7 in an assembled arrangement corresponding to its arrangement in a smart card. It is recognized that the control chip module 7 is supported on the bearing shoulder 6 of the display 5 and that the surfaces of the control chip module 7 and the display 5 wind directly juxtapose to each other so that by observing from the side of the display board, neither the control electronics, nor the contact surfaces 8 or the counter-contact contact surfaces 9 are visible. In a more favorable manner, the display 5 and the control chip module 7 are optically complete in one unit, the control electronics

  being hidden beneath the surface of the control chip module 7.

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  Figures 3 and 4 show an alternative embodiment in which the control electronics for the display is integrated in the module.

  own chip or CPU 10's own chip module.

  The CPU Unit CPU chip module 10 structure corresponds to the already explicit structure of the control chip module 7, with the difference that the CPU chip module 10 in the embodiment example has instead of a chip module neutral back face, contact areas 11 for data and / or energy transfer transmitted by contact from and / or to an external data processing apparatus. FIG. 4 shows again the CPU chip module 10 in combination with the corresponding display 5.

  to the representation according to Figure 2.

  The contacting of the CPU chip module 10 with the display 5 is solved in the same way as for the control chip module 7 described in connection with

Figures 1 and 2.

  As will be explained by way of example, with reference to FIGS. 5 to 7, the manufacture of a smart card with a fader 5 and a control chip module 7 or a chip module 1 at the central unit. CPU processing. A card body 15 is first provided with a recess 16. The recess 16 may, for example, be milled in the card body. Alternatively, the card body 15 may be manufactured by an injection molding process with an integrated cavity 16. The card body can be made in one or more layers and in the exemplary embodiment shown, be integrated in a card body 15, with an insert 17 of conductive tracks which serves to connect inside the card body. the card the control chip module 7 or the module 10 has a CPU chip which serves to set up subsequently, other electronic components, for example switch, battery, keyboard, etc. inside the card. For this connection of the contact surfaces 18 of the insert 17 of the wind conductive track uncovered or in the case of the manufacture by casting under pressure, wind kept free, these contact surfaces

  ending with a support shoulder of the card body 15.

  In the recess 16, is then implanted a display 5. For this purpose, we can use the best suited bonding techniques. The display 5 may for example be stuck on the bottom of the recess 16 by means of a hot melt adhesive, or also by a cold adhesive. The display 5 is advantageously provided as a prefabric component and comprises the base substrate 2, a lower electrode on this base substrate 2, for example in the form of a layer of tin oxide and indium (ITO layer ) a display function layer 13, a higher electrode 12 also in the form of ITO layers,

  and above the substrate 3 covering.

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  The display 5 thus produced has a bearing shoulder 6 with contact surfaces 8 for the support and the contact of the control chip module 7 or the

  CPU chip module 10, to be implanted later.

  Fig. 6 shows the card body 15 with the display 5 implanted in the recess 16. The display 5 completes a cavity 19 forming a portion constituting the recess and having the dimensions of the chip module 10. The chip module 10 is a CPU module with dual interfaces with integrated control electronics. In fact, the chip module 10 has two interfaces, namely on the one hand the contact areas 11 on the face of the chip module rotated towards the surface of the card o for the data and / or the energy transfer dependent contact, as well as first and second surfaces 9 and 20 of contact (counter-support) on the lower face of the module for the contact of the chip model with the contact surfaces 8 of the display 5 on the one hand and the contact surfaces 18 of the insert 17 of conductive tracks on the other hand. CPU chip with integrated control electronics is merged into a flowing mass 21

chip coating.

  The chip module 10 has on its side shoulder pads on

  which supports the first and second counter contact surfaces 9, 20.

  The poured coating mass 19 is put into place in the cavity 19, so that the first and second counter-contact contact surfaces 9, 20 rest on the contact surfaces 8 of the display 5 and on the contact surfaces 18 of the insert 17 of conductive tracks. The contact surfaces 18 rest on the bearing shoulder of the card body 15 in a manner similar to the contact surfaces 8 on

  the support shoulder 6 of the display 5.

