FR2768860B1 - STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS - Google Patents
STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITSInfo
- Publication number
- FR2768860B1 FR2768860B1 FR9712168A FR9712168A FR2768860B1 FR 2768860 B1 FR2768860 B1 FR 2768860B1 FR 9712168 A FR9712168 A FR 9712168A FR 9712168 A FR9712168 A FR 9712168A FR 2768860 B1 FR2768860 B1 FR 2768860B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuits
- repairing integrated
- repairing
- circuits
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9712168A FR2768860B1 (en) | 1997-09-25 | 1997-09-25 | STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS |
US09/152,778 US6236228B1 (en) | 1997-09-25 | 1998-09-14 | Structure and method of repair of integrated circuits |
EP98410107A EP0905766B1 (en) | 1997-09-25 | 1998-09-24 | Structure and method to repair integrated circuits |
DE69837980T DE69837980D1 (en) | 1997-09-25 | 1998-09-24 | Structure and method for repairing an integrated circuit |
US09/911,344 US6586961B2 (en) | 1997-09-25 | 2001-07-23 | Structure and method of repair of integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9712168A FR2768860B1 (en) | 1997-09-25 | 1997-09-25 | STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2768860A1 FR2768860A1 (en) | 1999-03-26 |
FR2768860B1 true FR2768860B1 (en) | 1999-11-26 |
Family
ID=9511644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9712168A Expired - Fee Related FR2768860B1 (en) | 1997-09-25 | 1997-09-25 | STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS |
Country Status (4)
Country | Link |
---|---|
US (2) | US6236228B1 (en) |
EP (1) | EP0905766B1 (en) |
DE (1) | DE69837980D1 (en) |
FR (1) | FR2768860B1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2768860B1 (en) | 1997-09-25 | 1999-11-26 | Sgs Thomson Microelectronics | STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS |
US20050144524A1 (en) * | 2003-12-04 | 2005-06-30 | International Business Machines Corporation | Digital reliability monitor having autonomic repair and notification capability |
US7287177B2 (en) * | 2003-12-04 | 2007-10-23 | International Business Machines Corporation | Digital reliability monitor having autonomic repair and notification capability |
KR100718216B1 (en) * | 2004-12-13 | 2007-05-15 | 가부시끼가이샤 도시바 | Semiconductor device, pattern layout designing method, exposure mask |
WO2015015319A2 (en) * | 2013-05-03 | 2015-02-05 | Blackcomb Design Automation Inc. | Architecture of spare wiring structures for improved engineering change orders |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679967A (en) * | 1985-01-20 | 1997-10-21 | Chip Express (Israel) Ltd. | Customizable three metal layer gate array devices |
US5512397A (en) | 1988-05-16 | 1996-04-30 | Leedy; Glenn J. | Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
DE69322667D1 (en) * | 1992-02-18 | 1999-02-04 | Elm Technology Corp | Lithography as needed for integrated circuits |
JPH06125067A (en) * | 1992-10-12 | 1994-05-06 | Mitsubishi Electric Corp | Semiconductor integrated circuit and designing method therefor |
JP2909328B2 (en) * | 1992-11-02 | 1999-06-23 | 株式会社東芝 | Field programmable gate array |
US5777887A (en) * | 1995-05-12 | 1998-07-07 | Crosspoint Solutions, Inc. | FPGA redundancy |
US5798937A (en) * | 1995-09-28 | 1998-08-25 | Motorola, Inc. | Method and apparatus for forming redundant vias between conductive layers of an integrated circuit |
FR2741475B1 (en) * | 1995-11-17 | 2000-05-12 | Commissariat Energie Atomique | METHOD OF MANUFACTURING A MICRO-ELECTRONICS DEVICE INCLUDING A PLURALITY OF INTERCONNECTED ELEMENTS ON A SUBSTRATE |
US5892249A (en) * | 1996-02-23 | 1999-04-06 | National Semiconductor Corporation | Integrated circuit having reprogramming cell |
FR2768860B1 (en) | 1997-09-25 | 1999-11-26 | Sgs Thomson Microelectronics | STRUCTURE AND METHOD FOR REPAIRING INTEGRATED CIRCUITS |
US6404226B1 (en) * | 1999-09-21 | 2002-06-11 | Lattice Semiconductor Corporation | Integrated circuit with standard cell logic and spare gates |
-
1997
- 1997-09-25 FR FR9712168A patent/FR2768860B1/en not_active Expired - Fee Related
-
1998
- 1998-09-14 US US09/152,778 patent/US6236228B1/en not_active Expired - Lifetime
- 1998-09-24 DE DE69837980T patent/DE69837980D1/en not_active Expired - Lifetime
- 1998-09-24 EP EP98410107A patent/EP0905766B1/en not_active Expired - Lifetime
-
2001
- 2001-07-23 US US09/911,344 patent/US6586961B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0905766B1 (en) | 2007-06-27 |
FR2768860A1 (en) | 1999-03-26 |
DE69837980D1 (en) | 2007-08-09 |
EP0905766A1 (en) | 1999-03-31 |
US20020093037A1 (en) | 2002-07-18 |
US6586961B2 (en) | 2003-07-01 |
US6236228B1 (en) | 2001-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |
Effective date: 20060531 |