FR2706729B1 - Radiator for electronic power components. - Google Patents

Radiator for electronic power components.

Info

Publication number
FR2706729B1
FR2706729B1 FR9306905A FR9306905A FR2706729B1 FR 2706729 B1 FR2706729 B1 FR 2706729B1 FR 9306905 A FR9306905 A FR 9306905A FR 9306905 A FR9306905 A FR 9306905A FR 2706729 B1 FR2706729 B1 FR 2706729B1
Authority
FR
France
Prior art keywords
radiator
electronic power
power components
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9306905A
Other languages
French (fr)
Other versions
FR2706729A1 (en
Inventor
Panhaleux Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9306905A priority Critical patent/FR2706729B1/en
Publication of FR2706729A1 publication Critical patent/FR2706729A1/en
Application granted granted Critical
Publication of FR2706729B1 publication Critical patent/FR2706729B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9306905A 1993-06-09 1993-06-09 Radiator for electronic power components. Expired - Fee Related FR2706729B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9306905A FR2706729B1 (en) 1993-06-09 1993-06-09 Radiator for electronic power components.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9306905A FR2706729B1 (en) 1993-06-09 1993-06-09 Radiator for electronic power components.

Publications (2)

Publication Number Publication Date
FR2706729A1 FR2706729A1 (en) 1994-12-23
FR2706729B1 true FR2706729B1 (en) 1995-09-08

Family

ID=9447915

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9306905A Expired - Fee Related FR2706729B1 (en) 1993-06-09 1993-06-09 Radiator for electronic power components.

Country Status (1)

Country Link
FR (1) FR2706729B1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305004A (en) * 1965-08-24 1967-02-21 Philips Corp Heat dissipator with pivotable means to grip a semiconductor device
US3412788A (en) * 1966-03-11 1968-11-26 Mallory & Co Inc P R Semiconductor device package
DE2927860A1 (en) * 1979-07-10 1981-01-29 Siemens Ag Thyristor or diode cooling device - includes leaf spring with central pressure block and screw above upper, ribbed cooling block
IT1201836B (en) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa SEMICONDUCTOR DEVICE MOUNTED IN A HIGHLY FLEXIBLE SEGMENTED CONTAINER AND PROVIDED WITH A THERMAL DISSIPATOR
US5172755A (en) * 1992-04-01 1992-12-22 Digital Equipment Corporation Arcuate profiled heatsink apparatus and method

Also Published As

Publication number Publication date
FR2706729A1 (en) 1994-12-23

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Legal Events

Date Code Title Description
ST Notification of lapse