FR2695792B1 - Assembly for electronic control devices and manufacturing method for implementing this assembly. - Google Patents

Assembly for electronic control devices and manufacturing method for implementing this assembly.

Info

Publication number
FR2695792B1
FR2695792B1 FR9310048A FR9310048A FR2695792B1 FR 2695792 B1 FR2695792 B1 FR 2695792B1 FR 9310048 A FR9310048 A FR 9310048A FR 9310048 A FR9310048 A FR 9310048A FR 2695792 B1 FR2695792 B1 FR 2695792B1
Authority
FR
France
Prior art keywords
assembly
implementing
manufacturing
electronic control
control devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9310048A
Other languages
French (fr)
Other versions
FR2695792A1 (en
Inventor
Willy Bentz
Waldemar Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2695792A1 publication Critical patent/FR2695792A1/en
Application granted granted Critical
Publication of FR2695792B1 publication Critical patent/FR2695792B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10424Frame holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10446Mounted on an edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
FR9310048A 1992-09-17 1993-08-17 Assembly for electronic control devices and manufacturing method for implementing this assembly. Expired - Fee Related FR2695792B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4231141A DE4231141A1 (en) 1992-09-17 1992-09-17 Power component module for electronic control device - uses sidewall of control device housing as heat sink for dissipating waste heat generated by power components

Publications (2)

Publication Number Publication Date
FR2695792A1 FR2695792A1 (en) 1994-03-18
FR2695792B1 true FR2695792B1 (en) 1995-05-19

Family

ID=6468198

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9310048A Expired - Fee Related FR2695792B1 (en) 1992-09-17 1993-08-17 Assembly for electronic control devices and manufacturing method for implementing this assembly.

Country Status (3)

Country Link
DE (1) DE4231141A1 (en)
FR (1) FR2695792B1 (en)
IT (1) IT1272626B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT411125B (en) * 2001-04-12 2003-09-25 Siemens Ag Oesterreich HOLDING ELEMENT FOR ELECTRICAL COMPONENTS FOR ASSEMBLY ON CIRCUIT BOARDS
DE10154878B4 (en) * 2001-11-06 2006-01-26 e-motion Gesellschaft für Antriebstechnik mbH Retaining element for fixing an electronic power component to a heat sink
DE10342483A1 (en) * 2003-09-15 2005-04-07 Robert Bosch Gmbh Components Holder
DE102005013763B4 (en) * 2005-03-22 2007-09-13 Sew-Eurodrive Gmbh & Co. Kg Manufacturing method for a heat dissipation device
DE102011085924A1 (en) * 2011-11-08 2013-05-08 Robert Bosch Gmbh Electrical control device for a motor vehicle
CN105744797A (en) * 2016-03-28 2016-07-06 张立 Protective frame for servo motor encoder

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331207A1 (en) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Assembly for electronic controllers
FR2604593A1 (en) * 1986-09-30 1988-04-01 Trt Telecom Radio Electr Clip for holding the package (case) of a semi-conductor component mounted on a "support" plate
IT219096Z2 (en) * 1989-11-03 1992-12-01 Marelli Autronica ELECTRONIC CONTROL UNIT ESPECIALLY FOR IGNITION SYSTEMS AND / OR ELECTRONIC INJECTION OF VEHICLES

Also Published As

Publication number Publication date
IT1272626B (en) 1997-06-26
DE4231141A1 (en) 1994-03-24
FR2695792A1 (en) 1994-03-18
ITMI931982A0 (en) 1993-09-14
ITMI931982A1 (en) 1995-03-14

Similar Documents

Publication Publication Date Title
EP0647967A3 (en) Method of mounting a semiconductor device.
FR2733386B1 (en) MICROCOOLER FOR ELECTRONIC COMPONENTS AND ITS MANUFACTURING METHOD
KR970008346B1 (en) Method for forming a semiconductor device
DK0627146T3 (en) Process for establishing a compound and system for carrying out the method
FR2785131B1 (en) PLASMA DISPLAY AND METHOD OF CONTROLLING THE SAME
NO951346D0 (en) Process for forming an opening in a well conduit
EP0723319A3 (en) A planar waveguide and a process for its fabrication
EP1119032B8 (en) A method for producing a semiconductor device
FR2696867B1 (en) DISCHARGE CATHODE DEVICE AND METHOD FOR THE PRODUCTION THEREOF.
FR2738045B1 (en) CONTROL DEVICE FOR GEARBOXES
FR2657987B1 (en) METHOD FOR CONTROLLING A MATRIX SCREEN COMPRISING TWO INDEPENDENT PARTS AND DEVICE FOR ITS IMPLEMENTATION.
KR950702267A (en) Wall panel and manufacturing method and device for the panel (WALL PANEL AND METHOD AND DEVICE FOR MANUFACTURING THIS PANEL)
FR2635413B1 (en) MANUFACTURING METHOD FOR A METAL-OXIDE-SEMICONDUCTOR DEVICE
FR2714998B1 (en) Method for controlling a bistable electromagnetic actuator and device for its implementation.
FR2720527B1 (en) Method for controlling grouped home automation devices.
FR2720856B1 (en) Wiring electrode for semiconductor device and its manufacturing process.
DK0549440T3 (en) Process for optimizing a device for controlling and attenuating a multi-phase flow and device obtained by the method
FR2695792B1 (en) Assembly for electronic control devices and manufacturing method for implementing this assembly.
FR2781558B1 (en) HOOD-MOUNTING WALL-MOUNTED MICROWAVE DEVICE AND METHOD FOR CONTROLLING THE SAME
AU7474594A (en) Method for manufacturing a frequency control device
FR2547091B1 (en) METHOD FOR CONTROLLING AN ALTERNATIVE TYPE PLASMA PANEL AND DEVICE FOR IMPLEMENTING SAME
EP0708581A3 (en) A process for the electroless deposition of metal on a substrate
FR2711035B1 (en) Device and method for forming a plasma by applying microwaves.
FR2733385B1 (en) METHOD FOR MANUFACTURING PACKAGES, PARTICULARLY FOR ELECTRONIC COMPONENTS, AND PACKAGES FOR RECEIVING ELECTRONIC COMPONENTS
GB2289984B (en) Method for the fabrication of a semiconductor device

Legal Events

Date Code Title Description
ST Notification of lapse