FR2713401B1 - Optical semiconductor device. - Google Patents
Optical semiconductor device.Info
- Publication number
- FR2713401B1 FR2713401B1 FR9500522A FR9500522A FR2713401B1 FR 2713401 B1 FR2713401 B1 FR 2713401B1 FR 9500522 A FR9500522 A FR 9500522A FR 9500522 A FR9500522 A FR 9500522A FR 2713401 B1 FR2713401 B1 FR 2713401B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- optical semiconductor
- optical
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5242363A JPH0799368A (en) | 1993-09-29 | 1993-09-29 | Optical semiconductor device |
FR9411650A FR2710783B1 (en) | 1993-09-29 | 1994-09-29 | Optical semiconductor device. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2713401A1 FR2713401A1 (en) | 1995-06-09 |
FR2713401B1 true FR2713401B1 (en) | 1997-01-17 |
Family
ID=26231434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9500522A Expired - Fee Related FR2713401B1 (en) | 1993-09-29 | 1995-01-18 | Optical semiconductor device. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2713401B1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4355321A (en) * | 1981-02-02 | 1982-10-19 | Varian Associates, Inc. | Optoelectronic assembly including light transmissive single crystal semiconductor window |
JPS584955A (en) * | 1981-06-30 | 1983-01-12 | Shinko Electric Ind Co Ltd | Package of gold-plated electronic parts |
NL8303316A (en) * | 1983-09-28 | 1985-04-16 | Philips Nv | METHOD FOR MANUFACTURING LIGHT EMISSION DEVICE |
-
1995
- 1995-01-18 FR FR9500522A patent/FR2713401B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2713401A1 (en) | 1995-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20070531 |