FR2810768B1 - METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD - Google Patents

METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD

Info

Publication number
FR2810768B1
FR2810768B1 FR0008188A FR0008188A FR2810768B1 FR 2810768 B1 FR2810768 B1 FR 2810768B1 FR 0008188 A FR0008188 A FR 0008188A FR 0008188 A FR0008188 A FR 0008188A FR 2810768 B1 FR2810768 B1 FR 2810768B1
Authority
FR
France
Prior art keywords
chip cards
manufacturing hybrid
manufacturing
hybrid chip
cards obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0008188A
Other languages
French (fr)
Other versions
FR2810768A1 (en
Inventor
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0008188A priority Critical patent/FR2810768B1/en
Priority to PCT/FR2001/001798 priority patent/WO2002001495A1/en
Priority to AU2001267626A priority patent/AU2001267626A1/en
Publication of FR2810768A1 publication Critical patent/FR2810768A1/en
Application granted granted Critical
Publication of FR2810768B1 publication Critical patent/FR2810768B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
FR0008188A 2000-06-26 2000-06-26 METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD Expired - Fee Related FR2810768B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0008188A FR2810768B1 (en) 2000-06-26 2000-06-26 METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD
PCT/FR2001/001798 WO2002001495A1 (en) 2000-06-26 2001-06-08 Hybrid card with ohmic contact and delocalized sinks
AU2001267626A AU2001267626A1 (en) 2000-06-26 2001-06-08 Hybrid card with ohmic contact and delocalized sinks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0008188A FR2810768B1 (en) 2000-06-26 2000-06-26 METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD

Publications (2)

Publication Number Publication Date
FR2810768A1 FR2810768A1 (en) 2001-12-28
FR2810768B1 true FR2810768B1 (en) 2003-11-28

Family

ID=8851692

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0008188A Expired - Fee Related FR2810768B1 (en) 2000-06-26 2000-06-26 METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD

Country Status (3)

Country Link
AU (1) AU2001267626A1 (en)
FR (1) FR2810768B1 (en)
WO (1) WO2002001495A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1582515A (en) 2001-12-10 2005-02-16 弗拉克托斯股份有限公司 Contactless identification device
JP2006505973A (en) 2002-11-07 2006-02-16 フラクタス・ソシエダッド・アノニマ Integrated circuit package including micro antenna
WO2006008180A1 (en) 2004-07-23 2006-01-26 Fractus S.A. Antenna in package with reduced electromagnetic interaction with on chip elements
US8196829B2 (en) 2006-06-23 2012-06-12 Fractus, S.A. Chip module, sim card, wireless device and wireless communication method
FR3013504B1 (en) 2013-11-18 2022-06-10 Interplex Microtech METHOD FOR MANUFACTURING AN ELECTRONIC CHIP HOLDER, CHIP HOLDER AND SET OF SUCH HOLDERS
FR3021145B1 (en) 2014-05-14 2018-08-31 Linxens Holding METHOD FOR MANUFACTURING A CIRCUIT FOR A CHIP CARD MODULE AND CIRCUIT FOR A CHIP CARD MODULE
FR3083892B1 (en) * 2018-07-16 2020-07-03 Smart Packaging Solutions DUAL COMMUNICATION INTERFACE CHIP CARD AND MANUFACTURING METHOD THEREOF
FR3123778A1 (en) * 2021-06-07 2022-12-09 Eyco Process for manufacturing a printed circuit integrating an electronic component and smart card module obtained by said process.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610044C2 (en) * 1996-03-14 2000-02-24 Pav Card Gmbh Card body and method for producing a chip card
EP0818752A2 (en) * 1996-07-08 1998-01-14 Fela Holding AG Inlet for chipcards
FR2753819B1 (en) * 1996-09-20 1998-11-27 INTEGRATED CIRCUIT BOARD WITH MIXED CONNECTION
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD

Also Published As

Publication number Publication date
WO2002001495A1 (en) 2002-01-03
FR2810768A1 (en) 2001-12-28
AU2001267626A1 (en) 2002-01-08

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100226