FR2669176A1 - Ceramic housing the hermetic outputs of which are sealed by means of glass and which is intended for integrated circuits - Google Patents

Ceramic housing the hermetic outputs of which are sealed by means of glass and which is intended for integrated circuits Download PDF

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Publication number
FR2669176A1
FR2669176A1 FR9014079A FR9014079A FR2669176A1 FR 2669176 A1 FR2669176 A1 FR 2669176A1 FR 9014079 A FR9014079 A FR 9014079A FR 9014079 A FR9014079 A FR 9014079A FR 2669176 A1 FR2669176 A1 FR 2669176A1
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France
Prior art keywords
glass
sealed
hermetic
preforms
ceramic
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Granted
Application number
FR9014079A
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French (fr)
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FR2669176B1 (en
Inventor
Prouteau Jean-Pierre
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SEPT DOLOY SA
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SEPT DOLOY SA
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Application filed by SEPT DOLOY SA filed Critical SEPT DOLOY SA
Priority to FR9014079A priority Critical patent/FR2669176B1/en
Publication of FR2669176A1 publication Critical patent/FR2669176A1/en
Application granted granted Critical
Publication of FR2669176B1 publication Critical patent/FR2669176B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)

Abstract

Production of hermetic and non-magnetic housings for microelectronics, the body of the housing being made of ceramic and the metal through-leads being, not welded, but sealed with one of the glasses used in electronics. Several sealing configurations illustrated by figures II to V can be used. On the same housing, all the sealings can be achieved with the same configuration or with two or more of the configurations described.

Description

L'industrie électronique utilise de plus en plus de boîtiers munis de sorties isolantes hermétiques pour l'encapsulation de circuits in tégrés.  The electronics industry is increasingly using enclosures with hermetic insulating outputs for the encapsulation of integrated circuits.

Dans de nombreux cas, il peut être indispensable que ces
boîtiers soient complètement amagnétiques et non métalliques. On emploie
alors des cuvettes en céramique, particulièrement en alumine, percées de
trous pour le passages de sorties métalliques hermétiques qui serviront
pour les connexions électriques. (voir figure 1).In many cases it may be essential that these
enclosures are completely non-magnetic and not metallic. We employ
then ceramic bowls, particularly in alumina, pierced with
holes for the passage of hermetic metal outlets which will serve
for electrical connections. (see figure 1).

Il est connu de braser à haute température (entre 8000 et
12000 C) des traversées métalliques dans des cuvettes en céramique. Il
existe deux techniques principales pour réaliser ces brasures.It is known to braze at high temperature (between 8000 and
12000 C) metal bushings in ceramic bowls. he
There are two main techniques for making these solders.

L'une consiste à métalliser avec une peinture du type molyb
dène-manganèse, puis une peinture à base d'oxyde de nickel et de poudre de
nickel, les zones à braser du boîtier céramique. Cette technique exige de multiples cuissons intermédiaires, dont plusieurs à très haute température
(1500 à 16000 C) dans un four à hydrogène, puis de braser ensuite les pas
sages, de manière conventionnelle.One is to metallize with molyb type paint
dene-manganese, then a paint based on nickel oxide and powder
nickel, the areas to be brazed from the ceramic housing. This technique requires multiple intermediate cooking, including several at very high temperature
(1500 to 16000 C) in a hydrogen oven, then braze the steps
wise, conventionally.

Dans la deuxième technique, le brasage se fait en employant des métaux réactifs ou leurs hydrures, tels que titane ou zirconium. Il est alors nécessaire d'opérer entre 10000 et 12000 C dans un four sous très bon vide (de l'ordre de 10 6 torr.) ou sous argon parfaitement sec
(point de rosée inférieur à - 1500 C).In the second technique, brazing is done using reactive metals or their hydrides, such as titanium or zirconium. It is then necessary to operate between 10,000 and 12,000 C in an oven under very good vacuum (of the order of 10 6 torr.) Or under perfectly dry argon
(dew point below - 1500 C).

Ces deux techniques sont longues à mettre en oeuvre, demandent beaucoup de soin et imposent l'emploi d'un matériel important et d'utilisation délicate. Elles sont donc onéreuses. These two techniques are long to implement, require a lot of care and require the use of important equipment and delicate use. They are therefore expensive.

