FR2806249B1 - MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS - Google Patents

MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS

Info

Publication number
FR2806249B1
FR2806249B1 FR0003174A FR0003174A FR2806249B1 FR 2806249 B1 FR2806249 B1 FR 2806249B1 FR 0003174 A FR0003174 A FR 0003174A FR 0003174 A FR0003174 A FR 0003174A FR 2806249 B1 FR2806249 B1 FR 2806249B1
Authority
FR
France
Prior art keywords
cut
mounting
out circuits
lamp supports
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0003174A
Other languages
French (fr)
Other versions
FR2806249A1 (en
Inventor
Jean Paul Mauviere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie dEquipements Automobiles Axo Scintex SA
Original Assignee
Compagnie dEquipements Automobiles Axo Scintex SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie dEquipements Automobiles Axo Scintex SA filed Critical Compagnie dEquipements Automobiles Axo Scintex SA
Priority to FR0003174A priority Critical patent/FR2806249B1/en
Publication of FR2806249A1 publication Critical patent/FR2806249A1/en
Application granted granted Critical
Publication of FR2806249B1 publication Critical patent/FR2806249B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10113—Lamp
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
FR0003174A 2000-03-13 2000-03-13 MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS Expired - Fee Related FR2806249B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0003174A FR2806249B1 (en) 2000-03-13 2000-03-13 MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0003174A FR2806249B1 (en) 2000-03-13 2000-03-13 MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS

Publications (2)

Publication Number Publication Date
FR2806249A1 FR2806249A1 (en) 2001-09-14
FR2806249B1 true FR2806249B1 (en) 2002-05-10

Family

ID=8848007

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0003174A Expired - Fee Related FR2806249B1 (en) 2000-03-13 2000-03-13 MOUNTING OF CUT-OUT CIRCUITS ON LAMP SUPPORTS

Country Status (1)

Country Link
FR (1) FR2806249B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005096683A1 (en) * 2004-03-31 2005-10-13 Mitsubishi Cable Industries, Ltd. Circuit board, its manufacturing method, and joint box using circuit board
DE102005006638B4 (en) * 2005-02-14 2009-01-02 Siemens Ag Adhesive conductor on insulating layer
US7641491B2 (en) * 2007-04-23 2010-01-05 Lutron Electronics Co., Inc. Load control device having a flexible connector
DE202009004984U1 (en) * 2009-07-03 2009-08-27 Kiekert Ag Motor vehicle lock consisting of mechanical and electrical, electromotive and / or electronic components

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3108360A (en) * 1960-10-08 1963-10-29 Hackler Ludwig Method of making electrical circuits
US4489999A (en) * 1983-02-15 1984-12-25 Motorola, Inc. Socket and flexible PC board assembly and method for making
FR2600022B1 (en) * 1986-06-16 1988-09-16 Axo Equip Automobile OPTICAL BLOCK FOR VEHICLE
US4781600A (en) * 1986-06-25 1988-11-01 Yazaki Corporation Junction box and a process of assembling the same
US4894018A (en) * 1988-08-08 1990-01-16 General Motors Corporation Low profile electrical connector
US5527187A (en) * 1994-11-17 1996-06-18 Ford Motor Company Compliant electrical interconnect

Also Published As

Publication number Publication date
FR2806249A1 (en) 2001-09-14

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
CJ Change in legal form
ST Notification of lapse

Effective date: 20121130