FR2651372B1 - DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME. - Google Patents

DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME.

Info

Publication number
FR2651372B1
FR2651372B1 FR8911431A FR8911431A FR2651372B1 FR 2651372 B1 FR2651372 B1 FR 2651372B1 FR 8911431 A FR8911431 A FR 8911431A FR 8911431 A FR8911431 A FR 8911431A FR 2651372 B1 FR2651372 B1 FR 2651372B1
Authority
FR
France
Prior art keywords
metallizing
same
power semiconductor
semiconductor component
metallization power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8911431A
Other languages
French (fr)
Other versions
FR2651372A1 (en
Inventor
Christophe Cros
Bail Laurent Le
Pierre Rossetti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
La Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by La Telemecanique Electrique SA filed Critical La Telemecanique Electrique SA
Priority to FR8911431A priority Critical patent/FR2651372B1/en
Publication of FR2651372A1 publication Critical patent/FR2651372A1/en
Application granted granted Critical
Publication of FR2651372B1 publication Critical patent/FR2651372B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8911431A 1989-08-31 1989-08-31 DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME. Expired - Fee Related FR2651372B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8911431A FR2651372B1 (en) 1989-08-31 1989-08-31 DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8911431A FR2651372B1 (en) 1989-08-31 1989-08-31 DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME.

Publications (2)

Publication Number Publication Date
FR2651372A1 FR2651372A1 (en) 1991-03-01
FR2651372B1 true FR2651372B1 (en) 1994-05-06

Family

ID=9385031

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8911431A Expired - Fee Related FR2651372B1 (en) 1989-08-31 1989-08-31 DUAL METALLIZATION POWER SEMICONDUCTOR COMPONENT AND METHOD FOR METALLIZING THE SAME.

Country Status (1)

Country Link
FR (1) FR2651372B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5580825A (en) * 1993-09-20 1996-12-03 International Technology Exchange Corp. Process for making multilevel interconnections of electronic components

Also Published As

Publication number Publication date
FR2651372A1 (en) 1991-03-01

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Legal Events

Date Code Title Description
ST Notification of lapse