FR2647571A1 - Method of fabricating a card known as a chip card, and card obtained by this method - Google Patents
Method of fabricating a card known as a chip card, and card obtained by this method Download PDFInfo
- Publication number
- FR2647571A1 FR2647571A1 FR8906908A FR8906908A FR2647571A1 FR 2647571 A1 FR2647571 A1 FR 2647571A1 FR 8906908 A FR8906908 A FR 8906908A FR 8906908 A FR8906908 A FR 8906908A FR 2647571 A1 FR2647571 A1 FR 2647571A1
- Authority
- FR
- France
- Prior art keywords
- card
- module
- mold
- contacts
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Procédé de tabrication d'une carte dite carte a puce.Method of tabulating a smart card
et carte obtenue par ce procédé
La présente invention concerne un procédé de fabrication de cartes communément appelées "cartes a puce". and map obtained by this method
The present invention relates to a method of manufacturing cards commonly called "smart cards".
Ces cartes de conception récente, sont des cartes de crédit comportant un module électronique mettant en oeuvre un composant électronique performant dit puce électronique. These cards of recent design, are credit cards comprising an electronic module implementing a high-performance electronic component said electronic chip.
Le problème qui se pose dans la conception de telles cartes concerne la mise en place et la fixation du module électronique dans la carte en matiere pi astique. The problem which arises in the design of such cards concerns the installation and fixing of the electronic module in the card in plastic material.
A l'heure actuelle, la plupart des cartes en matière plastique sont fabriquées par découpage & partir d'une planche, puis on les transperce afin de créer une cavité dans laquelle est positionne le module electronique. At present, most plastic cards are made by cutting from a board and then pierced to create a cavity in which the electronics module is positioned.
Les contacts du module électronique sont situés dans le plan du recto de la carte tandis qu'au verso on retrouve la cavité avec la puce a. 1' intérieur. Bien entendu, la puce est située dans l'épaisseur de la carte, mais on comprend qu' elle n' est pas touJours protégée contre les agressions externes, ce qui peut altérer sa fiabilité. The contacts of the electronic module are located in the plane of the front of the card while on the back we find the cavity with the chip a. 1 inside. Of course, the chip is located in the thickness of the card, but we understand that it is not always protected against external aggression, which can affect its reliability.
La présente invention cherche A pallier cet inconvénient tout en proposant de fabriquer une carte d'un prix de revient largement inférieur a celui des cartes actuelles. The present invention seeks to overcome this disadvantage while proposing to manufacture a card with a cost substantially lower than that of current cards.
Le procédé selon l'invention de fabrication d'une carte dite carte * puce, du genre comportant un module électronique disposé dans une carte en matière plastique, est caractérisé en ce que la carte est moulée dans un moule apurés positionnement dans ledit moule dudit module électronique qui se trouve ainsi noyé sur sa face arrière et sa peripherie dans la matière dont est constituée la carte. The method according to the invention for manufacturing a so-called smart card *, of the kind comprising an electronic module disposed in a plastic card, is characterized in that the card is molded in a mold cleared positioning in said mold of said module electronics which is thus drowned on its back side and its periphery in the material of which the card is made up.
Atin de mettre en oeuvre un tel procédé
- on réalise le circuit électronique,
- on enrobe ledit circuit électronique de résine, afin de former un module électronique,
- on positionne ledit module électronique dans un moule dans lequel on injecte de la matière afin d' obtenir ladite carte par surmoulage du module électronique.Atin to implement such a process
the electronic circuit is produced,
said resin electronic circuit is coated in order to form an electronic module,
- Positioning said electronic module in a mold in which material is injected to obtain said card by overmolding the electronic module.
