FR2741230A3 - CONNECTION DEVICE - Google Patents
CONNECTION DEVICE Download PDFInfo
- Publication number
- FR2741230A3 FR2741230A3 FR9613450A FR9613450A FR2741230A3 FR 2741230 A3 FR2741230 A3 FR 2741230A3 FR 9613450 A FR9613450 A FR 9613450A FR 9613450 A FR9613450 A FR 9613450A FR 2741230 A3 FR2741230 A3 FR 2741230A3
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- connection device
- circuit board
- contact
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Dispositif de connexion adapté directement à une plaque de circuit imprimé (1). La plaque de circuit imprimé (1) comporte une zone de contact (8) en forme de barrette à couteaux sur laquelle on glisse une pièce moulée en matière plastique (15) formant un boîtier d'un dispositif de connexion d'appareil (16). On supprime ainsi tout connecteur distinct. Ce dispositif de connexion convient particulièrement bien pour des plaques de circuit imprimé (1) en technique SMO car ce dispositif est très peu encombrant.Connection device adapted directly to a printed circuit board (1). The printed circuit board (1) has a contact area (8) in the form of a knife strip on which a plastic molded part (15) is slid, forming a housing of an appliance connection device (16). . This eliminates any separate connector. This connection device is particularly suitable for printed circuit boards (1) in SMO technique because this device is very compact.
Description
La présente invention concerne un dispositif de connexion pour unThe present invention relates to a connection device for a
composant sur une plaque de circuit imprimé, comprenant un dispositif de connexion de lignes prévu sur un support. On connaît déjà un tel dispositif de connexion se- component on a printed circuit board, comprising a line connection device provided on a support. There is already known such a connection device
lon le document DE 32 40 407 Ai.see document DE 32 40 407 Ai.
Dans ce dispositif de connexion connu, pour la mise en contact, on superpose un support en verre (substrat en In this known connection device, for contacting, a glass support is superimposed (substrate made of
verre) et un film de câblage, pour que les électrodes de rac- glass) and a wiring film, so that the connection electrodes
cordement et les chemins conducteurs viennent en appui pour être reliés par brasure ou soudure. Pour éviter les courants de fuite et les courtscircuits, d'une part, on applique une colle conductrice sur les chemins conducteurs et/ou les électrodes de branchement, et, d'autre part, on utilise une colle isolante évitant que ne s'établissent des cavités et des interstices. Un connecteur d'appareil, distinct, adapté, comporte, ses propres broches comme éléments de connexion,. Un tel dispositif est cord and conductive paths bear to be connected by soldering or welding. To avoid leakage currents and short circuits, on the one hand, a conductive adhesive is applied to the conductive paths and / or the connection electrodes, and, on the other hand, an insulating adhesive is used to prevent them from becoming established. cavities and interstices. A separate, suitable device connector has its own pins as connection elements. Such a device is
toutefois compliqué à fabriquer, encombrant et coûteux. however complicated to manufacture, bulky and expensive.
La présente invention a pour but de remédier à ces The object of the present invention is to remedy these
inconvénients et se propose de développer un dispositif de con- disadvantages and intends to develop a device for
nexion correspondant au type défini ci-dessus, qui soit de construction et de fabrication simples, peu encombrant pour s'utiliser avantageusement sur des circuits imprimés de petites connection corresponding to the type defined above, which is of simple construction and manufacture, space-saving to be used advantageously on printed circuits of small
dimensions et comporte un dispositif de connexion compact inté- dimensions and has an integrated compact connection device
grable, sans broche propre.grable, without clean pin.
A cet effet, l'invention concerne un dispositif de connexion du type défini ci-dessus, caractérisé en ce que To this end, the invention relates to a connection device of the type defined above, characterized in that
la plaque de circuit imprimé comporte des composants en techni- the printed circuit board has technical components
que SMD, la partie frontale de la plaque est réalisée sous la forme de zone de contact et une pièce moulée fermée à l'extérieur, est engagée sur la zone de contact et forme avec that SMD, the front part of the plate is made in the form of a contact zone and a molded part closed outside, is engaged on the contact zone and forms with
un boîtier un dispositif connecteur d'appareil. a housing a device connector device.
Le dispositif de connexion selon l'invention offre l'avantage d'utiliser la technique SMD, c'est-à-dire un montage des composants en surface sur une plaque de circuit imprimé, comme par exemple un condensateur parallélépipédique, dont la face inférieure comporte deux zones de branchement placées à fleur, et qui sont directement soudées ou brasées sur la plaque The connection device according to the invention offers the advantage of using the SMD technique, that is to say a mounting of the components on the surface on a printed circuit board, such as for example a parallelepiped capacitor, the underside of which has two connection zones placed flush with each other, which are directly welded or brazed to the plate
de circuit imprimé.printed circuit board.