  2s The electrical contact of the contact surfaces 8, 9 or 18, 20 arranged one above the other is provided by an adhesive 22 anisotropic conductor. Alternatively, instead of an anisotropic conductive adhesive 22, an isotropic conductive adhesive or paste could be used to provide contact. Due to the large number of display contact surfaces 8, these normally dimensionally smaller wind surfaces have smaller spacing intervals than for example the contact areas 18 of the conductive track insert. A careful dosage of the adhesive is thus necessary in order to avoid a transverse connection

  between adjacent contact surfaces 8 or 9.

  According to another variant, the contact surfaces 8 or 18 and the surfaces of 3s backing contact 9 or 20 may have only touching contact in which case the chip module 10 is glued with a non-conductive adhesive, for example in the the shoulder areas of the display 5 and the card body 15, on the basis of FIG. 6, and FIG.

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  which zones, no contact surface 8 of the display 5 or no surface of

  Contact 18 of the insert 17 of conductive tracks is not expected.

  Figure 7 illustrates the card body 15 after placement of the display 5 and the chip module 10, both ending in alignment with the surface 25 of the card body 15. An additional layer of card cover ntest not necessary, but can be provided when needed. Where appropriate, the chip module 10 may also protrude on the surface of the display 5 and close the surface of the card flushly after applying a card cover layer.

o additional.

  Figure 9 shows a control chip module 7 in cross-section. The control chip 26 is placed centrally on an arrangement 24 of conductive tracks made as a conducting frame and is brought into contact with the arrangement of conductive tracks by electrical connections 25 made according to the wired connection technique. The chip 26 and the electrical connections 25 are embedded in a poured coating mass 21. A cover sheet 27 covers the chip module 7.

  command to constitute the outer face of the card.

  Of course, the present invention is not limited to the embodiments

  described and represented, but includes all the easily accessible

  those skilled in the art without departing from the scope of the present invention.

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Claims (22)