Une telle réalisation est peu coûteuse à mettre en oeuvre et permet I'obtention de cartes d'une très grande fiabilité puisque la puce est parfaitement protégée,
Selon d'autres aspects de l'invention, le procédé est également intéressant en ce que
- on réalise le circuit électronique à partir d'une bande métallique prédécoupée et préformee afin de présenter des contacts, sur laquelle on soude et câble la puce électronique ;
- le circuit électronique est enrobe d' une-. Such an embodiment is inexpensive to implement and allows the obtaining of very reliable cards since the chip is perfectly protected,
According to other aspects of the invention, the method is also interesting in that
the electronic circuit is produced from a pre-cut and preformed metal strip in order to present contacts, on which the electronic chip is soldered and wired;
the electronic circuit is coated with a.
résine qui remplit des espaces libres entre les contacts pour assurer la tenue mécanique du module électronique ainsi t orme;
- on forme des pions de resine sur la bande métallique avant de coller et cabler la puce électronique , et avant d'enrober le module de résine;
- la carte est imprimée par transtert d'image l'aide d'au moins un film mis en place dans le moulue.resin which fills free spaces between the contacts to ensure the mechanical strength of the electronic module thus form;
- Resin pins are formed on the metal strip before gluing and cabling the electronic chip, and before coating the resin module;
- The card is printed by image transtert using at least one film set up in the ground.
Suivant une forme de réalisation
- le module électronique présente sur sa lace opposée a celle portant les contacts une jupe crénelée;
- des ouvertures sont prévues dans la jupe;
- le moule utilisé présente des tetons sur' lesquels on engage le module par ses ouvertures Ju6qu'd ce que les faces d'extrémités des portions de la jupe reposent sur le fond dudit moule.According to an embodiment
- the electronic module has on its opposite lace to the one carrying the contacts a crenellated skirt;
openings are provided in the skirt;
the mold used has teats on which the module is engaged by its openings until the end faces of the portions of the skirt rest on the bottom of said mold.
Suivant une autre forme de réalisation:
- le module électronique présente des ouvertures positionnées 60US chacun des contacts;
- le module électronique est positionné par lesdites ouvertures sur des tétons que présente l'une des coquilles du moule. According to another embodiment:
the electronic module has openings positioned 60US each of the contacts;
- The electronic module is positioned by said openings on nipples that has one of the mold shells.
La présente invention concerne également une carte obtenue per ce procédé, qui est remarquable en ce que l'on voit å son verso soit des extrémités de portion d'une jupe que présente le module électronique, soit des ouvertures borgnes au fond desquelles on peut distinguer le dessous des contacts qu'elle présente au recto. The present invention also relates to a card obtained by this method, which is remarkable in that one can see on its back either the portion ends of a skirt that presents the electronic module, or blind openings at the bottom of which we can distinguish the bottom of the contacts she presents on the front.
La présente invention sera mieux comprise å la lecture de la description qui va suivre de la mise en oeuvre du procédé selon l'invention, en référence au dessin dans lequel
La figure 1 est une vue en coupe d'une première torme de réalisation de la partie centrale du module électronique;
La figure 2 est une vue en coupe d'une seconde forme ae réalisation de la partie centrale du moaule électronique;
La figure 3 est une vue de dessous d'une forme de reaiisatlon du module électronique
La figure 4 est une vue en coupe selon la ligne lD-lV de la figure 3;
La ligure 5 est une vue en coupe de l'installation de surmoulage;
La figure 6 est une vue du recto de la carte obtenue par le procédé, objet de l'invention;
La figure 7 est une vue du verso de la carte obtenue par le procédé, objet de l'invention;
La figure 8 est une vue en coupe d'une troisième forme de réalisation de la partie centrale du module électronique.The present invention will be better understood on reading the following description of the implementation of the method according to the invention, with reference to the drawing in which
Figure 1 is a sectional view of a first embodiment of the central portion of the electronic module;
Figure 2 is a sectional view of a second embodiment of the central portion of the electronic module;
Figure 3 is a bottom view of a form of reaiisatlon of the electronic module
Figure 4 is a sectional view along line lD-lV of Figure 3;
Figure 5 is a sectional view of the overmolding plant;
Figure 6 is a front view of the map obtained by the method, object of the invention;
Figure 7 is a view of the back of the card obtained by the method, object of the invention;
Figure 8 is a sectional view of a third embodiment of the central portion of the electronic module.
