FR2663159B1 - SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE. - Google Patents

SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE.

Info

Publication number
FR2663159B1
FR2663159B1 FR9007281A FR9007281A FR2663159B1 FR 2663159 B1 FR2663159 B1 FR 2663159B1 FR 9007281 A FR9007281 A FR 9007281A FR 9007281 A FR9007281 A FR 9007281A FR 2663159 B1 FR2663159 B1 FR 2663159B1
Authority
FR
France
Prior art keywords
hermetically
conditioning
hybrid module
hybrid
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9007281A
Other languages
French (fr)
Other versions
FR2663159A1 (en
Inventor
Gerard Teissier
Dominique Garcin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Hybrides
Original Assignee
Thomson Hybrides
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Hybrides filed Critical Thomson Hybrides
Priority to FR9007281A priority Critical patent/FR2663159B1/en
Publication of FR2663159A1 publication Critical patent/FR2663159A1/en
Application granted granted Critical
Publication of FR2663159B1 publication Critical patent/FR2663159B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
FR9007281A 1990-06-12 1990-06-12 SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE. Expired - Fee Related FR2663159B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9007281A FR2663159B1 (en) 1990-06-12 1990-06-12 SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9007281A FR2663159B1 (en) 1990-06-12 1990-06-12 SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE.

Publications (2)

Publication Number Publication Date
FR2663159A1 FR2663159A1 (en) 1991-12-13
FR2663159B1 true FR2663159B1 (en) 1997-01-24

Family

ID=9397506

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9007281A Expired - Fee Related FR2663159B1 (en) 1990-06-12 1990-06-12 SYSTEM FOR HERMETICALLY CONDITIONING A HYBRID MODULE.

Country Status (1)

Country Link
FR (1) FR2663159B1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2591801B1 (en) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut ENCAPSULATION BOX OF AN ELECTRONIC CIRCUIT
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same

Also Published As

Publication number Publication date
FR2663159A1 (en) 1991-12-13

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Legal Events

Date Code Title Description
ST Notification of lapse