FR2662566B1 - Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique. - Google Patents

Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.

Info

Publication number
FR2662566B1
FR2662566B1 FR9006388A FR9006388A FR2662566B1 FR 2662566 B1 FR2662566 B1 FR 2662566B1 FR 9006388 A FR9006388 A FR 9006388A FR 9006388 A FR9006388 A FR 9006388A FR 2662566 B1 FR2662566 B1 FR 2662566B1
Authority
FR
France
Prior art keywords
metal housing
encapsulation
copper content
assembling parts
hybrid circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9006388A
Other languages
English (en)
Other versions
FR2662566A1 (fr
Inventor
Christian Cordelle
Francis Mayenc
Michel Sergent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9006388A priority Critical patent/FR2662566B1/fr
Publication of FR2662566A1 publication Critical patent/FR2662566A1/fr
Application granted granted Critical
Publication of FR2662566B1 publication Critical patent/FR2662566B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Casings For Electric Apparatus (AREA)
FR9006388A 1990-05-22 1990-05-22 Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique. Expired - Fee Related FR2662566B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9006388A FR2662566B1 (fr) 1990-05-22 1990-05-22 Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9006388A FR2662566B1 (fr) 1990-05-22 1990-05-22 Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.

Publications (2)

Publication Number Publication Date
FR2662566A1 FR2662566A1 (fr) 1991-11-29
FR2662566B1 true FR2662566B1 (fr) 1994-04-15

Family

ID=9396847

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9006388A Expired - Fee Related FR2662566B1 (fr) 1990-05-22 1990-05-22 Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.

Country Status (1)

Country Link
FR (1) FR2662566B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008842A1 (fr) * 1993-09-22 1995-03-30 Unisys Corporation Boitier de circuit integre avec un couvercle specialement conçu pour etre assujetti au laser

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4521668A (en) * 1983-11-08 1985-06-04 Westinghouse Electric Corp. Method of hermetically laser sealing electronic packages
FR2637210B1 (fr) * 1988-09-30 1990-11-09 Thomson Hybrides Microondes Procede de soudure par faisceau laser de deux pieces metalliques, et boitier electronique soude par ce procede

Also Published As

Publication number Publication date
FR2662566A1 (fr) 1991-11-29

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Legal Events

Date Code Title Description
ST Notification of lapse