La figure 9 est une vue en coupe d'une variante de realisation de l'installation de surmoulage;
La figure 1 est une vue du recto de la carte obtenue dans l'installation de la figure 9;
La figure 11 est une vue du verso de la carte obtenue dans 1' installation de la figure 9;
La figure 12 est une vue semblable à la figure 5, pour la mise en oeuvre du procédé selon l'invention.Figure 9 is a sectional view of an alternative embodiment of the overmolding installation;
Figure 1 is a front view of the map obtained in the installation of Figure 9;
Figure 11 is a view of the back of the card obtained in the installation of Figure 9;
Figure 12 is a view similar to Figure 5, for carrying out the method according to the invention.
La première etape du procédé selon l'invention consiste å réaliser le module électronique que aoit porter la carte. The first step of the method according to the invention consists in producing the electronic module that the card has to carry.
A cet effet, on utilise une des techniques d'assemblage des composants électroniques connues pour la réalisation de boltiers plastiques du type pour composants de puissance ou pour microprocesseurs. For this purpose, one of the assembly techniques of known electronic components for the production of plastic bolters of the type for power components or for microprocessors is used.
Pour ce taire, on met en oeuvre une bande métallique 19, généralement en cuivre, qui est prédécoupée et préformée afin de former par découpage de tronçon, les contacts 1 nécessaires. Une telle bande est de manière usuelle en cuivre ou alliage cuivre-berylium argenté ou doré. For this, we use a metal strip 19, usually made of copper, which is pre-cut and preformed in order to form by section cutting, the necessary contacts 1. Such a strip is usually copper or silver-plated copper or berylium alloy gold.
Sur cette bande métallique 19, on soude la puce électronique 12 per exemple à l'aide de colle conductrice et on cable par soudure thermo-sonique 13. On this metal strip 19, the electronic chip 12 is welded for example by means of conductive glue and is wired by thermo-sonic welding 13.
Le circuit électronique ainsi préparé sur chaque tronçon de ladite bande 19 est enrobé d'une résine 14. The electronic circuit thus prepared on each section of said strip 19 is coated with a resin 14.
Cet enrobage par la résine 14 permet de protéger efficacement la puce 12 et d'éviter toute détérioration du cablage ; on utilise à cet effet une résine, dite de qualite électronique, telle que de la resine époxy ou des silicones. This coating with the resin 14 can effectively protect the chip 12 and prevent damage to the wiring; a so-called electronic quality resin such as epoxy resin or silicones is used for this purpose.
Comme on peut le voir à la figure 1, la résine 14 est admise à remplir les espaces libres 15 entre les contacts 1 afin d'assurer leur liaison mécanique et leur isolement électrique en meme temps que la tenue mécanique du module. As can be seen in FIG. 1, the resin 14 is allowed to fill the free spaces 15 between the contacts 1 in order to ensure their mechanical connection and their electrical insulation at the same time as the mechanical strength of the module.
Le module électronique 1 nécessaire à la carte que l'on veut fabriquer est alors obtenu en découpant la bande 19 en 16 afin d'en obtenir un tronçon présentant les contacts i. The electronic module 1 necessary for the card that one wants to manufacture is then obtained by cutting the strip 19 in 16 to obtain a section with the contacts i.
Une des difficultés rencontrées dans cette réalisation concerne le fait qu'il est indispensable que la surface des contacts 1 ò l'extérieur du module 1 soit parfaitement lisse et propre pour qu'ils assurent convenablement leur rôle dans la carte qui les comportera. One of the difficulties encountered in this embodiment relates to the fact that it is essential that the surface of the contacts 1 to the outside of the module 1 is perfectly smooth and clean so that they properly perform their role in the card that will include them.
Ces difficultés sont particulièrement importantes lorsque l'espace, entre les contacts est important ou lorsque les séparations desdits contacts sont trop éloignées de la zone de serrage du moule ou encore lorsque les liaisons métalliques entre les contacts sont trop fines et ne peuvent être convenablement plaquées par la résinecontre le fond du moule. These difficulties are particularly important when the space between the contacts is large or when the separations of said contacts are too far from the clamping area of the mold or when the metal connections between the contacts are too thin and can not be properly plated by the resin against the bottom of the mold.
Lorsque cela est possible, on prévoit un nouveau dessin des contacts et dans le cas inverse, on procède comme visible 8 la figure 2. Where possible, a new drawing of the contacts is provided and in the opposite case, the procedure is as shown in FIG. 2.
Dans une première étape, on forme des pions 17 de résine sur la bande métallique 19 afin d'assurer la liaison mécanique entre les contacts 1, puis, on eifectue le collage et lé calage de la puce 12 après avoir si nécessaire nettoyé la bande 19. In a first step, resin pins 17 are formed on the metal strip 19 in order to ensure the mechanical connection between the contacts 1, then the bonding and setting of the chip 12 is effected after having cleaned the strip 19 if necessary. .
Lors de l'enrobage par la résine 14, celle-ci se solidarise auxdits pions 17 pour former le module électronique 1 recherché. During coating with the resin 14, the latter is secured to said pins 17 to form the desired electronic module 1.
Les tigures 3 et 4 montrent en détail la forme du module 1 dans un mode de réalisation prétéré. On voit, que le bloc de résine 14 de forme genérale tronconique présente sur sa face opposée à celle portant les contacts 10 une jupe crénelée 20. Dans l'exemple représenté, ladite jupe 2 est découpée en quatre portions 21 par des canaux 22. Tigures 3 and 4 show in detail the shape of the module 1 in a pretested embodiment. It can be seen that the resin block 14 of generally frustoconical shape has on its face opposite to that carrying the contacts 10 a crenellated skirt 20. In the example shown, said skirt 2 is cut into four portions 21 by channels 22.
Cette Jupe aX permet d'assurer, lorsque le module 1 est positionné, comme visible & la figure 5, dans le moule 3 des zones d' application d' un effort assurant le bon placage des contacts 10 contre la face interne de la coquille 31 afin d'éviter leur enrobage par la matiere plastique au cours du moulage. This skirt aX ensures, when the module 1 is positioned, as visible in Figure 5, in the mold 3 areas of application of a force ensuring the good plating of the contacts 10 against the inner face of the shell 31 in order to avoid their coating by the plastic material during molding.
A la figure 3, on voit également des ouvertures 23 destinées au positionnement du module 1 dans le moule. A cet effet, la coquille 32 du moule est munie de tétons non représentés sur lesquels on engage le module 1. In Figure 3, we also see openings 23 for positioning the module 1 in the mold. For this purpose, the shell 32 of the mold is provided with not shown pins on which the module 1 is engaged.
Afin de réaliser le surmoulage de la carte en matière plastique dans le moule 3, on engage le module 1 sur lesdits tétons par les ouvertures 23 jusqu' à ce que les taces d'extrémités des portions 21 de la jupe 2 reposent sur le tond de la coquille 32 puis on positionne la coquille 31. Cette opération peut etre ettectuee de maniere avantageuse par un outil approprié prenant les modules positionnés sur une table de report lorsque l'on utilise un moule à plusieurs empreintes. In order to perform the overmolding of the plastic card in the mold 3, the module 1 is engaged on said nipples by the openings 23 until the end taces of the portions 21 of the skirt 2 rest on the ground of the shell 32 and then the shell 31 is positioned. This operation can be performed advantageously by an appropriate tool taking the modules positioned on a transfer table when using a multi-cavity mold.
L'épaisseur du module 1 est prévue afin que celui-ci soit en contact avec l'intérieur du moule 3 par les contacts 1 d'une part et par les portions 21 de Jupe d'autre part. En exerçant alors une pression comme marqué par les flèches P, on est sur que la matière plastique servant au moulage de la carte dans ledit moule ne peut recouvrir les contacts 1. Les canaux 22 de séparation de la jupe assurent quant & eux le passage de ladite matière tout en remplissant la zone intérieure de la jupe 20. The thickness of the module 1 is provided so that it is in contact with the interior of the mold 3 by the contacts 1 on the one hand and by the portions 21 of skirt on the other hand. By exerting then a pressure as marked by the arrows P, it is sure that the plastic material used to mold the card in said mold can not cover the contacts 1. The channels 22 of separation of the skirt ensure the passage of said material while filling the inner area of the skirt 20.
Les tigures 6 et 7 montrent l'aspect recto et verso de la carte 4 ainsi obtenue. Tigures 6 and 7 show the front and back aspect of the card 4 thus obtained.
On voit sur la figure b que les contacts 10 sont visibles à la surface de ladite carte 4 afin d'être opérationnels lorsque l'on désire utiliser cette carte. We see in Figure b that the contacts 10 are visible on the surface of said card 4 to be operational when it is desired to use this card.
Au verso de ladite carte 4, on voit les faces d'extrémites des portions 21 de jupe ainsi que les ouvertures de centrage 23. On the back of said card 4, we see the end faces of the skirt portions 21 and the centering openings 23.
Le module 1 representé aux tigures est un module de section ronae, il est bien entendu que l'on ne sortira pas du cadre de la présente invention en créant un module d' une autre section. On pourra de meme adapter à volonté la tormeN le nombre et la répartition des ouvertures 23. The module 1 represented by the tigures is a module section ronae, it is understood that it will not be beyond the scope of the present invention by creating a module of another section. The number and the distribution of the openings 23 can also be adapted as desired.
Les figures 8 å 11 montrent une variante de réalisation selon laquelle le module électronique 1(o présente des contacts 11 sous la forme de rectangles disposés en colonnes. Comme visible & la figure 1 un tel module peut par exemple comporter deux colonnes dé quatre contacts. Figures 8 to 11 show an alternative embodiment in which the electronic module 1 (o has contacts 11 in the form of rectangles arranged in columns, as shown in Figure 1 such a module may for example comprise two columns of four contacts.
Dans cette réalisation, on a prévu le bloc de résine 114 protégeant la puce 12 avec des ouvertures 123 positionnées sous chacun des contacts. Le bloc de résine 114 remplit comme précédemment les espaces libres, non visibles a la figure B, entre les contacts 116 afin d'assurer la tenue mécanique du module 100. In this embodiment, there is provided the resin block 114 protecting the chip 12 with openings 123 positioned under each of the contacts. The resin block 114 fills as previously the free spaces, not visible in Figure B, between the contacts 116 to ensure the mechanical strength of the module 100.
Le module 100 ainsi fabriqué est mis en place dans le moule en étant positionne par lesdites ouvertures 123 sur des tétons 133 de la coquille 132. The module 100 thus manufactured is placed in the mold by being positioned by said openings 123 on nipples 133 of the shell 132.
Comme précédemment, l'épaisseur du module 100 est telle que lorsque l'on referme le moule après l'avoir positionné sur lesdits tétons 133, les contacts 11 soient en appui contre l'intérieur de la coquille 131. As before, the thickness of the module 100 is such that when the mold is closed after having positioned it on said pins 133, the contacts 11 bear against the inside of the shell 131.
On peut alors en exerçant, comme il était visible à la figure 5, une pression P sur les coquilles 131, 132 obtenir par moulage une carte 14 dont le recto présente lesdits contacts 110 (figure 1). One can then by exerting, as it was visible in Figure 5, a pressure P on the shells 131, 132 obtain by molding a card 14 whose front has said contacts 110 (Figure 1).
Le verso de le carte 104 présente quant à lui des ouvertures borgnes 134 au fond desquelles on peut distinguer le-deesous des contacts 110. The back of the card 104 has blind openings 134 at the bottom of which we can distinguish-deesous contacts 110.
La carte 4 ou 104 peut si désiré etre imprimee afin de servir de support publicitaire ou de support d'intormations diverses telles que, par exemple, le mode d'emploi de cette carte. The card 4 or 104 may, if desired, be printed in order to serve as advertising medium or as support for various information such as, for example, the instructions for use of this card.
A cet et fat, on peut utiliser une methode traditionnelle d' impression mais ceci nécessite une manipulation supplémentaire de ladite carte. To this and fat, one can use a traditional method of printing but this requires additional manipulation of said card.
Atin de réduire le cout de production de la carte, on utilise une méthode d' impression dite par transfert d'imege. In order to reduce the production cost of the card, a printing method known as imitation transfer is used.
Comme visible à la figure 12, un film 33 est mis en place dans 1' une au moins des coquilles du moule 3. As can be seen in FIG. 12, a film 33 is put in place in at least one of the shells of the mold 3.
Ce film porte sur sa face tournée vers 1' intérieur dudit moule l'lmage à transférer sur la carte. Le film 33 est prévu evec des portions 34 dépassant du moule et portant des repères optiques permettant d'assurer son positionnement parfait.This film bears on its face turned towards the inside of said mold the image to be transferred onto the card. The film 33 is provided with portions 34 protruding from the mold and carrying optical marks to ensure its perfect positioning.
Un tel positionnement doit etre parfait d'une part pour l'esthétique de le carte mais également et de manière indispensable pour que les contacts ne soient pas imprimés, une zone incolore étant prévue dans l'impression du film à cet effet. Such a positioning must be perfect on the one hand for the aesthetics of the card but also and essential for the contacts are not printed, a colorless area being provided in the printing of the film for this purpose.
Claims (12)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8906908A FR2647571B1 (en) | 1989-05-26 | 1989-05-26 | METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED THEREBY |
| FR909002624A FR2659157B2 (en) | 1989-05-26 | 1990-03-02 | METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED BY THIS PROCESS. |
| EP94104315A EP0606118A3 (en) | 1989-05-26 | 1990-05-11 | Method of producing a plastic card. |
| EP90401253A EP0399868B2 (en) | 1989-05-26 | 1990-05-11 | Manufacturing process of a chip card |
| ES90401253T ES2063935T5 (en) | 1989-05-26 | 1990-05-11 | PROCEDURE FOR THE MANUFACTURE OF A CARD WITH PRINTED CIRCUIT. |
| DE69013220T DE69013220T3 (en) | 1989-05-26 | 1990-05-11 | Manufacturing process of a chip card |
| US07/527,184 US5134773A (en) | 1989-05-26 | 1990-05-22 | Method for making a credit card containing a microprocessor chip |
| JP02136921A JP3095762B2 (en) | 1989-05-26 | 1990-05-25 | Method for producing a microchip card incorporating a microprocessor chip and a microchip card produced by this method |
| US07/896,697 US5417905A (en) | 1989-05-26 | 1992-06-10 | Method of making a card having decorations on both faces |
| HK189495A HK189495A (en) | 1989-05-26 | 1995-12-14 | Manufacturing process of a chip card and card obtained by this process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8906908A FR2647571B1 (en) | 1989-05-26 | 1989-05-26 | METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED THEREBY |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2647571A1 true FR2647571A1 (en) | 1990-11-30 |
| FR2647571B1 FR2647571B1 (en) | 1994-07-22 |
Family
ID=9382041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8906908A Expired - Fee Related FR2647571B1 (en) | 1989-05-26 | 1989-05-26 | METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED THEREBY |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2647571B1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217491A (en) * | 1984-04-12 | 1985-10-31 | Dainippon Printing Co Ltd | Manufacture of ic card |
| EP0197438A1 (en) * | 1985-04-02 | 1986-10-15 | Eta SA Fabriques d'Ebauches | Method of manufacturing electronic modules for microcircuit boards and modules obtained by this method |
| EP0254640A1 (en) * | 1986-07-24 | 1988-01-27 | Schlumberger Industries, Sa | Realization method of an electronic memory card and card obtained by this method |
| EP0277854B1 (en) * | 1987-01-16 | 1992-04-01 | Schlumberger Industries | Memory card manufacturing process and cards obtained by this process |
-
1989
- 1989-05-26 FR FR8906908A patent/FR2647571B1/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217491A (en) * | 1984-04-12 | 1985-10-31 | Dainippon Printing Co Ltd | Manufacture of ic card |
| EP0197438A1 (en) * | 1985-04-02 | 1986-10-15 | Eta SA Fabriques d'Ebauches | Method of manufacturing electronic modules for microcircuit boards and modules obtained by this method |
| EP0254640A1 (en) * | 1986-07-24 | 1988-01-27 | Schlumberger Industries, Sa | Realization method of an electronic memory card and card obtained by this method |
| EP0277854B1 (en) * | 1987-01-16 | 1992-04-01 | Schlumberger Industries | Memory card manufacturing process and cards obtained by this process |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 10, no. 80 (P-441)(2137) 29 mars 1986, & JP-A-60 217491 (DAINIPPON INSATSU K.K.) 31 octobre 1985, * |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2647571B1 (en) | 1994-07-22 |
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