  1. A portable data carrier with display (5), in particular a chip card comprising a card body (15) with a recess (16), in which the wind support seats side-by-side with the display ( 5) and a control chip module (7; 10) for the selective control of individual elements of the display (5), in which the display 5 has, on the side of the control module, a first shoulder of support (6) with first contact surfaces (8) and the control chip module (7; 10) has the first contact surfaces (9) for counter-support, and in which support the chip module of control (7; 10) rests on the support shoulder (6) of the display (5), so that the first contact surfaces (9) of the counter-support of the control chip module (7;   rests on the first contact surfaces (8) of the display (5).   2. Data carrier according to claim 1, wherein the display (5) accommodates in the recess (16) complete side of the support shoulder a cavity.   (19) which is completely covered by the control chip module (7;   Data carrier according to claim 1 or 2, wherein the control chip module (7; 10) completely covers the first surfaces.   contact (8) of the first bearing shoulder (6) of the display (5).   4. Data carrier according to one of claims 1 to 3, wherein   the display (5) and the control chip module (7; 10) terminate   2s flush with a surface (23) of the data carrier.   Data carrier according to one of Claims 1 to 4, in which   for contacting the first control contact surface (9) of the control chip module (7; 10) with the first contact surfaces (8) of   the display (5) is an anisotropic conductive adhesive (22).   Data carrier according to one of Claims 1 to 4, in which   the contact surfaces (8) of the display (5) come into touching contact with the   counteracting contact surfaces (9) of the control chip module (7; 3s   Data carrier according to one of Claims 1 to 6, in which   the control chip module (7; 10) further rests on a second shoulder   support which is formed by the card body (15).   \\ HIRSCH6 \ PATENTS \ 13revets \ 20800 \ 20890.doe - 6th of March 2003 -11/15 12 2837306   Data carrier according to claim 7, wherein the second bearing shoulder comprises second contact surfaces (18) for contacting the control chip module (7; 10) with electronic components inside. of the data carrier, and wherein the control chip module (7; 10) has second counter-bearing contact surfaces (20), which   located above the contact surfaces (18) of the second support shoulder.   Data carrier according to one of Claims 1 to 8, in which   o the control electronics is integrated in a module (10) of Unite chip Central Processing CPU.   Data carrier according to claim 9, wherein the CPU chip module (10) has contact zones (11) which are arranged for data exchange by the contacts with an external processing device.   data on a surface (23) of the data carrier.   Data carrier according to one of Claims 1 to 10, in which   the control chip module (7) or CPU chip module (10) comprises an arrangement (24) of conductive tracks and a chip (26) connected to the arrangement of conductive tracks by connections electrics (25), the chip (26) and the electrical connections (25) being surrounded by a cast mass (21) chip coating.   2s 12. A method of manufacturing a portable data carrier with a slider (5), in particular a smart card comprising the steps of: - providing a display (5) having a first support shoulder (6) of the edge dimension with first contact surfaces (8), a control chip module (7; 10) for selectively controlling individual elements of the display (5) the control chip module (7; 10) having first abutting contact surfaces (9) for contacting the first contact surfaces (8) of the display, and a card body (15) with a recess (16) for receiving the display ( 5) and the control chip module (7; 10), - placing the slider (5) in the recess (16), so that in the recess (16) of the side of the shoulder of next to the slider (5), there is still room to put the control chip module (7; 10) in place. - 12/15 3 2837306   placing the control chip module in the recess (16) next to the display (5) so that the control chip module (7; 10) rests on the support shoulder (6). The display (5) and that the first contacting surfaces (9) of the control chip module (7; 10) rest against the first contact surfaces (8) of the display (5). 13. Method according to claim 12, including the step of manufacturing the card body (15) provided, wherein the recess (16) in the card body (15) is made so that the display (5) places in the recess (16) o complete the side of the shoulder support a cavity (19), in which is housed the control chip module (7;   The method of claim 13, wherein the recess (16) in the card body (15) is constructed such that the display (5) and the control chip module (7; flush with a surface (23) of the body Map.   15. The method of claim 13 or 14, wherein is created in the card body a second support shoulder, on which is pressed the module   (7; 10) of the control chip is inserted into the recess (16).   16. The method according to claim 15, wherein the second bearing surface of the second contact surfaces (18) is provided for contacting the control chip module (7; 10) with electrical components 2s in the second phase. data carrier, and wherein the control chip module (7; 10) has second counter-support contact surfaces (20) which, when the control chip module (7; 10) is in place, in the obvious (16) come to   place on the second contact surface (18) of the second support shoulder.   17. Method according to one of claims 12 to 16, comprising the step of   manufacturing the display (5) and / or the control chip module (7; 10), so that the control chip module (7; 10) is in place (16) , completely covers the first contact surfaces (8) of the first   support shoulder (6) of the display (5).   18. Process according to one of claims 12 to 17, in which the   first contact surfaces (8) located one above the other, of the display unit; 4 2837306   and first counter-bearing contact surfaces (9) of the chip module (7;   contact, wind contacted by means of an anisotropic conductive adhesive.   19. Process according to one of claims 12 to 17, in which the   s first contact surfaces 8 located one above the other of the display (5) and the first contact surfaces (9) against the support of the chip module (7;   order come in touching touch.   20. Method according to one of claims 12 to 19, wherein the module   lo (7; 10) of control chip is integrated in a module (10) of Unite chip   Central Processing CPU CPU data.   21. The method according to claim 20, wherein the CPU chip module (10) comprises zones (11) of contact which are arranged, for data exchange by the contacts with an external data processing member, on a surface (23) of the data carrier.   22. Method according to one of claims 12 to 21 wherein the module   Control chip module (7) or CPU module (10) comprises an arrangement of conductive tracks and a chip (26) connected to the arrangement of conductive tracks by electrical connections (25), the chip (26). and electrical connections (25)   being surrounded by a casting mass (21).