Selon d'autres caractéristiques avantageuses de l'invention, par exemple la surface de contact est prévue sur la face supérieure et sur la face inférieure de la plaque de circuit imprimé et la surface de contact est constituée par des According to other advantageous features of the invention, for example the contact surface is provided on the upper face and on the lower face of the printed circuit board and the contact surface consists of
couteaux de contact en forme de broches de connexion. contact knives in the form of connection pins.
De plus, il est avantageux qu'une chambre d'un con- In addition, it is advantageous that a room of a con-
necteur entoure d'un côté la zone de contact prévue sur la pla- nector surrounds on one side the contact area provided on the plate
que de circuit imprimé et soit conçue par ailleurs pour that circuit board and is designed elsewhere for
recevoir un manchon d'un faisceau de câble pour mettre en con- receive a sleeve from a cable bundle to bring
tact le manchon et le contact à couteaux, en forme de fiche, de touch the sleeve and the blade contact, in the form of a plug,
manière à permettre une liaison protégée. so as to allow a protected connection.
Suivant d'autres caractéristiques avantageuses de l'invention: - la zone de contact se compose chaque fois d'une bande étroite According to other advantageous features of the invention: - the contact zone is each time made up of a narrow strip
ou à la face supérieure ou face inférieure de la plaque de cir- or on the upper or lower face of the cir-
cuit imprimé, - les bandes de la plaque de circuit imprimé présentent des contacts zingués, - la zone de contact prévue sur la partie frontale comporte des surfaces de contact en forme de couteaux de contact, - le dispositif connecteur est muni d'un dispositif de blocage printed baking, - the strips on the printed circuit board have zinc-plated contacts, - the contact zone provided on the front part has contact surfaces in the form of contact knives, - the connector device is fitted with a blocking
venant prendre dans la plaque de circuit imprimé. coming to take in the printed circuit board.
Dessins.Drawings.
Un exemple de réalisation de l'invention est repré- An embodiment of the invention is shown
senté dans les dessins et sera décrit ci-après de manière plus détaillée. Ainsi: - la figure 1 montre une plaque de circuit imprimé en technique SMD, - la figure 2 montre un dispositif de connexion prévu sur la plaque de circuit imprimé selon la figure 1, felt in the drawings and will be described below in more detail. Thus: - Figure 1 shows a printed circuit board in SMD technique, - Figure 2 shows a connection device provided on the printed circuit board according to Figure 1,
- la figure 3 montre un manchon de faisceau de câ- - Figure 3 shows a wiring harness sleeve
ble susceptible d'être combiné au dispositif de connexion selon ble can be combined with the connection device according to
la figure 2.Figure 2.
Description de l'exemple de réalisation. Description of the exemplary embodiment.
Une plaque de circuit imprimé 1 comporte une face supérieure 2 et une face inférieure 3 munies de surfaces de A printed circuit board 1 has an upper face 2 and a lower face 3 provided with contact surfaces.
contact 4, 5; ces surfaces sont des surfaces de cuivre étamé. contact 4, 5; these surfaces are surfaces of tinned copper.
Cela permet de disposer sur la face supérieure et sur la face inférieure 2, 3 en technique SMD, c'est-à-dire à construction montée en surface, des composants électriques et électroniques 6; un seul de ces composants est représenté. Ce This makes it possible to have on the upper face and on the lower face 2, 3 in SMD technique, that is to say with surface-mounted construction, electrical and electronic components 6; only one of these components is shown. This
seul composant 6 est un condensateur de forme parallélépipédi- single component 6 is a parallelepiped capacitor
que dont la face inférieure est munie de deux zones de branche- ment non représentées, qui sont collées ou brasées directement that the underside of which is provided with two connection zones, not shown, which are glued or brazed directly
et sans intermédiaire sur les chemins conducteurs également non représentés de la surface de contact 4; il peut également être brasé. La technique SMD permet d'utiliser des plaques de cir-15 cuit imprimé très petites 1 facilitant le montage. and without an intermediary on the conductive paths also not shown of the contact surface 4; it can also be soldered. The SMD technique allows the use of very small printed cir-15 baked plates 1 facilitating assembly.
Une partie avant 7 de la plaque de circuit imprimé A front part 7 of the printed circuit board
est réalisée comme zone de contact 8; elle comporte deux ban- is made as contact zone 8; it has two ban-
des étroites 9, 10 sur la face supérieure, la face inférieure 2 et 3 de la plaque de circuit imprimé 1. Les deux bandes 8 et 9 sont également munies de chemins conducteurs 10 et 12 en cuivre zingué. Elles forment les surfaces de contact 13, 14. Sur la zone de contact 8 de la plaque de circuit imprimé 1, comme cela apparaît à la figure 2, on a glissé une pièce moulée en matière plastique 15 formant le boîtier d'un dispositif de connecteur d'appareil 16. Le dispositif connecteur 16 est muni d'un moyen narrow 9, 10 on the upper face, the lower face 2 and 3 of the printed circuit board 1. The two strips 8 and 9 are also provided with conductive paths 10 and 12 of zinc-plated copper. They form the contact surfaces 13, 14. On the contact zone 8 of the printed circuit board 1, as it appears in FIG. 2, a plastic molded part 15 has been slipped forming the housing of a device for appliance connector 16. The connector device 16 is provided with a means
de blocage par lequel il pénètre dans la plaque de circuit im- blocking by which it enters the im- circuit plate
primé 1 de manière à l'accrocher. awarded 1 so as to hang it.
