FR2815721B1 - Sabot de test de composants et procede de realisation d'un tel sabot - Google Patents

Sabot de test de composants et procede de realisation d'un tel sabot

Info

Publication number
FR2815721B1
FR2815721B1 FR0013616A FR0013616A FR2815721B1 FR 2815721 B1 FR2815721 B1 FR 2815721B1 FR 0013616 A FR0013616 A FR 0013616A FR 0013616 A FR0013616 A FR 0013616A FR 2815721 B1 FR2815721 B1 FR 2815721B1
Authority
FR
France
Prior art keywords
shoe
making
component test
component
test shoe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0013616A
Other languages
English (en)
Other versions
FR2815721A1 (fr
Inventor
Francois Baleras
Manquat Catherine Brunet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0013616A priority Critical patent/FR2815721B1/fr
Priority to PCT/FR2001/003287 priority patent/WO2002035244A1/fr
Priority to US10/399,844 priority patent/US6835577B2/en
Priority to EP01980634A priority patent/EP1332375A1/fr
Publication of FR2815721A1 publication Critical patent/FR2815721A1/fr
Application granted granted Critical
Publication of FR2815721B1 publication Critical patent/FR2815721B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)
FR0013616A 2000-10-24 2000-10-24 Sabot de test de composants et procede de realisation d'un tel sabot Expired - Fee Related FR2815721B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0013616A FR2815721B1 (fr) 2000-10-24 2000-10-24 Sabot de test de composants et procede de realisation d'un tel sabot
PCT/FR2001/003287 WO2002035244A1 (fr) 2000-10-24 2001-10-23 Procede de realisation d'un sabot de test de composants
US10/399,844 US6835577B2 (en) 2000-10-24 2001-10-23 Method for making a block for testing components
EP01980634A EP1332375A1 (fr) 2000-10-24 2001-10-23 Procede de realisation d'un sabot de test de composants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0013616A FR2815721B1 (fr) 2000-10-24 2000-10-24 Sabot de test de composants et procede de realisation d'un tel sabot

Publications (2)

Publication Number Publication Date
FR2815721A1 FR2815721A1 (fr) 2002-04-26
FR2815721B1 true FR2815721B1 (fr) 2002-11-29

Family

ID=8855678

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0013616A Expired - Fee Related FR2815721B1 (fr) 2000-10-24 2000-10-24 Sabot de test de composants et procede de realisation d'un tel sabot

Country Status (4)

Country Link
US (1) US6835577B2 (fr)
EP (1) EP1332375A1 (fr)
FR (1) FR2815721B1 (fr)
WO (1) WO2002035244A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7239024B2 (en) * 2003-04-04 2007-07-03 Thomas Joel Massingill Semiconductor package with recess for die
CN112379238B (zh) * 2020-10-14 2023-07-28 安徽科技学院 一种tfet器件研究用模拟系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5716218A (en) * 1991-06-04 1998-02-10 Micron Technology, Inc. Process for manufacturing an interconnect for testing a semiconductor die
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US6016060A (en) * 1997-03-25 2000-01-18 Micron Technology, Inc. Method, apparatus and system for testing bumped semiconductor components
US5931685A (en) * 1997-06-02 1999-08-03 Micron Technology, Inc. Interconnect for making temporary electrical connections with bumped semiconductor components
US6130148A (en) * 1997-12-12 2000-10-10 Farnworth; Warren M. Interconnect for semiconductor components and method of fabrication
US5951305A (en) * 1998-07-09 1999-09-14 Tessera, Inc. Lidless socket and method of making same
US6208156B1 (en) * 1998-09-03 2001-03-27 Micron Technology, Inc. Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems
US6242932B1 (en) * 1999-02-19 2001-06-05 Micron Technology, Inc. Interposer for semiconductor components having contact balls
US6263566B1 (en) * 1999-05-03 2001-07-24 Micron Technology, Inc. Flexible semiconductor interconnect fabricated by backslide thinning
US6285203B1 (en) * 1999-06-14 2001-09-04 Micron Technology, Inc. Test system having alignment member for aligning semiconductor components

Also Published As

Publication number Publication date
FR2815721A1 (fr) 2002-04-26
US20040070925A1 (en) 2004-04-15
US6835577B2 (en) 2004-12-28
EP1332375A1 (fr) 2003-08-06
WO2002035244A1 (fr) 2002-05-02

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110630