FR2796761B1 - METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE - Google Patents

METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE

Info

Publication number
FR2796761B1
FR2796761B1 FR9909605A FR9909605A FR2796761B1 FR 2796761 B1 FR2796761 B1 FR 2796761B1 FR 9909605 A FR9909605 A FR 9909605A FR 9909605 A FR9909605 A FR 9909605A FR 2796761 B1 FR2796761 B1 FR 2796761B1
Authority
FR
France
Prior art keywords
substrate
connection balls
laying connection
laying
balls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9909605A
Other languages
French (fr)
Other versions
FR2796761A1 (en
Inventor
Michel Massiot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SOREP ERULEC
Original Assignee
SOREP ERULEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SOREP ERULEC filed Critical SOREP ERULEC
Priority to FR9909605A priority Critical patent/FR2796761B1/en
Priority to JP2000220541A priority patent/JP3405714B2/en
Publication of FR2796761A1 publication Critical patent/FR2796761A1/en
Application granted granted Critical
Publication of FR2796761B1 publication Critical patent/FR2796761B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Feeding Of Articles To Conveyors (AREA)
FR9909605A 1999-07-23 1999-07-23 METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE Expired - Fee Related FR2796761B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9909605A FR2796761B1 (en) 1999-07-23 1999-07-23 METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE
JP2000220541A JP3405714B2 (en) 1999-07-23 2000-07-21 Method and apparatus for installing connection ball on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9909605A FR2796761B1 (en) 1999-07-23 1999-07-23 METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE

Publications (2)

Publication Number Publication Date
FR2796761A1 FR2796761A1 (en) 2001-01-26
FR2796761B1 true FR2796761B1 (en) 2003-07-25

Family

ID=9548464

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9909605A Expired - Fee Related FR2796761B1 (en) 1999-07-23 1999-07-23 METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE

Country Status (2)

Country Link
JP (1) JP3405714B2 (en)
FR (1) FR2796761B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3803556B2 (en) * 2001-03-26 2006-08-02 日本電気株式会社 Ball transfer device and ball alignment device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138339B (en) * 1983-04-19 1986-05-14 Welwyn Electronics Ltd Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads
JPH0878422A (en) * 1994-09-08 1996-03-22 Hitachi Ltd Forming method of ball-shaped outer electrode
DE19719177C1 (en) * 1997-05-06 1998-10-01 Martin Umwelt & Energietech Solder ball application method for ball grid array component
JP3402172B2 (en) * 1998-01-05 2003-04-28 松下電器産業株式会社 Apparatus and method for mounting conductive ball

Also Published As

Publication number Publication date
JP2001077147A (en) 2001-03-23
FR2796761A1 (en) 2001-01-26
JP3405714B2 (en) 2003-05-12

Similar Documents

Publication Publication Date Title
FR2767603B1 (en) METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE ON A SEMICONDUCTOR SUBSTRATE
FR2817042B1 (en) METHOD AND DEVICE FOR ANALYZING THE SURFACE OF A SUBSTRATE
FR2773603B1 (en) DEVICE AND METHOD FOR INSTALLING VERY LARGE DEPTH PIPES
FR2792458B1 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
FR2767945B1 (en) METHOD AND SYSTEM FOR INSTALLING AND TESTING SOFTWARE ON A CUSTOM COMPUTER SYSTEM
FR2788881B1 (en) METHOD FOR IMPLANTING SEMICONDUCTOR DEVICE
FR2776128B1 (en) INDUCTANCE DEVICE FORMED ON A SEMICONDUCTOR SUBSTRATE
FR2776831B1 (en) DEVICE COMPRISING A MOS TRANSISTOR AND METHOD FOR DEVELOPING SUCH A DEVICE ON A SOIL SUBSTRATE
FR2769406B1 (en) SEMICONDUCTOR SUBSTRATE HAVING A BURIED OXIDE FILM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
FR2802676B1 (en) METHOD AND DEVICE FOR DEPLOYING A DISTRIBUTED SUPERVISION
FR2772982B1 (en) ANODE SUBSTRATE FOR A DISPLAY DEVICE AND ITS MANUFACTURING METHOD
FR2797716B1 (en) SEMICONDUCTOR DEVICE ON SOI SUBSTRATE
FR2797523B1 (en) METHOD FOR INSPECTING A SEMICONDUCTOR SUBSTRATE
FR2776124B1 (en) SEMICONDUCTOR DEVICE WITH DIODE AND MANUFACTURING METHOD
FR2770030B1 (en) SEMICONDUCTOR DEVICE INCLUDING MOS TRANSISTOR AND MANUFACTURING METHOD
FR2796024B1 (en) COOLING BRAKE METHOD AND DEVICE
FR2796219B1 (en) DEVICE AND METHOD FOR CONTROLLING A PIEZOELECTRIC ACTUATOR
FR2807873B1 (en) METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING A SELF SUBSTRATE
FR2744300B1 (en) METHOD AND DEVICE FOR CONTROLLING A ZVS CIRCUIT
FR2868976B1 (en) DEVICE AND METHOD FOR PLACING AN ELASTICALLY DEFORMABLE JOINT ON A TUBE
FR2796761B1 (en) METHOD AND DEVICE FOR LAYING CONNECTION BALLS ON A SUBSTRATE
FR2752380B1 (en) METHOD FOR MANUFACTURING A CONTROLLED RELEASE DEVICE
FR2782839B1 (en) METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
FR2792118B1 (en) METHOD AND DEVICE FOR INTERCONNECTING TERMINALS
FR2765644B1 (en) METHOD AND DEVICE FOR CONTROLLING A CLUTCH

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120330