L'idée essentielle de la présente invention consiste à remplacer le brasage des traversées métalliques par un scellement, au moyen d'un des verres employés en électronique. Ce scellement se failven une seu le opération, dans un four électrique classique, sous atmosphère d'air ou d'azote. The essential idea of the present invention is to replace the brazing of the metal bushings with a seal, using one of the glasses used in electronics. This sealing takes place only once, in a conventional electric oven, under an atmosphere of air or nitrogen.

On obtient ainsi une production beaucoup plus économique de boîtiers amagnétiques, tout en conservant les caractéristiques nécessaires d'herméticité, d'isolement et de tenue aux atmosphères chaudes et humides. This results in a much more economical production of non-magnetic boxes, while retaining the necessary characteristics of airtightness, insulation and resistance to hot and humid atmospheres.

Plusieurs configurations de scellement peuvent être utilisées pour mettre en oeuvre cette technologie. Several sealing configurations can be used to implement this technology.

Dans la configuration représentée par la figure Il, des trous 2 sont percés dans le corps du boîtier 1 et les traversées métalliques 3 sont scellées au moyen de préformes de verre 4 placées, avant introduction dans le four, comme l'indique cette figure Il. Le diametre des trous 2 est à peine supérieur à celui des traversées métalliques 3. In the configuration shown in Figure II, holes 2 are drilled in the body of the housing 1 and the metal bushings 3 are sealed by means of glass preforms 4 placed, before introduction into the oven, as shown in this figure II. The diameter of the holes 2 is barely greater than that of the metal bushings 3.

Dans la configuration représentée par le figure III, est prévu dans le corps du boîtier 1 un logement 5 dans lequel est placée la préforme de verre 4. In the configuration shown in FIG. III, there is provided in the body of the housing 1 a housing 5 in which the glass preform 4 is placed.

Dans la configuration représentée par la figure IV, le corps du boîtier 1 est percé de part en part des trous 2 dont le diamètre est à peine supérieur à celui des préformes de verre 4. Sur environ la moitié de sa hauteur (l'épaisseur du boltier), ce trou est occupé dans sa partie inférieure par un petit manchon de céramique 6 et dans sa partie supérieure par la préforme de verre 4. In the configuration shown in Figure IV, the body of the housing 1 is drilled right through the holes 2 whose diameter is hardly greater than that of the glass preforms 4. Over about half of its height (the thickness of the boltier), this hole is occupied in its lower part by a small ceramic sleeve 6 and in its upper part by the glass preform 4.

Enfin, dans la configuration représentée par la figure V, le corps du boîtier 1 est percé de part en part, comme dans le cas de la figure IV, mais la préforme de verre 4 occupe la totalité de la hauteur du trou 2. L'ensemble est alors obligatoirement supporté par un outil en graphite pour le scellement. Finally, in the configuration shown in Figure V, the body of the housing 1 is drilled right through, as in the case of Figure IV, but the glass preform 4 occupies the entire height of the hole 2. The assembly is then necessarily supported by a graphite tool for sealing.

Les préformes fondent lors du passage dans le four et réalisent le scellement,
Pour certaines applications, il peut être nécessaire, sur le même corps de boîtier, d'utiliser simultanément deux ou plusieurs des configurations décrites par les figures Il à V.The preforms melt when passing through the oven and seal,
For certain applications, it may be necessary, on the same housing body, to use simultaneously two or more of the configurations described in Figures II to V.

Pour le choix du verre de scellement, il doit être tenu compte du coefficient linéaire de dilatation thermique de la céramique et du métal des traversées employés de manière à obtenir un scellement accordé ou en légère compression.  When choosing the sealing glass, the linear coefficient of thermal expansion of the ceramic and the metal of the bushings used must be taken into account in order to obtain a tuned or slightly compressed seal.

Claims (4)

