FR2756975B1 - INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME - Google Patents

INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME

Info

Publication number
FR2756975B1
FR2756975B1 FR9614946A FR9614946A FR2756975B1 FR 2756975 B1 FR2756975 B1 FR 2756975B1 FR 9614946 A FR9614946 A FR 9614946A FR 9614946 A FR9614946 A FR 9614946A FR 2756975 B1 FR2756975 B1 FR 2756975B1
Authority
FR
France
Prior art keywords
integrated circuit
insulating layer
same
active face
face covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9614946A
Other languages
French (fr)
Other versions
FR2756975A1 (en
Inventor
Alain Larchevesque
Mickael Mande
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to FR9614946A priority Critical patent/FR2756975B1/en
Priority to DE1997154125 priority patent/DE19754125A1/en
Publication of FR2756975A1 publication Critical patent/FR2756975A1/en
Application granted granted Critical
Publication of FR2756975B1 publication Critical patent/FR2756975B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9614946A 1996-12-05 1996-12-05 INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME Expired - Fee Related FR2756975B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9614946A FR2756975B1 (en) 1996-12-05 1996-12-05 INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME
DE1997154125 DE19754125A1 (en) 1996-12-05 1997-12-05 Integrated circuit with active area for chip card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9614946A FR2756975B1 (en) 1996-12-05 1996-12-05 INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME

Publications (2)

Publication Number Publication Date
FR2756975A1 FR2756975A1 (en) 1998-06-12
FR2756975B1 true FR2756975B1 (en) 1999-05-07

Family

ID=9498368

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9614946A Expired - Fee Related FR2756975B1 (en) 1996-12-05 1996-12-05 INTEGRATED CIRCUIT HAVING AN ACTIVE FACE COVERED WITH AN INSULATING LAYER AND INTEGRATED CIRCUIT CARD COMPRISING SAME

Country Status (2)

Country Link
DE (1) DE19754125A1 (en)
FR (1) FR2756975B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2671417B1 (en) * 1991-01-04 1995-03-24 Solaic Sa PROCESS FOR THE MANUFACTURE OF A MEMORY CARD AND MEMORY CARD THUS OBTAINED.
FR2735284B1 (en) * 1995-06-12 1997-08-29 Solaic Sa CHIP FOR ELECTRONIC CARD COATED WITH A LAYER OF INSULATING MATERIAL AND ELECTRONIC CARD CONTAINING SUCH A CHIP

Also Published As

Publication number Publication date
DE19754125A1 (en) 1998-06-10
FR2756975A1 (en) 1998-06-12

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Legal Events

Date Code Title Description
ST Notification of lapse