FR2796761B1 - METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE - Google Patents
METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATEInfo
- Publication number
- FR2796761B1 FR2796761B1 FR9909605A FR9909605A FR2796761B1 FR 2796761 B1 FR2796761 B1 FR 2796761B1 FR 9909605 A FR9909605 A FR 9909605A FR 9909605 A FR9909605 A FR 9909605A FR 2796761 B1 FR2796761 B1 FR 2796761B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- connection balls
- laying connection
- laying
- balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Feeding Of Articles To Conveyors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909605A FR2796761B1 (en) | 1999-07-23 | 1999-07-23 | METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE |
JP2000220541A JP3405714B2 (en) | 1999-07-23 | 2000-07-21 | Method and apparatus for installing connection ball on substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909605A FR2796761B1 (en) | 1999-07-23 | 1999-07-23 | METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2796761A1 FR2796761A1 (en) | 2001-01-26 |
FR2796761B1 true FR2796761B1 (en) | 2003-07-25 |
Family
ID=9548464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9909605A Expired - Fee Related FR2796761B1 (en) | 1999-07-23 | 1999-07-23 | METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3405714B2 (en) |
FR (1) | FR2796761B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3803556B2 (en) * | 2001-03-26 | 2006-08-02 | 日本電気株式会社 | Ball transfer device and ball alignment device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138339B (en) * | 1983-04-19 | 1986-05-14 | Welwyn Electronics Ltd | Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads |
JPH0878422A (en) * | 1994-09-08 | 1996-03-22 | Hitachi Ltd | Forming method of ball-shaped outer electrode |
DE19719177C1 (en) * | 1997-05-06 | 1998-10-01 | Martin Umwelt & Energietech | Solder ball application method for ball grid array component |
JP3402172B2 (en) * | 1998-01-05 | 2003-04-28 | 松下電器産業株式会社 | Apparatus and method for mounting conductive ball |
-
1999
- 1999-07-23 FR FR9909605A patent/FR2796761B1/en not_active Expired - Fee Related
-
2000
- 2000-07-21 JP JP2000220541A patent/JP3405714B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2001077147A (en) | 2001-03-23 |
FR2796761A1 (en) | 2001-01-26 |
JP3405714B2 (en) | 2003-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20120330 |