FR2729253A1 - Module capteur a boitier et procede de fabrication d'un tel module - Google Patents

Module capteur a boitier et procede de fabrication d'un tel module Download PDF

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Publication number
FR2729253A1
FR2729253A1 FR9500264A FR9500264A FR2729253A1 FR 2729253 A1 FR2729253 A1 FR 2729253A1 FR 9500264 A FR9500264 A FR 9500264A FR 9500264 A FR9500264 A FR 9500264A FR 2729253 A1 FR2729253 A1 FR 2729253A1
Authority
FR
France
Prior art keywords
sensor
strip
insulating film
module
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9500264A
Other languages
English (en)
French (fr)
Other versions
FR2729253B1 (enExample
Inventor
Jean Philippe Ebersohl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9500264A priority Critical patent/FR2729253A1/fr
Publication of FR2729253A1 publication Critical patent/FR2729253A1/fr
Application granted granted Critical
Publication of FR2729253B1 publication Critical patent/FR2729253B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
FR9500264A 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module Granted FR2729253A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9500264A FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9500264A FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Publications (2)

Publication Number Publication Date
FR2729253A1 true FR2729253A1 (fr) 1996-07-12
FR2729253B1 FR2729253B1 (enExample) 1997-03-07

Family

ID=9475036

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9500264A Granted FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Country Status (1)

Country Link
FR (1) FR2729253A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999019733A1 (de) * 1997-10-14 1999-04-22 Temic Telefunken Microelectronic Gmbh Piezoelektrischer biegesensor-beschleunigungsaufnehmer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150616A (en) * 1989-09-21 1992-09-29 Nippondenso Co., Ltd. Semiconductor strain sensor and manufacturing method thereof
DE9314084U1 (de) * 1993-09-17 1994-01-05 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Anordnung zum Befestigen eines mikromechanischen Sensors auf einem Träger durch Kleben
FR2694403A1 (fr) * 1992-07-31 1994-02-04 Sagem Accéléromètre pendulaire électrostatique à électrode de test et procédé de fabrication d'un tel accéléromètre.
DE9415696U1 (de) * 1993-09-29 1994-12-15 Société d'Applications Générales d'Electricité et de Mécanique, Paris Cedex Dichtes Gehäuse für Mikrobauelemente

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150616A (en) * 1989-09-21 1992-09-29 Nippondenso Co., Ltd. Semiconductor strain sensor and manufacturing method thereof
FR2694403A1 (fr) * 1992-07-31 1994-02-04 Sagem Accéléromètre pendulaire électrostatique à électrode de test et procédé de fabrication d'un tel accéléromètre.
DE9314084U1 (de) * 1993-09-17 1994-01-05 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Anordnung zum Befestigen eines mikromechanischen Sensors auf einem Träger durch Kleben
DE9415696U1 (de) * 1993-09-29 1994-12-15 Société d'Applications Générales d'Electricité et de Mécanique, Paris Cedex Dichtes Gehäuse für Mikrobauelemente

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999019733A1 (de) * 1997-10-14 1999-04-22 Temic Telefunken Microelectronic Gmbh Piezoelektrischer biegesensor-beschleunigungsaufnehmer

Also Published As

Publication number Publication date
FR2729253B1 (enExample) 1997-03-07

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