FR2803097B1 - Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede - Google Patents

Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede

Info

Publication number
FR2803097B1
FR2803097B1 FR9916593A FR9916593A FR2803097B1 FR 2803097 B1 FR2803097 B1 FR 2803097B1 FR 9916593 A FR9916593 A FR 9916593A FR 9916593 A FR9916593 A FR 9916593A FR 2803097 B1 FR2803097 B1 FR 2803097B1
Authority
FR
France
Prior art keywords
electronic device
housing
implementing
multifunctional coating
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9916593A
Other languages
English (en)
Other versions
FR2803097A1 (fr
Inventor
Claude Sarno
Jean Bernard Dezord
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Avionics SAS
Original Assignee
Thales Avionics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Avionics SAS filed Critical Thales Avionics SAS
Priority to FR9916593A priority Critical patent/FR2803097B1/fr
Publication of FR2803097A1 publication Critical patent/FR2803097A1/fr
Application granted granted Critical
Publication of FR2803097B1 publication Critical patent/FR2803097B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
FR9916593A 1999-12-28 1999-12-28 Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede Expired - Fee Related FR2803097B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9916593A FR2803097B1 (fr) 1999-12-28 1999-12-28 Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9916593A FR2803097B1 (fr) 1999-12-28 1999-12-28 Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede

Publications (2)

Publication Number Publication Date
FR2803097A1 FR2803097A1 (fr) 2001-06-29
FR2803097B1 true FR2803097B1 (fr) 2003-01-10

Family

ID=9553926

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9916593A Expired - Fee Related FR2803097B1 (fr) 1999-12-28 1999-12-28 Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede

Country Status (1)

Country Link
FR (1) FR2803097B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019096B4 (de) 2007-04-23 2015-03-12 Continental Automotive Gmbh Elektronikgehäuse

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778155A (en) * 1980-10-31 1982-05-15 Matsushita Electric Works Ltd Sealing method for electric device
US5075821A (en) * 1990-11-05 1991-12-24 Ro Associates DC to DC converter apparatus
FR2674177B1 (fr) * 1991-03-20 1993-06-25 Telemecanique Procede pour noyer dans de la resine l'interieur d'un appareil electrique tel que detecteur de proximite, et appareil electrique s'y rapportant.
JPH05335758A (ja) * 1992-06-01 1993-12-17 Yamatake Honeywell Co Ltd 電気部品の密封方法
DE4407782C2 (de) * 1994-03-09 1997-08-28 Braun Ag Gehäuse für ein elektrisches Gerät sowie Verfahren zum Einbringen von Vergußmasse in das Gehäuse

Also Published As

Publication number Publication date
FR2803097A1 (fr) 2001-06-29

Similar Documents

Publication Publication Date Title
ZA200001492B (en) A technique for centrally tracking transactions in an electronic billing system.
DE60031808D1 (de) Vorrichtung mit einem Kältemittelkreislauf
DE59912889D1 (de) Vorrichtung zur Überwachung eines Gefässzuganges
DE69736859D1 (de) Vorrichtung zum herstellen von metal zum halbflüssigen verarbeiten
DE69817943D1 (de) Vorrichtung mit einem Kühlkreislauf
FR2788898B1 (fr) Dispositif electrique a economiseur d'energie et procede pour economiser l'energie dans un dispositif electrique, notamment pour le domaine medical
FR2842294B1 (fr) Procede et dispositif pour corriger le signal de sortie d'un resolveur
DE60021191D1 (de) Vorrichtung zum elektronischen terminkalender
FR2810157B1 (fr) Procede de realisation d'un composant electronique a source, drain et grille auto-allignes, en architecture damascene
FR2769440B1 (fr) Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
FR2781493B1 (fr) Enduit magnetique, procede d'enduction mettant en oeuvre un tel enduit et dispositif pour la mise en oeuvre du procede
DE59906429D1 (de) Elektronische Vorrichtung
FR2781065B1 (fr) Procede de placement-routage d'un circuit d'horloge globale sur un circuit integre, et dispositifs associes
FR2734923B1 (fr) Lame elastique, dispositif de developpement l'utilisant et procede pour sa fabrication
FR2790347B1 (fr) Procede de securisation d'un enchainement d'operations realisees par un circuit electronique dans le cadre de l'execution d'un algorithme
DE69600389D1 (de) Stossgeschützte elektronische Vorrichtung durch Einkapsulierung
FR2817974B1 (fr) Micro-actionneur optique, composant optique utilisant le micro-actionneur, et procede de realisation d'un micro-actionneur optique
FR2803097B1 (fr) Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede
FR2787519B1 (fr) Dispositif d'injection et procede de mise en oeuvre associe
FR2749680B1 (fr) Dispositif pour la securisation de transactions informatisees, notamment pour le paiement electronique
FR2804264B1 (fr) Procede et dispositif de paiement electronique
GB2339949B (en) An apparatus for conducting a secure electronic transaction
FR2831739B1 (fr) Procede de mise en oeuvre securisee d'un module fonctionnel, dans un composant electronique et composant correspondant
FR2811442B1 (fr) Procede de generation d'une cle electronique a partir d'un nombre premier compris dans un intervalle determine et dispositif de mise en oeuvre du procede
FR2830496B1 (fr) Dispositif antivol, procede de mise en oeuvre d'un tel dispositif et elements constitutifs de celui-ci

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060831