FR2777734B1 - Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte - Google Patents

Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte

Info

Publication number
FR2777734B1
FR2777734B1 FR9804666A FR9804666A FR2777734B1 FR 2777734 B1 FR2777734 B1 FR 2777734B1 FR 9804666 A FR9804666 A FR 9804666A FR 9804666 A FR9804666 A FR 9804666A FR 2777734 B1 FR2777734 B1 FR 2777734B1
Authority
FR
France
Prior art keywords
board
radiator
assembly
printed circuit
power components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9804666A
Other languages
English (en)
Other versions
FR2777734A1 (fr
Inventor
Olivier Ploix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9804666A priority Critical patent/FR2777734B1/fr
Priority to IT1999TO000288A priority patent/ITTO990288A1/it
Publication of FR2777734A1 publication Critical patent/FR2777734A1/fr
Application granted granted Critical
Publication of FR2777734B1 publication Critical patent/FR2777734B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
FR9804666A 1998-04-15 1998-04-15 Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte Expired - Lifetime FR2777734B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9804666A FR2777734B1 (fr) 1998-04-15 1998-04-15 Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte
IT1999TO000288A ITTO990288A1 (it) 1998-04-15 1999-04-13 Insieme di scheda a circuito stampato con componenti di potenza e diradiatore per la scheda.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9804666A FR2777734B1 (fr) 1998-04-15 1998-04-15 Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte

Publications (2)

Publication Number Publication Date
FR2777734A1 FR2777734A1 (fr) 1999-10-22
FR2777734B1 true FR2777734B1 (fr) 2004-07-09

Family

ID=9525243

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9804666A Expired - Lifetime FR2777734B1 (fr) 1998-04-15 1998-04-15 Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte

Country Status (2)

Country Link
FR (1) FR2777734B1 (fr)
IT (1) ITTO990288A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657866B2 (en) * 2002-03-15 2003-12-02 Robert C. Morelock Electronics assembly with improved heatsink configuration
EP1395098B1 (fr) 2002-09-02 2009-08-26 Eberspächer catem GmbH & Co. KG Chauffage électrique pour véhicule
DE102005047025A1 (de) 2005-09-30 2007-04-05 Siemens Ag Leiterplatte
DE102012204133A1 (de) * 2012-03-16 2013-09-19 Continental Automotive Gmbh Verfahren, Vorrichtung und System für eine Leistungsschaltung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383270A (en) * 1980-07-10 1983-05-10 Rca Corporation Structure for mounting a semiconductor chip to a metal core substrate
DE4240996C1 (de) * 1992-12-05 1994-06-16 Bosch Gmbh Robert Verfahren zur Herstellung einer Verbundanordnung
US5457605A (en) * 1993-11-23 1995-10-10 Motorola, Inc. Electronic device having coplanar heatsink and electrical contacts
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module

Also Published As

Publication number Publication date
ITTO990288A1 (it) 2000-10-13
FR2777734A1 (fr) 1999-10-22
ITTO990288A0 (it) 1999-04-13

Similar Documents

Publication Publication Date Title
DE69800514D1 (de) Leiterplatte mit primären und sekundären Durchgangslöchern
DE69841252D1 (de) Gedruckte leiterplatte
DE69626747T2 (de) Gedruckte Leiterplatte und ihre Anordnung
DE69812221D1 (de) Gedruckte Leiterplatte
AU4428396A (en) Printed circuit board and heat sink arrangement
EP0674473A3 (fr) Assemblage directe pour les plaquettes à circuits imprimés.
DE69636930D1 (de) Schaltungsplatte und Schaltungsplattenanordnung
DE69837520D1 (de) Gedruckte Leiterplatte
DE69514053T2 (de) Leiterplatte mit bimetallischer Wärmesenke
EP1034619A4 (fr) Circuit de reenclenchement d'alimentation a puissance nulle
EP0715489A3 (fr) Assemblage de panneaux à circuit imprimé
FR2777734B1 (fr) Ensemble d'une carte de circuit imprime a composants de puissance et d'un radiateur pour la carte
DE69636329D1 (de) Merschichtige gedruckte leiterplatte
FR2753819B1 (fr) Carte a circuit integre a connexion mixte
DE69827754D1 (de) Gedruckte Schaltungsplatte
FR2753044B1 (fr) Procede d'assemblage de composants electroniques sur une carte de circuit imprime
FR2766051B1 (fr) Ensemble d'une carte de circuit imprime associee a des moyens de dissipation de l'energie thermique du circuit
DE9413819U1 (de) Durchkontaktierungen aufweisende Leiterplatte
GB9610002D0 (en) Heat sink and circuit board assembly
GB2328088B (en) The interconnection of electronic circuit boards
KR960019548U (ko) 인쇄회로기판 조립구조
FR2706729B1 (fr) Radiateur pour composants électroniques de puissance.
KR960026283U (ko) 인쇄 회로 기판
KR950028995U (ko) 인쇄회로기판
DE29602417U1 (de) Elektronische Baugruppe mit Leiterplatte und Kühlkörper

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 18

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20