REVENDICAr ON#CLAIM ON # 1) Bottier à sorties hermétiques pour usage microélectronique caractérisé en ce que les traversées (3) métalliques sont scellées au corps (1) en céranique dans des trous (2) au moyen de préformes (4) d'un verre utilise en électronique1) Clamshell with hermetic outlets for microelectronic use characterized in that the metallic bushings (3) are sealed to the body (1) in ceramic in holes (2) by means of preforms (4) of a glass used in electronics 2) Boîtier selon la revendication 1 caractérisé en ce que les préformes (4)2) Housing according to claim 1 characterized in that the preforms (4) de verre assurant le scellement des tiges (3) métalliques sur le corps of glass ensuring the sealing of the metal rods (3) on the body (1) en céramique sont placées dans des logements (5) aménagés dans le (1) ceramic are placed in housings (5) arranged in the corps (1). body (1). 3) Boîtier selon la revendication 1 caractérisé en ce que les préformes (4) de verre assurant le scellement des tiges (3) métalliques sur le corps (1) sont supportées par des manchons (61 en céramique logés dans les trous (2) sous les préformes (4), les manchons (6) étant scellés en même temps que les tiges (3) sur le corps (1). 3) Housing according to claim 1 characterized in that the glass preforms (4) ensuring the sealing of the metal rods (3) on the body (1) are supported by sleeves (61 ceramic housed in the holes (2) under the preforms (4), the sleeves (6) being sealed at the same time as the rods (3) on the body (1). 4) Boîtier selon la revendication 1 caractérisé en ce que les préformes (4)4) Housing according to claim 1 characterized in that the preforms (4) de verre assurant le scellement des tiges (3) métalliques sur le corps of glass ensuring the sealing of the metal rods (3) on the body (1), occupent toute la hauteur des trous (2) aménagés dans le corps (1), (1), occupy the entire height of the holes (2) arranged in the body (1), l'ensemble étant supporté par un outil lors du scellement.  the assembly being supported by a tool during sealing.
FR9014079A 1990-11-13 1990-11-13 CERAMIC HOUSING WHOSE HERMETIC OUTPUTS ARE SEALED BY MEANS OF A GLASS AND INTENDED FOR INTEGRATED CIRCUITS. Expired - Fee Related FR2669176B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9014079A FR2669176B1 (en) 1990-11-13 1990-11-13 CERAMIC HOUSING WHOSE HERMETIC OUTPUTS ARE SEALED BY MEANS OF A GLASS AND INTENDED FOR INTEGRATED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9014079A FR2669176B1 (en) 1990-11-13 1990-11-13 CERAMIC HOUSING WHOSE HERMETIC OUTPUTS ARE SEALED BY MEANS OF A GLASS AND INTENDED FOR INTEGRATED CIRCUITS.

Publications (2)

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FR2669176A1 true FR2669176A1 (en) 1992-05-15
FR2669176B1 FR2669176B1 (en) 1996-07-12

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FR9014079A Expired - Fee Related FR2669176B1 (en) 1990-11-13 1990-11-13 CERAMIC HOUSING WHOSE HERMETIC OUTPUTS ARE SEALED BY MEANS OF A GLASS AND INTENDED FOR INTEGRATED CIRCUITS.

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995026046A1 (en) * 1994-03-24 1995-09-28 Egide S.A. Method for the sealed and electrically insulating attachment of an electrical conductor extending through a metal wall

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2373878A1 (en) * 1976-12-07 1978-07-07 Europ Composants Electron Semiconductor crystal chip base support - has insulated connection through metal-glass seal avoiding contact with graphite and glass bead during mfr.
JPS55148443A (en) * 1979-05-07 1980-11-19 Nec Corp Package for semiconductor device
US4547624A (en) * 1983-12-02 1985-10-15 Isotronics, Inc. Method and apparatus for reducing package height for microcircuit packages
JPS61137350A (en) * 1984-12-10 1986-06-25 Nec Corp Heat sink metal package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2373878A1 (en) * 1976-12-07 1978-07-07 Europ Composants Electron Semiconductor crystal chip base support - has insulated connection through metal-glass seal avoiding contact with graphite and glass bead during mfr.
JPS55148443A (en) * 1979-05-07 1980-11-19 Nec Corp Package for semiconductor device
US4547624A (en) * 1983-12-02 1985-10-15 Isotronics, Inc. Method and apparatus for reducing package height for microcircuit packages
JPS61137350A (en) * 1984-12-10 1986-06-25 Nec Corp Heat sink metal package

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 332 (E-453)(2388) 12 Novembre 1986 & JP-A-61 137 350 ( NEC CORP. ) 25 Juin 1986 *
PATENT ABSTRACTS OF JAPAN vol. 5, no. 19 (E-44)(691) 4 Février 1981 & JP-A-55 148 443 ( NIPPON DENKI ) 19 Novembre 1980 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995026046A1 (en) * 1994-03-24 1995-09-28 Egide S.A. Method for the sealed and electrically insulating attachment of an electrical conductor extending through a metal wall
FR2717981A1 (en) * 1994-03-24 1995-09-29 Egide Sa Method of hermetic and electrically insulating fixing of an electrical conductor passing through a metal wall.

Also Published As

Publication number Publication date
FR2669176B1 (en) 1996-07-12

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