Les deux surfaces de contact 13, 14 sont des con- The two contact surfaces 13, 14 are con-
tacts en couteaux et forment une zone de contact 8 assimilable knife tacts and form an assimilable contact zone 8
à des contacts à couteaux pour le dispositif de connecteur 16. to knife contacts for connector device 16.
Cette zone de contact 8 est entourée de manière protégée par le boîtier du dispositif connecteur 16 en ce que cette zone se trouve dans une chambre 18 du dispositif connecteur d'appareil 16. Une douille de faisceau de câbles 19 est engagée dans la direction de la flèche 22 sur le dispositif connecteur This contact area 8 is surrounded in a protected manner by the housing of the connector device 16 in that this area is located in a chamber 18 of the device connector device 16. A cable harness socket 19 is engaged in the direction of the arrow 22 on the connector device
d'appareil 16; cette douille 19 est représentée à la figure 3. apparatus 16; this socket 19 is shown in FIG. 3.
La douille de faisceau de câbles 19 sert de support à des li- The cable harness socket 19 serves as a support for cables
gnes de branchement; elle comporte un logement 20 et un bran- connection genes; it includes a housing 20 and a branch
chement de faisceau de câbles 21. A la réunion du manchon de faisceau de câbles 19 et du dispositif connecteur d'appareil 16, le logement 20 passe par-dessus le côté supérieur et le cô- wiring harness connection 21. At the meeting of the wiring harness sleeve 19 and the device connector device 16, the housing 20 passes over the upper side and the side
té inférieur 2, 3 de la plaque de circuit imprimé 1 dans la zone de contact 8 en établissant ainsi de manière simple une lower tee 2, 3 of the printed circuit board 1 in the contact zone 8, thereby simply establishing a
liaison électrique entre la plaque de circuit imprimé 1 et le dispositif de connexion à faisceau de câbles 21 de la douille de faisceau de câbles 19. Cela permet de supprimer tout dispo-10 sitif de connexion distinct avec ses broches. electrical connection between the printed circuit board 1 and the wiring harness connection device 21 of the wiring harness socket 19. This makes it possible to eliminate any separate connection arrangement with its pins.
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29517750U DE29517750U1 (en) | 1995-11-09 | 1995-11-09 | Connection connector |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2741230A3 true FR2741230A3 (en) | 1997-05-16 |
FR2741230B3 FR2741230B3 (en) | 1997-11-21 |
Family
ID=8015197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9613450A Expired - Fee Related FR2741230B3 (en) | 1995-11-09 | 1996-11-05 | CONNECTION DEVICE |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE29517750U1 (en) |
FR (1) | FR2741230B3 (en) |
GB (1) | GB2307116A (en) |
IT (1) | IT240976Y1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19963287A1 (en) * | 1999-12-27 | 2001-06-28 | Tridonic Bauelemente | Method of assembling a cutting contact |
DE20207094U1 (en) * | 2002-05-04 | 2003-09-18 | Bosch Gmbh Robert | Printed circuit board with contact surface elements for establishing an electrical connection |
DE102008016993A1 (en) * | 2008-04-03 | 2009-10-08 | Valeo Schalter Und Sensoren Gmbh | Contact strip and contact connection combination for printed circuit board, has double row of contact units arranged one after another in insertion direction, and plug with double-row of contact units and suspended on printed circuit board |
DE102008048882A1 (en) * | 2008-09-25 | 2010-04-22 | Rational Ag | Direct plug-in connection system comprises power semiconductor module and housing, where power semiconductor module comprises circuit board with integrated conductor path to semiconductor element forming relay |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1306025C (en) * | 1988-02-15 | 1992-08-04 | John C. Collier | Terminating insulated conductors |
-
1995
- 1995-11-09 DE DE29517750U patent/DE29517750U1/en not_active Expired - Lifetime
-
1996
- 1996-10-25 IT IT96MI000715 patent/IT240976Y1/en active
- 1996-10-25 GB GB9622289A patent/GB2307116A/en not_active Withdrawn
- 1996-11-05 FR FR9613450A patent/FR2741230B3/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB9622289D0 (en) | 1996-12-18 |
FR2741230B3 (en) | 1997-11-21 |
IT240976Y1 (en) | 2001-04-20 |
ITMI960715V0 (en) | 1996-10-25 |
ITMI960715U1 (en) | 1998-04-25 |
DE29517750U1 (en) | 1997-03-06 |
GB2307116A (en) | 1997-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |